A surface-relief grating comprises a plurality of grating ridges including a first material, and a layer of a second material conformally deposited on surfaces of the plurality of grating ridges. A first region of the surface-relief grating is characterized by a first grating depth and a first duty cycle greater than a first threshold value. A second region of the surface-relief grating is characterized by a second grating depth and a second duty cycle lower than a second threshold value that is lower than the first threshold value. A difference between the first grating depth and the second grating depth is less than 20% of the second grating depth.

A surface-relief structure comprises a surface-relief grating including a first material characterized by a first refractive index, a first layer of a second material having a second refractive index conformally deposited on surfaces of the surface-relief grating, and a second layer of a third material having a third refractive index conformally deposited on the first layer. The effective refractive index of the combination of the first layer and the second layer is less than, equal to, or greater than the first refractive index, thereby increasing the duty cycle and/or modifying the overall refractive index of the surface-relief structure. The first layer and the second layer are deposited using, for example, atomic layer deposition techniques.

A method of forming a photonic device includes forming a cavity extending from a first major surface of a semiconductor wafer, performing a laser grooving process to form a first groove and a second groove, dicing the semiconductor wafer along the first groove and the second groove, and attaching an optical interposer to the bottom surface of the cavity. The cavity includes a first sidewall, an opposite second sidewall, and a bottom surface. The first groove is separated from the second groove by the cavity. The dicing passes through the cavity along a line connecting the first groove to the second groove.

The subject matter of this specification can be embodied in, among other things, a graphene plasmon resonator that includes a planar patterned layer having a collection of electrically conductive segments, and a collection of dielectric segments, each dielectric segment defined between a corresponding pair of the electrically conductive segments, a graphene layer substantially parallel to the planar patterned layer and overlapping the collection of electrically conductive segments, and a planar dielectric layer between the planar patterned layer and the graphene layer.

In one aspect, the disclosure relates to multi-material fibers capable of distributedly measuring temperature and pressure in which the methods comprise a thermal drawing step, and the methods of fabricating the disclosed fibers. The fibers can be utilized in methods of temperature and pressure mapping or sensing comprising electrical reflectometry for interrogation. Further disclosed are devices comprising a disclosed fiber with the multi-point detection capability with simple one-end connection. Also disclosed are articles, e.g., smart clothing, wound dressing, robotic skin and other industrial products, comprising a disclosed fiber or a fabric comprising a disclosed fiber. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.

A method for manufacturing an optical fiber preform includes: producing a core preform including a core portion made of transparent glass and a first cladding layer obtained by adding fluorine to the core portion; and forming, on an outer periphery of the first cladding layer, a second cladding layer made of glass having a refractive index higher than that of the first cladding layer. Further, a refractive index profile is formed in the first cladding layer due to a fluorine concentration profile, the refractive index profile being provided at least near a boundary surface with the second cladding layer and having a profile such that a refractive index difference between a refractive index of the first cladding layer and a refractive index of the second cladding layer decreases in accordance with a reduction in a distance from the boundary surface with the second cladding layer.

The application relates to radars, and provides a chip with a beamforming network based on a photonic crystal resonant cavity tree structure and a fabrication method thereof. The chip includes a beamforming network layer, including an incidence coupling grating, first to Nth photonic crystal resonant cavity combinations, first to (N+1)th optical waveguides and an emergence coupling grating which are successively connected; branches of each photonic crystal resonant cavity combination is an integral multiple of that of the previous photonic crystal resonant cavity combination, and two photonic crystal resonant cavity combinations are connected by an optical waveguide.

A method of forming a photonic device includes forming a cavity extending from a first major surface of a semiconductor wafer, performing a laser grooving process to form a first groove and a second groove, dicing the semiconductor wafer along the first groove and the second groove, and attaching an optical interposer to the bottom surface of the cavity. The cavity includes a first sidewall, an opposite second sidewall, and a bottom surface. The first groove is separated from the second groove by the cavity. The dicing passes through the cavity along a line connecting the first groove to the second groove.

Systems and methods for compensating for nonuniform surface topography features in accordance with various embodiments of the invention are illustrated. One embodiment includes a method for manufacturing waveguide cells, the method including providing a waveguide including first and second substrates and a layer of optical recording material, and applying a surface forming process to at least one external surface of the first and second substrates. In another embodiment, applying the surface forming process includes applying a forming material coating to the at least one external surface, providing a forming element having a forming surface, bringing the forming element in physical contact with the forming material coating, curing the forming material coating while it is in contact with the forming element, and releasing the forming material coating from the forming element.