One embodiment provides a lens structure. The lens structure includes a backend. The backend includes a backend back surface and a backend front surface. The backend is configured to receive a luminous flux from a light source and to redirect the received luminous flux onto a lens. The redirected luminous flux is configured to increase a luminous efficacy.

A lens array, including: a plurality of lenses each including an optical refractive substance, the lenses being disposed one aside the other; and partitions disposed between the optical refractive substances of the lenses.

An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.

A beam shaping device includes an SAC and an FAC. The SAC is placed between an LD bar and the FAC. A first incident surface and a first exit surface are formed in the SAC. The first incident surface includes a plurality of incident-side lens surfaces aligned in a slow axis direction X. The incident-side lens surfaces each have, in section orthogonal to a fast axis direction Y, a shape convexed toward the outside of the SAC and, in section orthogonal to the slow axis direction X, a shape concaved toward the inside of the SAC. The shape of the first incident surface and the shape of the first exit surface in section orthogonal to the slow axis direction X are concentric arcs having a point on an emission end surface of a light emitting layer as the center.

The invention relates in particular to a method for creating patterns in a layer (410) to be etched, starting from a stack comprising at least the layer (410) to be etched and a masking, layer (420) on top of the layer (410) to be etched, the masking layer (420) having at least one pattern (421), the method comprising at least: a) a step of modifying at least one zone (411) of the layer (410) to be etched via ion implantation (430) vertically in line with said at least one pattern (421); b) at least one sequence of steps comprising: b1) a step of enlarging (440) the at least one pattern (421) in a plane in which the layer (410) to be etched mainly extends; b2) a step of modifying at least one zone (411, 411) of the layer (410) to be etched via ion implantation (430) vertically in line with the at least one enlarged pattern (421), the implantation being carried out over a depth less than the implantation depth of the preceding, modification step; c) a step of removing (461, 462) the modified zones (411, 411, 411), the removal comprising a step of etching the modified zones (411, 411, 411) selectively with respect to the non-modified zones (412) of the layer (410) to be etched.

A system and method of generating machine marking instructions for marking an ophthalmic lens is disclosed. The method comprises the steps of receiving lens order data related to a lens order, receiving an initial marking layout and calculating, using the lens order data, ophthalmic lens data of an ophthalmic lens related to the lens order. The method also comprises the steps of determining, using the ophthalmic lens data, marking parameters relating to the ophthalmic lens, producing an additional marking layout by modifying the initial marking layout using the marking parameters and the lens order data, the additional marking layout representing the markings to be applied to the ophthalmic lens, and generating machine marking instructions arranged to cause a marking machine to mark the ophthalmic lens in accordance with the additional marking layout.

An element substrate is formed as a lens array substrate on which a plurality of lenses are formed. In a method of manufacturing the lens array substrate, first recess sections are formed on one surface of the substrate, and then a plurality of lens surfaces, which include concave surfaces, are formed at the bottoms of the first recess sections 195. Subsequently, after a light-transmitting lens layer is formed to fill the inside of the first recess sections, flattening is performed while the lens layer is removed. Here, the surface of the lens layer on a side opposite to the substrate is a planar surface which is contiguous to an outside area that is positioned on the outer side of the first recess sections on the one surface of the substrate.

According to an embodiment of the disclosure, an electronic device may include a housing including a rear plate including a first region having a first concavo-convex pattern formed therein, and a second region having a second concavo-convex pattern formed therein, and a processor disposed inside the housing. The first concavo-convex pattern and the second concavo-convex pattern may be integrally formed with the rear plate, and a first depth of the first concavo-convex pattern may be different from a second depth of the second concavo-convex pattern.

There is provided an optical element including: a substrate; and a plurality of microlenses formed on the substrate. A reflecting surface of the microlens is an aspherical surface and asymmetrical with respect to an optical axis of the microlens. A pitch between adjacent ones of the microlenses is 10 to 230 m. A depth of the microlens is 3.2 to 15.4 m.

The present technology relates to a lens array and a manufacturing method therefor, a solid-state imaging apparatus, and an electronic apparatus that can improve the AF performance while suppressing the deterioration of image quality. A lens array includes microlenses that are formed corresponding to phase difference detection pixels that are provided to be mixed in imaging pixels. Each of the microlenses is formed such that a lens surface thereof is a substantially spherical surface, the microlens has a rectangular shape in a planar view and four corners are not substantially rounded, and a bottom surface in vicinity of an opposite-side boundary portion that includes an opposite-side center portion of a pixel boundary portion in a cross-sectional view is higher than a bottom surface in vicinity of a diagonal boundary portion that includes a diagonal boundary portion. The present technology is applicable to a lens array of a CMOS image sensor, for example.