This invention relates to an anti-tamper assembly for a circuit board comprising one or more electronic components, the assembly comprising: a container having side walls, a first, closed end and a second, opposing, open end, the container being configured to be mounted on said circuit board at said open end, over at least one of said electrical components, to form, in use, a sealed cavity around said at least one of said electrical components; a source of radioactive particles mounted within said container; an image sensor for capturing image frames within said sealed cavity, in use, wherein said image sensor comprises a detector region defining an array of pixels; and a processor for receiving said captured image frames, monitoring said image frames for changes in the statistical distribution of active pixels and, in the event that statistical distribution of active pixels indicates the presence of a feature in an image frame, generating a tamper alert.

A system and method for monitoring, testing or configuring electrical devices includes an input amplifier having an input connected to a device load line to generate an output linearly proportional to a voltage on the load line. An output of the input amplifier is connected to a photodiode in an optical path with a phototransistor. The phototransistor generates an output proportional to light generated by the photodiode, and this output is amplified and passed to an analog-to-digital converter. The converter generates a digital voltage level corresponding to the amplified output of the phototransistor. Digital temperature information is used to further enhance linearity of a generated digital voltage level. Multiple quantum well photodiodes further improve measurement linearity.

An optical measurement apparatus configured to measure a photonic integrated circuit (photonic IC) is provided. The optical measurement apparatus includes a substrate, at least one optical waveguide device, a first connector, and a second connector. The at least one optical waveguide device is disposed on the substrate. The first connector and the second connector are connected with the at least one optical waveguide device. An optical signal from a first optical fiber is transmitted to the at least one optical waveguide device through the first connector, transmitted to the inside of the photonic IC though at least one first evanescent coupler of the photonic IC, transmitted to the at least one optical waveguide device through at least one second evanescent coupler of the photonic IC, and transmitted to a second optical fiber through the second connector in sequence.

An optical measurement apparatus configured to measure a photonic integrated circuit (photonic IC) is provided. The optical measurement apparatus includes a substrate, at least one optical waveguide device, a first connector, and a second connector. The at least one optical waveguide device is disposed on the substrate. The first connector and the second connector are connected with the at least one optical waveguide device. An optical signal from a first optical fiber is transmitted to the at least one optical waveguide device through the first connector, transmitted to the inside of the photonic IC though at least one first evanescent coupler of the photonic IC, transmitted to the at least one optical waveguide device through at least one second evanescent coupler of the photonic IC, and transmitted to a second optical fiber through the second connector in sequence.

A display method of a display apparatus is provided. The method includes: displaying, on a touch display apparatus, a first window and a second window that overlap with each other, where the first window is smaller than the second window; displaying a first image on the first window, and displaying a second image on the second window, where the second image is an image captured by the camera module in real time; displaying the first image on the second window and displaying the second image on the first window according to the first touch instruction; and displaying the first image on the first window and displaying the second image on the second window according to the second touch instruction.

A control method of a touch display apparatus applicable to a probe station is provided. The probe station includes a movable element. The movable element is a chuck stage, a camera stage, a probe platen, or a positioner. The control method of a touch display apparatus includes displaying a first window and a second window on a touch display apparatus; displaying an operation interface on the first window and displaying a real-time image on the second window; and detecting a touch instruction generated on the operation interface, where the movable element moves according to the touch instruction.

Depth detector assemblies for material handling attachments are disclosed. In some embodiments, the depth detector assemblies may include at least one ultrasonic sensor removably attached to the material handling attachment. The depth detector assemblies may additionally include a controller removably attached to the material handling attachment and capable of receiving signals from the at least one ultrasonic sensor. The depth detector assemblies may further include a light display capable of being selectively illuminated by the controller to indicate depth of a load relative to the material handling attachment based on the received signals from the at least one ultrasonic sensor.

Methods and apparatuses for testing a photonic integrated circuit and a corresponding sample holder and a photonic integrated circuit are provided. Here, a location for an illumination light beam can be selected by way of a scanning device, with the result that targeted coupling of the illumination light into the photonic integrated circuit is made possible.

Systems and methods for detecting programmed defects on a water during inspection of the wafer are provided. One method includes selecting a mode of an inspection subsystem for detecting programmed defects on a wafer that generates output for the wafer having the lowest non-defect signal and at least a minimum signal for the programmed defects. The method also includes selecting a training care area that is mutually exclusive of care area(s) used for detecting the programmed defects during inspection of the wafer. The training care area generates less of the non-defect signal than the care area(s). The method further includes training a programmed defect detection method using the output generated with the selected mode in the training care area and detecting the programmed defects during the inspection of the wafer by applying the trained programmed defect detection method to the output generated in the care area(s) with the selected mode.

An inspection method for inspecting a semiconductor device which is an object to be inspected includes a step of inputting an input signal to the semiconductor device, a step of irradiating the semiconductor device with light, a step of outputting a result signal indicating a change in a state of the semiconductor device based on an output signal which is output from the semiconductor device to which the input signal is input while the semiconductor device is irradiated with the light, and a step of deriving time information relating to a time from the input of the input signal to the semiconductor device to the output of the result signal.