A receptacle connector defines a port. The port is provided with spring fingers that are configured to engage a mating module. The spring fingers are thermally coupled to a heat transfer plate that can be configured to provide part of a cage that defines the port. Fins can be mounted on or integrated into the heat transfer plate. In operation, thermal energy from an inserted module is transferred from the module to spring fingers and then to the heat transfer plate and then to a thermal dissipation system.

A traceable cable assembly includes a traceable cable having at least one data transmission element, a jacket at least partially surrounding the data transmission element, and first and second tracing optical fibers extending along at least a portion of a length of the traceable cable. The traceable cable assembly also includes a connector provided at each end of the traceable cable. The first and second tracing optical fibers each have a light launch end and a light emission end. The light launch ends of the first and second tracing optical fibers each include a bend. The bend allows for launching of light into the light launch ends without disengaging the first or second connectors from corresponding connector receptacles.

The invention described herein pertains to the structure and formation of an optical device that includes a planar laser and a waveguide. The planar laser has a large lateral QW-containing layer and a tapered section in a transition portion of the device structure that enable low diode leakage currents and facilitate transition of the optical signal from the laser to a transition waveguide, and in some embodiments, to a dilute waveguide.

A differential transmission circuit includes: a dielectric layer for embedding a plurality of first strip conductor pairs arranged side by side in the same layer above a ground conductor layer, each of the plurality of first strip conductor pairs including a first right strip conductor and a first left strip conductor, the dielectric layer being formed from an upper side of the ground conductor layer up to a region above the plurality of first strip conductor pairs, the dielectric layer having a flat upper surface. A region between adjacent two of the plurality of first strip conductor pairs is embedded in the dielectric layer without arranging a conductor in the region.

Realized is a bonding method which makes it possible to cause an angle formed between a front surface of an optical element and an upper end surface of a housing side wall to accurately match a design objective value. The bonding method includes the steps of (a) placing an optical element (12) on a jig (2) so that a front surface (12a) of the optical element (12) is in surface contact with a first flat surface (23a) of the jig'(2); and (b) placing a housing (11) on the jig (2) so that (i) an upper end surface (11a1) of a side wall (11a) of the housing (11) is in surface contact with a second flat surface (21a) of the jig (2) and (ii) a bottom plate (11b) of the housing (11) is in contact with a back surface (12h) of the optical element (12) via an adhesive (15).

A connector provided on a projector has an RF chip. A plug connected to the connector has an RF chip at a position opposite to the RF chip of the connector. When a protruding section of the plug is inserted and fit into an aperture section of the connector, the RF chip of the plug and the RF chip of the connector perform wireless communication with each other in a non-contact state. Thus, a connecting tool can be easily attached to/detached from a receiving tool without breaking a terminal due to contact such as in a case where a conventional contact type terminal is used.

A communication light detection adapter includes an adapter main body in which a light extraction hole is formed, a sliding lid attached to the adapter main body so as to slide between a closed position to close the light extraction hole and an open position to open the light extraction hole, and an energizing member to apply a pressure to the sliding lid in a direction from the open position toward the closed position.

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.

A housing for receiving at least one battery cell pack, having at least one housing wall, wherein the housing wall is formed at least partially from a plastic, and an optical conductor is formed in the plastic of the housing wall.

In an optical communications system, the thermal pathway for dissipating heat generated by clock and data recovery (CDR) circuitry of an optical communications module is a separate from the thermal pathway that is used to dissipate heat generated by other components of the module. The CDR circuitry is external to the module and is provided with its own heat dissipation device. Keeping the CDR circuitry external to the module and providing it with its own heat dissipation device decouples the thermal pathway for dissipating heat generated by the CDR circuitry from the thermal pathways used for dissipating heat generated by other components of the module. This results in more effective heat dissipation and better component performance.