Patent classifications
G01R31/31728
Integrated laser voltage probe pad for measuring DC or low frequency AC electrical parameters with laser based optical probing techniques
A semiconductor or integrated circuit block including a sense node and a converter circuit, in which the sense node develops a low frequency electrical parameter that is constant or varies at a frequency below a predetermined frequency level, and in which the converter circuit converts the low frequency electrical parameter into an alternating electrical parameter having a frequency at or above the predetermined frequency level sufficient to modulate a laser beam focused within a laser probe area of the converter circuit. The converter may include a ring oscillator, a switch circuit controlled by a clock enable signal, a capacitor having a charge rate based on the low frequency electrical parameter, etc. The laser probe area has a frequency level based on a level of the low frequency electrical parameter to modulate the reflected laser beam for measurement of the electrical parameter by a laser voltage probe test system.
Photonic Wafer Level Testing Systems, Devices, and Methods of Operation
A method of testing a photonic device includes providing a plurality of optical test signals at respective inputs of a first plurality of inputs of an optical input circuit located on a substrate, combining the plurality of optical test signals into a combined optical test signal at an output of the optical input circuit, transmitting the combined optical test signal through the output to an input waveguide of an optical device under test, the optical device under test being located on the substrate, and measuring a response of the optical device under test to the combined optical test signal. Each of the plurality of optical test signals comprises a respective dominant wavelength of a plurality of dominant wavelengths.
Display method of display apparatus
A display method of a display apparatus is provided. The method includes: displaying, on a touch display apparatus, a first window and a second window that overlap with each other, where the first window is smaller than the second window; displaying a first image on the first window, and displaying a second image on the second window, where the second image is an image captured by the camera module in real time; displaying the first image on the second window and displaying the second image on the first window according to the first touch instruction; and displaying the first image on the first window and displaying the second image on the second window according to the second touch instruction.
Photonic wafer level testing systems, devices, and methods of operation
A photonic testing device includes a substrate, an optical device under test (DUT) disposed over the substrate, and an optical input circuit disposed over the substrate. The optical input circuit includes a first plurality of inputs each configured to transmit a respective optical test signal of a plurality of optical test signals. Each of the plurality of optical test signals includes a respective dominant wavelength of a plurality of dominant wavelengths. The optical input circuit further includes an output coupled to an input waveguide of the optical DUT. The output is configured to transmit a combined optical test signal comprising the plurality of optical test signals.
Test device and heterogeneously integrated structure
A test device configured to test a photonic integrated circuit (IC) is provided. The photonic IC includes at least one waveguide edge coupler, and the test device includes an optical coupler. The optical coupler is configured to be optically aligned with the photonic IC, and includes at least one focusing lens and a first reflector. The at least one focusing lens is aligned with the at least one waveguide edge coupler. A light from the waveguide edge coupler is focused by the focusing lens, reflected by the first reflector, and transmitted to a fiber connector in sequence, or a light from the fiber connector is reflected by the first reflector and focused onto the waveguide edge coupler by the focusing lens in sequence. A heterogeneously integrated structure is also provided.
Semiconductor device inspection method and semiconductor device inspection device
An inspection method for inspecting a semiconductor device which is an object to be inspected includes a step of inputting an input signal to the semiconductor device, a step of irradiating the semiconductor device with light, a step of outputting a result signal indicating a change in a state of the semiconductor device based on an output signal which is output from the semiconductor device to which the input signal is input while the semiconductor device is irradiated with the light, and a step of deriving time information relating to a time from the input of the input signal to the semiconductor device to the output of the result signal.
TEST DEVICE AND HETEROGENEOUSLY INTEGRATED STRUCTURE
A test device configured to test a photonic integrated circuit (IC) is provided. The photonic IC includes at least one waveguide edge coupler, and the test device includes an optical coupler. The optical coupler is configured to be optically aligned with the photonic IC, and includes at least one focusing lens and a first reflector. The at least one focusing lens is aligned with the at least one waveguide edge coupler. A light from the waveguide edge coupler is focused by the focusing lens, reflected by the first reflector, and transmitted to a fiber connector in sequence, or a light from the fiber connector is reflected by the first reflector and focused onto the waveguide edge coupler by the focusing lens in sequence. A heterogeneously integrated structure is also provided.
Automated scan chain diagnostics using emission
A method for automated scan chain diagnostics includes comparing actual emission signatures for individual design elements to expected emission signatures, the individual design elements having pixels allocated thereto associated with an image of a device registered to a design layout, and determining whether the actual emission signatures differ from the expected emission signatures by more than a threshold amount to determine if a defect is present.
Optoelectronic chip and method for testing photonic circuits of such chip
The invention concerns an optoelectronic chip including a pair of optical inputs having a same bandwidth, and each being adapted to a different polarization, at least one photonic circuit to be tested, and an optical coupling device configured to couple the two inputs to the circuit to be tested.
INTEGRATED LASER VOLTAGE PROBE PAD FOR MEASURING DC OR LOW FREQUENCY AC ELECTRICAL PARAMETERS WITH LASER BASED OPTICAL PROBING TECHNIQUES
A semiconductor or integrated circuit block including a sense node and a converter circuit, in which the sense node develops a low frequency electrical parameter that is constant or varies at a frequency below a predetermined frequency level, and in which the converter circuit converts the low frequency electrical parameter into an alternating electrical parameter having a frequency at or above the predetermined frequency level sufficient to modulate a laser beam focused within a laser probe area of the converter circuit. The converter may include a ring oscillator, a switch circuit controlled by a clock enable signal, a capacitor having a charge rate based on the low frequency electrical parameter, etc. The laser probe area has a frequency level based on a level of the low frequency electrical parameter to modulate the reflected laser beam for measurement of the electrical parameter by a laser voltage probe test system.