A thin plate imaging device in accordance with the present invention comprises a guide light plate, at least an imaging unit, and at least a photosensitive unit; the guide light plate and the imaging unit are utilized to allow lights to conduct total internal reflective or reflective propagation in a dimension, the photosensitive unit is placed in the path of the total internal reflective or reflective propagation and disposed at the image focus position of the imaging unit; clear images can be obtained without moving the imaging unit or the photosensitive unit back and forth, and objects with different object distances can be imaged on different spots of the photosensitive unit such that relative distances of the objects can be determined by image signals obtained via the photosensitive unit directly.

Disclosed herein is a monolithically integrated coherent receiver chip which has a geometric arrangement of the on-chip components that significantly improves the performance and the manufacturability of a coherent receiver module for Dual Polarization Quadrature Phase Shift Keyed (DP-QPSK) applications and other optical coherent detection systems. The coherent receiver chip comprises two optical hybrids, three optical inputs and eight electrical outputs with the two optical hybrids oriented perpendicular to the optical inputs and the electrical outputs which are widely spaced and arranged in a co-linear fashion that simplifies module design and assembly. The proposed geometric arrangement also replaces any optical waveguide crossings with vertical electrical-optical crossings and includes electrical transmissions which are used to minimize channel skew. The proposed configuration also has the additional benefit of improved thermal management by separating the module's trans-impedance amplifiers.

Provided is aback illuminated photo detector enabling easy determination of whether or not the radius of a beam spot on a light absorption layer is an appropriate size. The back illuminated photo detector includes: a semiconductor substrate having a first surface for receiving light; a semiconductor layer that is laminated on a second surface and includes a light absorption layer; a passivation film so as to expose a contact portion that is part of an upper surface of the semiconductor layer; and an electrode that is in contact with the semiconductor layer in the contact portion, and has a reflectance lower than that of the passivation film. The contact portion includes a center portion located on an optical axis, and an area of the center portion is smaller than a design cross-sectional area of a beam spot.

An optical communication package includes a circuit layer, an optical component electrically coupled to the circuit layer to optically communicate outside of the package, and a thermoelectric cooler electrically coupled to the circuit layer and disposed to transfer heat from the optical component to the circuit layer.

Example implementations relate to mounting optoelectronic devices and wavelength-division multiplexing optical connectors. For example, an implementation includes a transparent interposer having an integrated plurality of lenses. A plurality of optoelectronic devices are mounted to a bottom surface of the transparent interposer, each of the optoelectronic devices being paired to a respective lens of the plurality of lenses. The bottom surface of the transparent interposer is mounted to a substrate within a region of an optical socket. The optical socket receives a filter-based wavelength-division multiplexing (WDM) optical connector. Each lens of the plurality of lenses is paired to a respective filter of the WDM optical connector when the WDM optical connector is mated to the optical socket.

A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

A delivery system extends from a laser radiation source for connecting to a medical device that utilizes the laser radiation for medical treatment. The delivery system comprises an optical fiber connecting to a male launch connecter. The male launch connector having a body portion with the optical fiber fixed or constrained therein and the optical fiber terminating at a male ferrule with a forward directed fiber facet, the male ferrule may be cantilevered within the body portion by the optical fiber line providing freedom of movement of the male ferrule. The launch connector engages a receiving connector on the medical device first with mechanical connection portions and then more finely aligning optical connection portions by the male ferrule self aligning in a female ferrule with cooperating tapered surfaces. The male portion may fully seat in the female portion with cooperating cylindrical surfaces.

An optical transceiver performing the full-duplex transmission in a plural channel is disclosed. The optical transceiver provides an optical receptacle, a semiconductor optical device, an inner fiber that optically couples the optical receptacle with the semiconductor optical device, and a fiber tray that secures an extra length of the inner fiber. The fiber tray provides an inner wall inclined toward a direction perpendicular to a direction along which the inner fiber warps. The inner fiber is set within the space as touching the inclined inner wall and sliding thereon toward the inclined direction.

The present invention provides an optical semiconductor device in which damage of a lens when being mounted and mounting displacement due to suction failures of a chip can be suppressed.

An optical semiconductor device according to an embodiment includes: a semiconductor substrate having a first surface and a second surface facing the first surface; an electrode formed over the first surface of the semiconductor substrate; an optical element that is electrically coupled to the electrode and is formed in the semiconductor substrate; and a lens arranged on the second surface side of the optical element. A concave part is formed in the second surface of the semiconductor substrate, and the lens is arranged at the bottom of the concave part. A top part on the second surface side of the lens is located on the first surface side relative to the second surface located around the concave part.

An optical fiber attachment device has a slide receptacle having a slide space, and a sliding member provided slidably in the slide space. The sliding member has an installation component where the core wire of an optical fiber is held by a fiber holder, a pressure contact part is provided to the slide face of the slide receptacle in the slide space, and a corresponding pressure contact part is provided to the slide face of the sliding member in the slide space, and when the sliding member has slid in the slide space, the pressing force of the pressure contact part propagates through the corresponding pressure contact part to the sliding member side, and part of the sliding member is pressed from the slide receptacle side toward the installation component on the sliding member side.