A method may include selecting a transistor-outline can (TO-can) assembly cap. The method may further include welding the TO-can assembly cap to a rim that surrounds an optical opening of an optical subassembly box (OSA) such that the TO-can assembly cap hermetically seals the optical opening and allows optical signals to pass through the TO-can assembly cap and the optical opening.

A module retracting type installing and uninstalling device, including a base, a slide block, a pressing cover and a bail. The slide block includes a long-strip-shaped slide block base body, and U-shaped grooves are respectively formed in the middle part of two side walls of the slide block base body. A square hole is formed at the rear end of the slide block base body, and is sheathed onto a triangular lock catch of the base. First and second rotating shafts of the bail are respectively located in two snapping grooves at the front end of the base, and third and fourth rotating shafts are respectively located in the U-shaped grooves. The pressing cover includes a square pressing cover base body, and a pressure resilient sheet attached to the upper surface of the slide block and being pressed to the base.

The present transmitter optical module provides an LD 11, a first lens 12 with a focal point aligned with an optical output point of the LD 11, a second lens 14 that generates an optical output of the first lens 12 as a concentrated optical signal, and a third lens 4 that provides an optical output of the second lens 14 in an optical fiber 5. The second lens 14 is set at a position offset toward the third lens 4 from a position at which the second lens 14 outputs a collimated optical signal. The third lens 4 concentrates an optical output thereof within the optical fiber 5.

Disclosed herein is a cable device including a cable configured to transmit power and a connector connected to the cable, the cable device including a connector with improved electromagnetic interference (EMI) shielding performance. The cable device includes a cable, and a connector connected to the cable. The connector includes a printed circuit board including a ground electrode, and a shield case provided to accommodate the printed circuit board therein, the shield case including a contact portion provided in direct contact with the ground electrode.

A connector includes an optical fiber and a case, and converts an optical signal input from the optical fiber into an electrical signal and outputs the electrical signal, or converts an input electrical signal into an optical signal and outputs the optical signal to the optical fiber. The case has a wall into which the optical fiber is inserted. The rear wall has an upper end and a lower end facing each other with a space therebetween so that the optical fiber intervenes in the space. The case includes an upper protruding wall protruding in the front-rear direction and a lower protruding wall protruding in the front-rear direction. Between the upper free end of the upper protruding wall and the lower free end of the lower protruding wall, a first space is defined so the optical fiber can freely move in the width direction.

A construction and configuration for the receiving function of a high speed optical communication system with reduced manufacturing cost and improved performance. In an aspect, mounting the cover and lens provides a self-alignment behaviour that advantageously positions the cover and the lens to be in the optimum position for the photodiode. An assembly of electronic components receives data using an optical fibre. In one aspect, the assembly includes a photodiode, an amplifier coupled to the photodiode, and a printed circuit board on which the photodiode and amplifier are physically mounted, The printed circuit board has areas of a first material to which components may be attached using a fixing agent, and areas of a second material to which components will not attach using the fixing agent. Conductive bond wires are configured to directly couple the amplifier and the photodiode to conductive traces on an opposite side of the printed circuit board. A cover is configured to cover the amplifier and the photodiode, and is physically attached to the printed circuit board to provide mechanical rigidity around the photodiode and the amplifier. The cover has an optically transparent aperture containing a lens configured to focus modulated light signals from a fibre onto the photodiode. The printed circuit board has areas of a first material and second material configured to fix a location of the cover by use of the fixing agent to align the lens to focus the light signals from the fibre onto the photodiode.

Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.

A semiconductor optical device includes: a laser for emitting light; a modulator for modulating the light using an electroabsorption effect; a chip capacitor that is electrically connected in parallel to the laser; a chip inductor that is electrically connected in series to the chip capacitor, is electrically connected in series to the laser and the chip capacitor as a whole, and includes a first terminal and a second terminal; a solder or a conductive adhesive that directly bonds the first terminal of the chip inductor and the chip capacitor to each other; an electrical wiring group in which the laser, the modulator, the chip capacitor, and the chip inductor are electrically connected to each other; and a substrate on which the laser, the modulator, the chip capacitor, and the chip inductor are mounted.

An excitation light irradiation device includes a substrate having a color center. The color center is excited by an excitation light incident to the substrate. The substrate includes first and second reflection surfaces facing each other, and first and second end surfaces facing each other. When the excitation light enters into the substrate, the incident excitation light travels from the first end surface to the second end surfaces while repeatedly reflecting between the first and second reflection surfaces. The second end surface is inclined. The second end surface reflects the incident excitation light so as to cause the incident excitation light to be emitted from one of the first and second reflection surfaces.

Embodiments relating to an integrated photonics air data system are disclosed. A light beam from a laser source is routed to a plurality of tunable optical filters operative to transmit the light beam to one of a plurality of emitting grating couplers at any given time. The tunable optical filters are configured such that the light beam is emitted into the region of interest at different times from each of the emitting grating couplers. A passive optical filter array is configured to receive scattered light from the emitted light beam. The passive optical filter array comprises a plurality of optical notch filters operative for frequency selection, and a plurality of optical detectors each respectively coupled to an output of one of the optical notch filters. The passive optical filter array is operative to perform frequency spectrum decomposition of the received scattered light into a plurality of signals.