An octave bandwidth, achromatic metalens configured to operate in light wavelengths having a range of approximately 640 nm to 1200 nm.

Embodiments described herein provide for methods of forming angled optical device structures. The methods described herein utilize etching a mandrel material with an etch chemistry that is selective to the hardmask, i.e., the mandrel material is etched at a higher rate than the hardmask. Therefore, mandrel trenches are formed in the mandrel material. Device material of the angled optical device structures to be formed is deposited on the plurality of angled mandrels. An angled etch process is performed on portions of the device material such that the angled optical device structures are formed.

A light sensor includes a semiconductor substrate supporting a number of pixels. Each pixel includes a photoconversion zone extending in the substrate between a front face and a back face of the substrate. An optical diffraction grating is arranged over the back face of the substrate at a position facing the photoconversion zone of the pixel. For at least two different pixels of the light sensor, the optical diffraction gratings have different pitches. Additionally, the optical grating of each pixel is surrounded by an opaque wall configured to absorb at operating wavelengths of the sensor.

Techniques for designing diffractive optical elements (DOEs) such as diffusers and other optical beam shaping elements can include designing a DOE unit cell on a smaller area than the overall area of the DOE, and then distributing the unit cell across the entire surface for the DOE. Height translations are introduced for at least some of the unit cells distributed across the surface, where the height translations correspond to respective phase translations for the intended operational wavelength of the DOE. In some instances, phase wrapping is introduced to translate the height variations among the unit cells into unit cells having sub-unit structures whose heights fall within a range that corresponds to a specified phase range at the operational wavelength.

Embodiments of the present disclosure generally relate to processing an optical workpiece containing grating structures on a substrate by deposition processes, such as atomic layer deposition (ALD). In one or more embodiments, a method for processing an optical workpiece includes positioning a substrate containing a first layer within a processing chamber, where the first layer contains grating structures separated by trenches formed in the first layer, and each of the grating structures has an initial critical dimension, and depositing a second layer on at least the sidewalls of the grating structures by ALD to produce corrected grating structures separated by the trenches, where each of the corrected grating structures has a corrected critical dimension greater than the initial critical dimension.

A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.

Disclosed herein is metasurface modules configured to reduce the cost of integration of metasurface elements within a housing and methods of manufacturing thereof. One particular embodiment includes a metasurface module including: a secondary substrate; and a metasurface chip mounted on the secondary substrate. The secondary substrate laterally extends from all sides of the metasurface chip to completely surround the metasurface chip. The secondary substrate may be utilized to mount the metasurface chip within a housing which decreases the size of the metasurface chip and ultimately decreases manufacturing costs of the metasurface chip.

Display devices include waveguides with in-coupling optical elements that mitigate re-bounce of in-coupled light to improve overall in-coupling efficiency and/or uniformity. A waveguide receives light from a light source and/or projection optics and includes an in-coupling optical element that in-couples the received light to propagate by total internal reflection in a propagation direction within the waveguide. Once in-coupled into the waveguide the light may undergo re-bounce, in which the light reflects off a waveguide surface and, after the reflection, strikes the in-coupling optical element. Upon striking the in-coupling optical element, the light may be partially absorbed and/or out-coupled by the optical element, thereby effectively reducing the amount of in-coupled light propagating through the waveguide. The in-coupling optical element can be truncated or have reduced diffraction efficiency along the propagation direction to reduce the occurrence of light loss due to re-bounce of in-coupled light, resulting in less in-coupled light being prematurely out-coupled and/or absorbed during subsequent interactions with the in-coupling optical element.

An optical element may include a substrate. The optical element may include a first anti-reflectance structure for a particular wavelength range formed on the substrate. The optical element may include at least one layer disposed on a portion of the first anti-reflectance structure. The optical element may include a second anti-reflectance structure for the particular wavelength range formed on the at least one layer. A depth between a first surface of the first anti-reflectance structure and a second surface of the second anti-reflectance structure, a first index of refraction of the first anti-reflectance structure, a second index of refraction of the second anti-reflectance structure, and a third index of refraction of the at least one layer may be selected to form a diffractive optical element associated with a particular phase delay for the particular wavelength.

A method of fabricating an imaging system as well as to a corresponding imaging system. The method includes providing a substrate; and forming, by means of a 3D-printing technique, a 3D structure on the substrate, wherein the forming of the 3D structure includes forming a stack of at least two diffractive optical elements in a single printing step.