A driving related system that may include an integrated circuit (IC) that may include IC conductors and test unit; a PCB that may include PCB conductors; intermediate conductors for coupling the IC conductors to the PCB conductors; wherein the test unit is configured to: electrically test a continuity of a first conducive path that comprises a first group of intermediate conductors, a first group of IC conductors and a first group of PCB conductors; and generate a continuity fault indication when detecting a discontinuity of the first conductive path; and wherein the driving related system is configured to perform a safety measure, in response to a generation of one or more continuity fault indications.

A driving related system that may include an integrated circuit (IC) that may include IC conductors and test unit; a PCB that may include PCB conductors; intermediate conductors for coupling the IC conductors to the PCB conductors; wherein the test unit is configured to: electrically test a continuity of a first conducive path that comprises a first group of intermediate conductors, a first group of IC conductors and a first group of PCB conductors; and generate a continuity fault indication when detecting a discontinuity of the first conductive path; and wherein the driving related system is configured to perform a safety measure, in response to a generation of one or more continuity fault indications.

An installation structure of a temperature fuse is disclosed. The temperature fuse includes a first leg fixed to one surface of a printed circuit board (PCB), a bent part formed to be bent several times in an outer direction of the PCB from an end part of the first leg, and a second leg incorporated with the bent part and fixed to one surface of the PCB while being spaced apart from the first leg by a predetermined distance. The installation structure of the temperature fuse includes a third leg formed to extend from any one of the first leg and the second leg, a conductive member electrically connected to the third leg while being electrically isolated from the PCB, and a sensing part electrically connected to the third leg through the conductive member, and configured to detect whether a connection state between the third leg and the conductive member is normal.

An installation structure of a temperature fuse is disclosed. The temperature fuse includes a first leg fixed to one surface of a printed circuit board (PCB), a bent part formed to be bent several times in an outer direction of the PCB from an end part of the first leg, and a second leg incorporated with the bent part and fixed to one surface of the PCB while being spaced apart from the first leg by a predetermined distance. The installation structure of the temperature fuse includes a third leg formed to extend from any one of the first leg and the second leg, a conductive member electrically connected to the third leg while being electrically isolated from the PCB, and a sensing part electrically connected to the third leg through the conductive member, and configured to detect whether a connection state between the third leg and the conductive member is normal.

A probe is a probe having a substantially bar-like shape and includes a distal end portion with a substantially columnar shape adapted to be in contact with an inspection point provided on a device under test, a base end portion with a substantially columnar shape on an opposite side of the distal end portion, and a main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion. The distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe.

A probe is a probe having a substantially bar-like shape and includes a distal end portion with a substantially columnar shape adapted to be in contact with an inspection point provided on a device under test, a base end portion with a substantially columnar shape on an opposite side of the distal end portion, and a main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion. The distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe.

A display device includes: a plurality of electrode wires formed in a touch panel; a plurality of signal wires connecting together opposing ends of each of the electrode wires and a connecting circuit board connected to the touch panel; and a plurality of circuit board terminals formed on the connecting circuit board, each of the circuit board terminals being connected to a corresponding one of the signal wires, wherein the circuit board terminals include: a first circuit board terminal connected at one end to one of the electrode wires; and a second circuit board terminal connected at an other end to the one electrode wire, the first circuit board terminal and the second circuit board terminal being different.

A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

Disclosed are an IGBT-module condition monitoring equipment and method. The IGBT-module condition monitoring equipment includes an IGBT module, a gate turning-on voltage overshoot monitoring module, a driving circuit, a bond wire state judging module, and a signal acquisition module. The breakage condition of bond wires is obtained by comparing a monitored actual gate turning-on voltage overshoot with a preset reference gate turning-on voltage overshoot threshold. The present invention solves the problem encountered in monitoring the aging of IGBT bond wires in power electronic converters. By characterizing the bond wire detachment with the gate turning-on voltage overshoot, the slight aging of the detached bond wires can be monitored without disturbing the operation, which is high in resolution and free of invasiveness and enables real-time online monitoring at high sampling rate and low cost, showing great significance in the monitoring of the IGBT and the reliability evaluation of power electronic converters.