A method of manufacturing an electronic device includes the following steps. A substrate is provided, and the substrate has a first surface, a second surface opposite to the first surface and a side surface between the first surface and the second surface. A first circuit is formed on the first surface. A second circuit is formed on the second surface. The first circuit is made to electrically connect with the second circuit. A testing signal is applied to the first circuit and received from the second circuit to verify the electrical connection between the first circuit and the second circuit.

A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.

Disclosed are a non-to-the-home type device and method for detecting electric meter misconnection based on the PLC communication technology and using multiple frequencies. The detection device includes a master detection device and a slave detection device. The master detection device acquires address information of different electric meters at the outlet terminals of the electric meters by using RS485 communication. The modulation circuit modulates the communication address information of different electric meters into high-frequency carrier signals of different frequencies, and sends the high-frequency carrier signals to user sides by using the PLC communication technology. A line trap is provided between the modulation circuit and the electric meters. The slave detection device has a high-frequency carrier signal detection antenna. The user side detects the high-frequency carrier signal, demodulates the high-frequency carrier signal to obtain the high-frequency carrier signal frequency and the communication address information of the electric meter corresponding to user.

Disclosed are a non-to-the-home type device and method for detecting electric meter misconnection based on the PLC communication technology and using multiple frequencies. The detection device includes a master detection device and a slave detection device. The master detection device acquires address information of different electric meters at the outlet terminals of the electric meters by using RS485 communication. The modulation circuit modulates the communication address information of different electric meters into high-frequency carrier signals of different frequencies, and sends the high-frequency carrier signals to user sides by using the PLC communication technology. A line trap is provided between the modulation circuit and the electric meters. The slave detection device has a high-frequency carrier signal detection antenna. The user side detects the high-frequency carrier signal, demodulates the high-frequency carrier signal to obtain the high-frequency carrier signal frequency and the communication address information of the electric meter corresponding to user.

An endpoint interface device architecture utilized in multi-drop communication networks, such as the RS485 architecture, that utilizes control logic software/firmware within the endpoint microprocessor to isolate shorted lines from the communication transceiver, and to communicate status information to a first or second data source.

An electronic device includes a substrate, an electronic element, a transistor, a redistribution layer and a plurality of first bonding pads. The electronic element is disposed on the substrate. The transistor is electrically connected with the electronic element. The plurality of first bonding pads are disposed on the redistribution layer.

An endpoint interface device architecture utilized in multi-drop communication networks, such as the RS485 architecture, that utilizes control logic software/firmware within the endpoint microprocessor to isolate shorted lines from the communication transceiver, and to communicate status information to a first or second data source.

The invention relates to a test device (1) for testing the insulation of an electrical line (2), in particular a cable or a cable harness, for detecting error points in the insulation of the electrical line (2). The test device (1) comprises a scalable, evacuable chamber (3) for completely accommodating the electrical line (2) to be tested, wherein at least one electrical connection point (6), preferably in the form of a plug device part, for connecting the electrical line (2) to be tested is arranged inside the chamber (3) and an electrical feedthrough (7) leads from the connection point (6) out of the chamber (3).

The invention relates to a test device (1) for testing the insulation of an electrical line (2), in particular a cable or a cable harness, for detecting error points in the insulation of the electrical line (2). The test device (1) comprises a scalable, evacuable chamber (3) for completely accommodating the electrical line (2) to be tested, wherein at least one electrical connection point (6), preferably in the form of a plug device part, for connecting the electrical line (2) to be tested is arranged inside the chamber (3) and an electrical feedthrough (7) leads from the connection point (6) out of the chamber (3).

A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.