One embodiment is directed to detecting that a cable has been connected to a port of patching equipment and detecting that the cable is no longer connected to said port. In response to detecting that the cable is no longer connected, information associated with fixed cabling coupled to said port that is captured by a cable tester is downloaded to a controller. The downloaded information is associated with said port and the downloaded information and association information is locally stored at the controller. The locally stored information can then be used to create and/or populate objects in a database. Another embodiment is directed to including a storage device and a wireless interface in patching equipment or other equipment such as an outlet or consolidation point for use in writing information to the storage device and reading information from the storage device via the wireless interface. Other embodiments are disclosed.

One embodiment is directed to detecting that a cable has been connected to a port of patching equipment and detecting that the cable is no longer connected to said port. In response to detecting that the cable is no longer connected, information associated with fixed cabling coupled to said port that is captured by a cable tester is downloaded to a controller. The downloaded information is associated with said port and the downloaded information and association information is locally stored at the controller. The locally stored information can then be used to create and/or populate objects in a database. Another embodiment is directed to including a storage device and a wireless interface in patching equipment or other equipment such as an outlet or consolidation point for use in writing information to the storage device and reading information from the storage device via the wireless interface. Other embodiments are disclosed.

The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.

The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.

An electronic device according to certain embodiments comprises a printed circuit board (PCB); a processor mounted on the PCB; and a connection interface configured to connect the PCB to an off-board electronic component, wherein the processor is configured to: output an inspection signal to the connection interface according to a particular bit pattern at a designated bit rate; identify a voltage level of a reception signal input to the processor, during a designated time, in response to the output of the inspection signal particular bit pattern; and determine a connection state of the connection interface based on the identified voltage level of the reception signal.

An electronic device according to certain embodiments comprises a printed circuit board (PCB); a processor mounted on the PCB; and a connection interface configured to connect the PCB to an off-board electronic component, wherein the processor is configured to: output an inspection signal to the connection interface according to a particular bit pattern at a designated bit rate; identify a voltage level of a reception signal input to the processor, during a designated time, in response to the output of the inspection signal particular bit pattern; and determine a connection state of the connection interface based on the identified voltage level of the reception signal.

An electric connection inspection device includes: a cooling plate; an insulating plate provided on the cooling plate; a first measurement electrode provided on the insulating plate; and a second measurement electrode and a third measurement electrode provided above the first measurement electrode and located apart from the first measurement electrode. The insulating plate includes a variable thermal resistance mechanism. A semiconductor device can be installed between the first measurement electrode and the second measurement electrode and between the first measurement electrode and the third measurement electrode.

An electric connection inspection device includes: a cooling plate; an insulating plate provided on the cooling plate; a first measurement electrode provided on the insulating plate; and a second measurement electrode and a third measurement electrode provided above the first measurement electrode and located apart from the first measurement electrode. The insulating plate includes a variable thermal resistance mechanism. A semiconductor device can be installed between the first measurement electrode and the second measurement electrode and between the first measurement electrode and the third measurement electrode.

A device for detecting the condition of electrical bonding of a plurality of conductive components of an aerial device, the aerial device comprising a plurality of electrical bonding cables, a control module, a gradient control device, a feedback wire to carry an input signal from the conductive components to the control module, and a power source. The device uses the input signal to determine the condition of the electrical bonding of the conductive components including the condition of the electrical bonding cables and connections therebetween and is configured to notify an operator if an unacceptable condition is determined based on a predetermined acceptance standard.

A display device includes a first substrate including a display area and a non-display area, pixels disposed in the display area, a driver integrated circuit located in the non-display area and connected to the pixels through data lines, a first pad portion disposed in the non-display area, a second pad portion disposed in the non-display area and connected to the driver integrated circuit, a first thin film transistor connected to one of the data lines and adjusting a first data signal, a second thin film transistor connected to another of the data lines and adjusting the first data signal, a first wiring connecting the first thin film transistor and the first pad portion, a second wiring connecting the second thin film transistor and the second pad portion, and a gate signal line connected to the first and second thin film transistors.