A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.

A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.

An optical mode converter includes a silicon substrate and a silicon dioxide film deposited on a top surface of the silicon substrate. A lithium niobate waveguide positioned on the silicon dioxide film having a slab and a rib that both taper in a direction of beam propagation through the optical mode converter. A doped silicon dioxide waveguide is positioned on top of the lithium niobate waveguide and has a slab that tapers in the direction of the optical beam propagation through the optical mode converter. The optical mode converter expands an optical mode of the optical beam propagating through the optical mode converter from a first optical mode size to a second optical mode size.

Methods and systems for selectable parallel optical fiber and WDM operation may include an optoelectronic transceiver integrated in a silicon photonics die. The optoelectronic transceiver may, in a first communication mode, communicate continuous wave (CW) optical signals from an optical source module to a first subset of optical couplers on the die for processing signals in optical modulators in accordance with a first communications protocol, and in a second communication mode, communicate the CW optical signals to a second subset of optical couplers for processing signals in the optical modulators in accordance with a second communications protocol. Processed signals may be transmitted out of the die utilizing a third subset of the optical couplers. First or second protocol optical signals may be received from the fiber interface coupled to a fourth subset or a fifth subset, respectively, of the optical couplers.

Methods and systems for selectable parallel optical fiber and WDM operation may include an optoelectronic transceiver integrated in a silicon photonics die. The optoelectronic transceiver may, in a first communication mode, communicate continuous wave (CW) optical signals from an optical source module to a first subset of optical couplers on the die for processing signals in optical modulators in accordance with a first communications protocol, and in a second communication mode, communicate the CW optical signals to a second subset of optical couplers for processing signals in the optical modulators in accordance with a second communications protocol. Processed signals may be transmitted out of the die utilizing a third subset of the optical couplers. First or second protocol optical signals may be received from the fiber interface coupled to a fourth subset or a fifth subset, respectively, of the optical couplers.

An easy-to-fabricate and highly efficient single-mode optical fiber-to-single-mode optical waveguide coupler having relatively large horizontal and vertical alignment tolerances between the fiber and the waveguide coupler. The waveguide coupler also features ease of end-facet cleaving. The waveguide coupler can be used in ultra-broadband high coupling efficiency applications or other suitable applications. Single-mode on-chip waveguides incorporating such coupler(s) are also provided, as are methods of manufacturing the waveguide coupler and on-chip waveguide.

The present disclosure relates to a method for forming a cavity that traverses a stack of layers including a bottom layer, a first portion of which locally presents an excess thickness, the method comprising a first step of non-selective etching and a second step of selective etching vertically in line with the first portion.

A method and system of determining a z-distance between an optical fiber and a substrate are presented. The method can include, for instance: obtaining an image that includes an end of the optical fiber and a reflection of the end of the optical fiber from a surface of the substrate, and processing the image to determine a z-distance along a z-axis between the end of the optical fiber and the substrate.

A method and system of determining a z-distance between an optical fiber and a substrate are presented. The method can include, for instance: obtaining an image that includes an end of the optical fiber and a reflection of the end of the optical fiber from a surface of the substrate, and processing the image to determine a z-distance along a z-axis between the end of the optical fiber and the substrate.

A first optical device includes a substrate, a first optical waveguide provided to the substrate, and a first connector attached to the substrate. At least a portion of the substrate is positioned outside the first connector forwardly of light emitted from one end of the first optical waveguide.