G01S7/52023

SYSTEMS AND METHODS FOR INTERPOLATED VIRTUAL APERTURE RADAR TRACKING
20230400566 · 2023-12-14 ·

A method for interpolated virtual aperture array radar tracking includes: transmitting first and second probe signals; receiving a first reflected probe signal at a radar array; receiving a second reflected probe signal at the radar array; calculating a target range from at least one of the first and second reflected probe signals; corresponding signal instances of the first reflected probe signal to physical receiver elements of the radar array; corresponding signal instances of the second reflected probe signal to virtual elements of the radar array; interpolating signal instances; calculating a first target angle; and calculating a position of the tracking target relative to the radar array from the target range and first target angle.

Ultrasound diagnosis apparatus

An ultrasound diagnosis apparatus according to an embodiment includes a receiving unit and a changing unit. The receiving unit outputs an ultrasound received signal. The changing unit obtains, in accordance with a change in a spatial frequency of ultrasound image data subject to an imaging processing, a group of parameters related to a frequency characteristic of an imaging received signal that is output by the receiving unit as the ultrasound received signal to be used in the imaging processing and changes a center frequency and a frequency band to be used in the imaging processing performed on the imaging received signal, on a basis of the obtained group of parameters.

INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING THERMOCOMPRESSION BONDING, EUTECTIC BONDING, AND SOLDER BONDING
20210094070 · 2021-04-01 ·

The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.

Signal receiving circuit and driving method thereof, display panel and display apparatus
10990784 · 2021-04-27 · ·

The present disclosure provides a signal receiving circuit and a driving method thereof, a display panel, and a display apparatus. The signal receiving circuit includes a reset circuit having an input terminal connected to a reference signal line for providing a reference voltage signal, a control terminal connected to a reset signal line providing a reset signal, and an output terminal connected to a collection node, the reset circuit being configured to control a voltage of a signal at the collection node under control of the reset signal; and an output circuit having an input terminal connected to the collection node, configured to accumulatively amplify the signal at the collection node and output the amplified signal.

SYSTEMS AND METHODS FOR PERFORMING ANALOG-TO-DIGITAL CONVERSION ACROSS MULTIPLE, SPATIALLY SEPARATED STAGES
20210050861 · 2021-02-18 ·

The invention provides a signal processing system, for transferring analog signals from a probe to a remote processing unit. The system comprises a first ASIC at a probe, which is adapted to receive an analog probe signal. The first ASIC comprises an asynchronous sigma-delta modulator, wherein the asynchronous sigma-delta modulator is adapted to: receive the analog probe signal; and output a binary bit-stream. The system further comprises a second ASIC at the remote processing unit, adapted to receive the binary bit-stream. The asynchronous may further include a time gain function circuit, the first ASIC may further comprise a multiplexer, the second ASIC may further comprise a time-to-digital converter. The time to digital converter may be a pipelined time-to-digital converter.

INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING THERMOCOMPRESSION BONDING, EUTECTIC BONDING, AND SOLDER BONDING
20210086231 · 2021-03-25 ·

The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.

INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING SOLID LIQUID INTERDIFFUSION (SLID)
20210088655 · 2021-03-25 ·

The present disclosure provides methods to integrate pMUT arrays with an ASIC using solid liquid interdiffusion (SLID). In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT device and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar, which conductive bonding pillar comprises one or more intermetallic compounds. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT device and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar, wherein the bonding is performed at a temperature less than the melting point of the conductive bonding pillar after the bonding.

ULTRASOUND IMAGE DEVICE AND ULTRASOUND IMAGE GENERATION METHOD
20210030395 · 2021-02-04 ·

A method of generating an ultrasound image includes: setting a focal point in an object; transmitting, based on a location of the focal point, ultrasound signals into the object by using a plurality of elements in a transducer; receiving, via the plurality of elements, ultrasound echo signals obtained by reflecting the ultrasound signals from the object; and performing beamforming on the received ultrasound echo signals, wherein the performing of the received ultrasound echo signals includes: setting, based on the location of the focal point, a plurality of delay times respectively corresponding to the plurality of elements; determining capacitors respectively corresponding to the plurality of elements based on the set plurality of delay times; and respectively performing the beamforming on the received ultrasound echo signals by using the determined capacitors.

Tablet ultrasound system

Exemplary embodiments provide systems and methods for portable medical ultrasound imaging. Preferred embodiments utilize a tablet touchscreen display operative to control imaging and display operations without the need for using traditional keyboards or controls. Certain embodiments provide ultrasound imaging system in which the scan head includes a beamformer circuit that performs far field sub array beamforming or includes a sparse array selecting circuit that actuates selected elements. Exemplary embodiments also provide an ultrasound engine circuit board including one or more multi-chip modules, and a portable medical ultrasound imaging system including an ultrasound engine circuit board with one or more multi-chip modules. Exemplary embodiments also provide methods for using a hierarchical two-stage or three-stage beamforming system, three dimensional ultrasound images which can be generated in real-time.

Systems and methods for interpolated virtual aperture radar tracking
11860267 · 2024-01-02 · ·

A method for interpolated virtual aperture array radar tracking includes: transmitting first and second probe signals; receiving a first reflected probe signal at a radar array; receiving a second reflected probe signal at the radar array; calculating a target range from at least one of the first and second reflected probe signals; corresponding signal instances of the first reflected probe signal to physical receiver elements of the radar array; corresponding signal instances of the second reflected probe signal to virtual elements of the radar array; interpolating signal instances; calculating a first target angle; and calculating a position of the tracking target relative to the radar array from the target range and first target angle.