A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.

Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

A fiber optic assembly is provided including a support substrate having a substantially planar surface, a signal-fiber array supported on the planar surface of the support substrate. The signal-fiber array including a plurality of optical fibers and an adhesive disposed on the plurality of optical fibers and the support substrate. Each of the optical fibers is spaced from adjacent optical fibers of the plurality of optical fibers at a precise pitch.

Methods and systems for joining photonic components. A method includes suspending nano-particles in a medium, wherein the nano-particles include metal nano-particles. The method further includes applying a layer of the nano-particle medium to a first substrate, and exposing the layer of nano-particle medium to a thermal process to remove at least a portion of the medium and expose the nano-particles. A second substrate is placed on the nano-particles in alignment with the first substrate, and a heat is applied to the nano-particles to cause connection of contact points between adjacent nano-particles to cause a secure alignment of the first and second substrates. The heat applied to the layer of nano-particles is less than 300 C.

A wavelength division multiplexing device includes an alignment substrate configured to provide alignment between optical components of the device. The device includes a plurality of collimating lenses, and the alignment substrate includes a plurality of aligners. Each of the aligners is configured to place a respective one of collimating lenses in a predetermined position and a predetermined orientation with respect to the other collimating lenses. The alignment substrate thereby provides passive alignment of the collimating lenses with a designed optical path. The substrate may also include visual alignment markings that provide an indication of the placement of multi-layer thin film filters so that the filters define an actual optical path in alignment with the designed optical path, and integrated optical waveguides that provide an optical beam to each of the collimating lenses.

A flexible hinge alignment mechanism of a high-power optical system is made of a flexible hinge, and may lead to a relatively weak region of the hinge to achieve elastic displacement or rotation under stress loading. Through movable actuators such as screws and springs, the area is precisely moved, and the function of accurate alignment is achieved. When the flexible hinge causes the structure to move relatively due to the applied forces, it must be ensured that the corresponding distribution of maximum stress needs to be below the yielding point of the material, thus ensuring the mechanism acts in a material's elastic region. The design is beneficial to optimize the design of the optical alignment mechanism.

An optical module includes a substrate including a main surface, an optical component including a bottom surface, and a first side surface and a second side surface each extending in a direction intersecting the bottom surface and facing each other, and an adhesion portion fixing the optical component to the substrate. The optical component is mounted on the substrate such that the bottom surface faces the main surface. In this optical module, the adhesion portion includes a plurality of first adhesion portions provided along the first side surface and a plurality of second adhesion portions provided along the second side surface.

A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.