A temperature measurement circuit includes a band-gap reference circuit configured to generate a band-gap reference voltage that is fixed regardless of an operation temperature, a reference voltage generator circuit configured to generate a measurement reference voltage by adjusting the band-gap reference voltage, a sensing circuit configured to generate a temperature-variant voltage based on a bias current, where the temperature-variant voltage is varied depending on the operation temperature, an analog-digital converter circuit configured to generate a first digital code indicating the operation temperature based on the measurement reference voltage and the temperature-variant voltage, and an analog built-in self-test (BIST) circuit configured to generate a plurality of flag signals indicating whether each of the band-gap reference voltage, the measurement reference voltage, and a bias voltage corresponding to the bias current is included in a predetermined range.

Aspects of the present disclosure are directed to methods, apparatuses and systems involving a switched probe contact. According to an example embodiment, an apparatus includes logic circuitry, a first circuit to communicate signals with the logic circuitry, and a first bond pad connected to the first circuit via a first circuit path. The apparatus also includes a second circuit to communicate signals with the logic circuitry, and a second bond pad connected to the second circuit via a second circuit path. A probe contact is connected to the first bond pad and communicates signals with an external probe, and a switch circuit is connected to the probe contact and the second circuit path. The switch circuit communicates signals between the probe contact and the second circuit path by selectively connecting and disconnecting the probe contact to the second circuit path.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.

The present disclosure provides systems and methods for performing built-in-self-test (BIST) operations without a dedicated clock source. The BIST operations are performed by receiver lanes of a multilane receiver system, wherein at least one receiver lane is configured as synthesized clock source for other receiver lanes configured to perform BIST operations. The at least one receiver lane configured as the synthesized clock source may generate a clock signal and provide the clock signal to the other receiver lanes performing the BIST operations. In some examples, digital control signals may be used for coordinating the enablement of the at least one receiver lane to function as the synthesized clock source and for coordinating the enablement of the other receiver lanes to perform BIST operations.

The disclosure provides a novel method and apparatus for inputting addresses to devices to select the device TAP for access. Further, the disclosure provides a novel method and apparatus for inputting addresses for selecting device TAPs and for inputting commands for commanding circuitry within the device. The inputting of addresses or the inputting of addresses and commands is initiated by a control bit input on TDI that is recognized during the Run Test/Idle, Pause-DR or Pause-IR TAP states.

Aspects of present disclosure relate to an integrated circuit chip (chip), a method and a computer program product of testing the chip. The method of testing the chip may include: partitioning the chip into various partitions, loading built-in self-test (BIST) test instructions into BIST engine and initializing a current partition counter, performing BIST test on current partition, transmitting test results of the current partition of the chip to an external test data storage, checking whether current partition is the last partition, incrementing current partition counter, and returning to performing BIST on a next partition when current partition is not the last partition, and exiting BIST test when current partition is the last partition. The test results may be stored in one or more inactive storage elements of the chip. The number of partitions may include: one partition, a predetermined number of partitions, and a variable number of partitions.

A control system, that includes a primary controller and various auxiliary controllers, is configured to facilitate a built-in self-test (BIST) of a system-on-chip (SoC). The primary controller is configured to initiate a BIST sequence associated with the SoC. Based on the BIST sequence initiation, each auxiliary controller is configured to schedule execution of various self-test operations on various functional circuits, various memories, and various logic circuits of the SoC by various functional BIST controllers, various memory BIST controllers, and various logic BIST controllers of the SoC, respectively. Based on the execution of the self-test operations, each auxiliary controller further generates various status bits with each status bit indicating whether at least one functional circuit, at least one memory, or at least one logic circuit is faulty. Based on the status bits generated by each auxiliary controller, a fault diagnosis of the SoC is initiated.

Automotive radar methods and systems for enhancing resistance to interference using a built-in self-test (BIST) module. In one illustrative embodiment, an automotive radar transceiver includes: a signal generator that generates a transmit signal; a modulator that derives a modulated signal from the transmit signal using at least one of phase and amplitude modulation; at least one receiver that mixes the transmit signal with a receive signal to produce a down-converted signal, the receive signal including the modulated signal during a built-in self-test (BIST) mode of operation; and at least one transmitter that drives a radar antenna with a selectable one of the transmit signal and the modulated signal.

The semiconductor device cyclically outputs given status information pieces according to a predetermined procedure from a test output terminal one by one on receipt of a test enable direction through a test enable terminal, and outputs the same status information pieces as those output at that time from the test output terminal without interruption on receipt of a test disable direction. Operating the test enable terminal, the semiconductor device cyclically outputs status information pieces without the need for initial setting and further, outputs only desired status information without interruption.