A photonic diode includes a first meta-material structure having a first bar and a second meta-material structure having a second bar arranged in a direction perpendicular to the first bar. The first bar and the second bar are separated from each other. Further, the first bar and the second bar are at least partially overlapped when viewed from a light propagation direction.

The subject matter of this specification can be embodied in, among other things, a graphene plasmon resonator that includes a planar patterned layer having a collection of electrically conductive segments, and a collection of dielectric segments, each dielectric segment defined between a corresponding pair of the electrically conductive segments, a graphene layer substantially parallel to the planar patterned layer and overlapping the collection of electrically conductive segments, and a planar dielectric layer between the planar patterned layer and the graphene layer.

A photonic diode includes a first meta-material structure having a first bar and a second meta-material structure having a second bar arranged in a direction perpendicular to the first bar. The first bar and the second bar are separated from each other. Further, the first bar and the second bar are at least partially overlapped when viewed from a light propagation direction.

In one aspect, the disclosure relates to multi-material fibers capable of distributedly measuring temperature and pressure in which the methods comprise a thermal drawing step, and the methods of fabricating the disclosed fibers. The fibers can be utilized in methods of temperature and pressure mapping or sensing comprising electrical reflectometry for interrogation. Further disclosed are devices comprising a disclosed fiber with the multi-point detection capability with simple one-end connection. Also disclosed are articles, e.g., smart clothing, wound dressing, robotic skin and other industrial products, comprising a disclosed fiber or a fabric comprising a disclosed fiber. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

A stacked edge coupler for a photonic chip is provided. The stacked edge coupler includes an insulating layer, a waveguide core, a first assisting waveguide, and a back-end-of-line stack. The first assisting waveguide is on the insulating layer. The waveguide core is over the first assisting waveguide and includes a tapered section. The back-end-of-line stack is over the waveguide core. The back-end-of-line stack includes a side edge, a dielectric layer, and a second assisting waveguide. The second assisting waveguide is on the dielectric layer and arranged adjacent to the side edge. The second assisting waveguide has an overlapping arrangement with the tapered section of the waveguide core.

An optical device with an optical transmitter circuit and an optical receiver circuit integrated on a substrate has at least one of a first oblique waveguide extending obliquely with respect to an edge of the substrate at or near an incident port for introducing a light emitted from a light source to the optical device, a second oblique waveguide extending obliquely with respect to the edge of the substrate at or near a signal receiving port optically connected to the optical receiver circuit, and a third oblique waveguide extending obliquely with respect to the edge of the substrate at or near a signal transmission port optically connected to the optical transmitter circuit.

A photonic diode includes a first meta-material structure having a first bar and a second meta-material structure having a second bar arranged in a direction perpendicular to the first bar. The first bar and the second bar are separated from each other. Further, the first bar and the second bar are at least partially overlapped when viewed from a light propagation direction.

An object of the present invention is to reduce the manufacturing cost of a semiconductor device. A semiconductor device includes a SOI substrate that has an optical waveguide including a semiconductor layer. The optical waveguide is covered with an interlayer insulating film. Wiring parts are formed on the interlayer insulating film. Moreover, a thin film part having a smaller thickness than the wiring parts is formed above the optical waveguide and is integrated with the wiring parts.

A method for fabricating an optical waveguide crossing structure. The method includes preparing a plate structure including a crossing part array and a guiding part array, each crossing part of the crossing part array being arranged at a gap from a plurality of guiding parts of the guiding part array. The method further includes preparing a waveguide structure including a first waveguide core array, a second waveguide core array and a tank, the tank being formed by removing a crossing region of the first waveguide core array and the second waveguide core array. The method further includes injecting an underfill into the tank. The method further includes depositing the plate structure on the waveguide structure so that the crossing part array and the guiding part array are inserted in the tank. The method further includes curing the underfill.

Systems for the manufacturing of waveguide cells in accordance with various embodiments can be configured and implemented in many different ways. In many embodiments, various deposition mechanisms are used to deposit layer(s) of optical recording material onto a transparent substrate. A second transparent substrate can be provided, and the three layers can be laminated to form a waveguide cell. Suitable optical recording material can vary widely depending on the given application. In some embodiments, the optical recording material deposited has a similar composition throughout the layer. In a number of embodiments, the optical recording material spatially varies in composition, allowing for the formation of optical elements with varying characteristics. Regardless of the composition of the optical recording material, any method of placing or depositing the optical recording material onto a substrate can be utilized.