A braider includes: a plurality of cylindrical bobbins around which flat foil yarns are wound so as not to be inverted; a plurality of carriers to which the bobbins are rotatably attached, the plurality of carriers being configured to feed out the flat foil yarns from the bobbins; a core material supply mechanism configured to supply a core material to be placed inside the outer conductor; a waveguide take-out mechanism configured to take out the flexible waveguide after the outer conductor is formed; and a carrier movement determination mechanism configured to determine movement of the carriers so that there are always three or more cross points formed by the individual flat foil yarns with other ones of the flat foil yarns in an enlarged portion before the flat foil yarns form a braided shape.

An optical waveguide device has a substrate, an intermediate layer, a thin-film LN layer containing an X-cut lithium niobate, and a buffer layer stacked on the substrate, and an optical waveguide having a ridge shape formed in the thin-film LN layer. The optical waveguide device includes a plurality of electrodes provided, respectively, at a first side and a second side of the optical waveguide. The electrodes are disposed so that respective bottom surfaces thereof are at positions lower than a position of a surface of the buffer layer.

Embodiments are disclosed for providing a silicon photonics collimator for wafer level assembly. An example apparatus includes a silicon photonics (SiP) device and a micro-optical passive element. The SiP device comprises a set of optical waveguides. The micro-optical passive element is mounted on an edge of a cavity etched into a silicon surface of the SiP device. Furthermore, the micro-optical passive element is configured to direct optical signals between the set of optical waveguides and an external optical element.

The invention provides a method for producing a 3D item (1) by means of fused deposition modelling, the method comprising a 3D printing stage comprising layer- wise depositing an extrudate (321) comprising 3D printable material (201), to provide the 3D item (1) comprising 3D printed material (202), wherein the 3D item (1) comprises layers (322) of 3D printed material (202), wherein the method further comprises controlling a first temperature T.sub.1 of the 3D printable material (201) within a first temperature range, wherein the 3D printable material (201) comprises a thermoplastic host material (401) and a dopant material (410) in the range of 1-20 vol %, the dopant material (410) comprising polymeric flake-like particles having a metal coating, wherein the 3D printable material (201) has an optical property that irreversibly changes from a low-temperature optical property to a high-temperature optical property when increasing a temperature of the 3D printable material (201) over a change temperature T.sub.c, the optical property being selected from the group consisting of reflection, transmission, luminescence, absorption, and color, wherein the change temperature T.sub.c is within the first temperature range, wherein during at least a first part of the 3D printing stage the first temperature T.sub.1 is below the change temperature T.sub.c, and wherein during at least a second part of the 3D printing stage the first temperature T.sub.1 is above the change temperature T.sub.c.

An optical member includes a light source, a first substrate to be a light guide that guides emitted light from the light source, a variable layer in contact with a predetermined surface of the first substrate, and a second substrate facing the first substrate via the variable layer. When a refractive index of the first substrate is n1, a refractive index of the variable layer can be changed to n2 or n3 (where n2>n3), and n1, n2, and n3 satisfy a relationship of |n1−n2|<|n1−n3|.

An optical component has: a planar liquid layer; and one or more light sources arranged such that light is guided to the planar liquid layer; wherein the liquid layer is configured to guide light.

A backlight device is provided and include frame formed of sheet material including at least four bars; first adhesive layer provided on one surface of the bars; reflective sheet attached to frame with first adhesive layer; second adhesive layer is provided on another surface opposed to the one surface of the bars; optical member including lightguide plate disposed on reflective sheet in frame; and light source disposed in frame and configured to emit light to optical member, wherein thickness of second adhesive layer provided on three successive bars of frame along three sides of lightguide plate is greater than thickness of first adhesive layer provided on four bars of frame.

A light distribution structure 10 and a related element 100, such as a light guide, are provided. The structure 10 is preferably an optically functional layer comprising an at least one feature pattern 11, 11A established in a light-transmitting carrier by a plurality of three-dimensional optical features variable in terms of at least one of the cross-sectional profile, dimensions, periodicity, orientation and disposition thereof within the feature pattern. In some instances, the optical features are embodied as internal optical cavities 12 capable to establish the total internal reflection (TIR) function at a horizontal surface and at an essentially vertical surface thereof. A method for manufacturing the light distribution structure is further provided.

A display apparatus including a display panel, a light source unit configured to provide light to the display panel, and a light guide member disposed between the display panel and the light source unit and covering the light source unit such that the light source unit is buried in the light guide member, the light guide member having a surface roughness on an upper surface thereof to diffuse light and including a substrate, and a light emitting device disposed on the substrate and including a blocking pattern to have an intensity of light emitted in an upward direction to be equal to or less than about 80% of a maximum light intensity of the light emitting device.

A light-emitting module manufacturing method of the present disclosure includes: providing a plurality of light sources each including a semiconductor layered structure and an electrode; providing a lightguide plate having a first principal surface to serve as a light extraction surface, a second principal surface opposite to the first principal surface, and a plurality of through holes penetrating through the lightguide plate from the first principal surface to the second principal surface; providing a light modulating member in each of the through holes; providing a plurality of bonding members on the light modulating member; equalizing heights of upper surfaces of the plurality of bonding members; placing the light sources on the bonding members such that the electrode faces away from the light modulating member; providing a cover member so as to cover the second principal surface; and forming an interconnect layer electrically coupled with the light sources.