Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.

Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.

After a step of etching a core layer, a lower cladding layer, and a substrate so that a recessed opening including one end of an optical waveguide is formed relative to a multilayer board and a step of forming mask layers on a top surface of the substrate including the opening, in a step, crystal is grown with respect to the mask layers in the opening, and a tilt surface to be used as the monolithic mirror is formed. An upper cladding layer is formed covering the core layer at the same time. Then, formation of an optical waveguide pattern, formation of the optical waveguide and an end surface of the optical waveguide, formation of a dielectric film for preventing reflection, and formation of a metal film on a surface of the tilt surface are executed.

A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.

Various embodiments of the present disclosure are directed towards a method for forming an integrated chip the method includes forming a waveguide on a first surface of a substrate. A conductive structure is formed at least partially overlying the waveguide. A light pipe structure is formed over the waveguide. A lower surface of the light pipe structure is disposed between a top surface and a bottom surface of the conductive structure. A lower portion of the light pipe structure contacts the conductive structure.

An apparatus for fusion welding one or several parallel optical fibers (102) to the same number of waveguides (101) includes a fiber guiding device and a highly reflective surface (104) located below the fiber for each fiber-waveguide pair, and a laser beam (103) whose wavelength is chosen such that its light is strongly absorbed by the fiber material and its shape is properly adjusted.

Embodiments may include or relate to an optical coupler. The optical coupler may include a silicon nitride (SiN) waveguide. The waveguide may be formed by placing SiN on an epitaxially grown silicon structure that is then removed subsequent to placement of the SiN. Other embodiments may be described and/or claimed.

Even when excitation light having large power is used, damage at the end face of the optical fiber is suppressed, and reduction in wavelength conversion efficiency and reduction in phase sensitive amplification gain are prevented. An embodiment of the present invention relates to a wavelength conversion apparatus for performing a wavelength conversion operation by inputting a fundamental wave and a second-order harmonic into a second-order nonlinear optical medium, the wavelength conversion apparatus comprising: a second-order harmonic input optical fiber optically coupled to a waveguide of the second-order nonlinear optical medium, for inputting the second-order harmonic into the waveguide; and a second-order harmonic output optical fiber optically coupled to a waveguide, for outputting the second-order harmonic output from the waveguide, wherein the second-order harmonic input optical fiber and the second-order harmonic output optical fiber are polarization maintaining fibers.

Even when excitation light having large power is used, damage at the end face of the optical fiber is suppressed, and reduction in wavelength conversion efficiency and reduction in phase sensitive amplification gain are prevented. An embodiment of the present invention relates to a wavelength conversion apparatus for performing a wavelength conversion operation by inputting a fundamental wave and a second-order harmonic into a second-order nonlinear optical medium, the wavelength conversion apparatus comprising: a second-order harmonic input optical fiber optically coupled to a waveguide of the second-order nonlinear optical medium, for inputting the second-order harmonic into the waveguide; and a second-order harmonic output optical fiber optically coupled to a waveguide, for outputting the second-order harmonic output from the waveguide, wherein the second-order harmonic input optical fiber and the second-order harmonic output optical fiber are polarization maintaining fibers.