Various embodiments provide for computational systems including multiple circuit packages, each circuit package comprising an electronic integrated circuit having multiple processing elements and intra-chip bidirectional photonic channels connecting the processing elements into an electro-photonic network, with inter-chip bidirectional photonic channels connecting the processing elements across the electro-photonic networks of the multiple circuit packages into a larger electro-photonic network.

Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.

Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.

Optical beam forming at the inputs/outputs of a photonic chip and to the spectral broadening of the light coupled to the chip. The photonic chip comprises an optical waveguide layer supported on a substrate. The chip includes an optical waveguide structure made of silicon and a coupling surface grating. The photonic chip has a front face on the side facing the coupling surface grating and a rear face on the side facing the substrate. A reflecting collimation structure is integrated in the rear face to modify the mode size of an incident light beam. The coupling surface grating is designed to receive light from the optical waveguide structure and to form a light beam directed to the reflecting collimation structure. The invention further relates to the method for producing such a chip.

An apparatus for monitoring strain in an optical chip in silicon photonics platform. The apparatus includes a silicon photonics substrate shared with the optical chip. Additionally, the apparatus includes an optical input configured in the silicon photonics substrate to supply an input signal of a single wavelength. The apparatus further includes a first waveguide arm and a second waveguide arm embedded in the silicon photonics substrate to form an on-chip interferometer. The second waveguide arm forms a delay line being disposed at a region in or adjacent to the optical chip. The on-chip interferometer is configured to generate an interference pattern serving as an indicator of strain distributed at the region in or adjacent to the optical chip. The interference pattern is caused by a temperature-independent phase shift at the single wavelength of the interferometer between the first waveguide arm and the second waveguide arm.

Methods of fabricating optical devices with high refractive index materials are disclosed. The method includes forming a first oxide layer on a substrate and forming a patterned template layer with first and second trenches on the first oxide layer. A material of the patterned template layer has a first refractive index. The method further includes forming a first portion of a waveguide and a first portion of an optical coupler within the first and second trenches, respectively, forming a second portion of the waveguide and a second portion of the optical coupler on a top surface of the patterned template layer, and depositing a cladding layer on the second portions of the waveguide and optical coupler. The waveguide and the optical coupler include materials with a second refractive index that is greater than the first refractive index.

Disclosed is a micro-optical interconnect component including an optical platform including, arranged onto a substrate, at least one optical alignment structure fixing an optical component and/or arranged as alignment structure to adapt another interconnect component. The optical platform includes a light deflecting element, having a total volume of less than 1 mm3, and made of a material having a refractive index higher than 1. The light deflecting element includes a face, facing the optical alignment structure, and has a curved reflecting surface so that an incident light beam onto the first face is deflected by an angle between 60° and 120°, the incident light beam may be provided from the outside or the inside of the substrate. Also disclosed are optical devices including at least one optical interconnect component and to optical systems including at least one optical device, as well as a batch fabrication process of the optical interconnect component

An exposure device for recording a hologram. The exposure device includes at least one modulation unit, which is designed to generate a modulation beam representing a reference beam and/or an object beam by impressing a modulation representing at least one holographic element of the hologram onto a laser beam. The exposure device also includes at least one reduction unit, which is designed to generate a modified modulation beam using the modulation beam, the modified modulation beam having a smaller beam diameter than the modulation beam. The exposure device further includes at least one objective lens unit, which is designed to direct the modified modulation beam through an immersion medium onto a recording material in order to record the hologram by exposing the recording material to the modified modulation beam.

A device includes a photonic routing structure including a silicon waveguide, photonic devices, and a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler; an interconnect structure on the photonic routing structure, wherein the grating coupler is configured to optically couple to an external optical fiber disposed over the interconnect structure; and computing sites on the interconnect structure, wherein each computing site includes an electronic die bonded to the interconnect structure, wherein each electronic die of the computing sites is electrically connected to a corresponding photonic device of the photonic devices.

Provided are a small-sized optical coupling system and an optical communication device using the optical coupling system. An optical coupling system includes a liquid crystal optical element, and a photonic device having a plurality of photonic chips, and couples an optical fiber to the photonic device, in which each of the photonic chips includes a grating coupler, the liquid crystal optical element separates incident signal light depending on at least one of polarization or a wavelength to emit light in different directions, and each separated signal light component is incident into the grating coupler of the corresponding photonic chip.