A ferrule includes a ferrule body having a first opening formed in a side face thereof, and having a second opening formed in a top face thereof, wherein the first opening is configured to receive an optical waveguide inserted into the ferrule body at the side face, and wherein the second opening is formed over and in communication with the first opening, such that the second opening connects an inner space of the first opening to an outside of the ferrule body.

Embodiments include an optical apparatus and associated method of assembling. The optical apparatus comprises a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface. The optical apparatus further comprises a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate. The optical apparatus further at least one optical component coupled with the second surface and at least partly disposed within the channel, wherein the at least one optical component is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member.

A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.

A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.

Systems and methods for coupling photonic integrated subcircuits are described herein. The example system can include a first cartridge (4702) including a first photonic integrated subcircuit (4706) and a first alignment feature (4720, 4722). The system can include a second cartridge (4704) including a second photonic integrated subcircuit (4708) and a second alignment feature (4724, 4726), where the first alignment feature (4720, 4722) and the second alignment feature (4724, 4726) can be configured to enable alignment between the first photonic integrated subcircuit (4706) and the second photonic integrated subcircuit (4708). When the first photonic integrated subcircuit (4706) is aligned to the second photonic integrated subcircuit (4708), a first light path of the first photonic integrated subcircuit (4706) can be optically coupled to a second light path of the second photonic integrated subcircuit (4708).

Systems and methods for coupling photonic integrated subcircuits are described herein. The example system can include a first cartridge (4702) including a first photonic integrated subcircuit (4706) and a first alignment feature (4720, 4722). The system can include a second cartridge (4704) including a second photonic integrated subcircuit (4708) and a second alignment feature (4724, 4726), where the first alignment feature (4720, 4722) and the second alignment feature (4724, 4726) can be configured to enable alignment between the first photonic integrated subcircuit (4706) and the second photonic integrated subcircuit (4708). When the first photonic integrated subcircuit (4706) is aligned to the second photonic integrated subcircuit (4708), a first light path of the first photonic integrated subcircuit (4706) can be optically coupled to a second light path of the second photonic integrated subcircuit (4708).

An example optoelectronic module includes a housing that extends between a first end and an opposite second end. The optoelectronic module includes a printed circuit board (“PCB”) with an electrical connector at an end thereof, a transmitter electrically coupled to the PCB, a receiver electrically coupled to the PCB, and a receiving member including a plurality of ports each configured to receive a respective one of a plurality of fiber optic cables. In one aspect, the receiving member includes a plurality of deformable retaining members configured to be positioned in corresponding receptacles of the housing member in an arrangement structured to limit movement of the receiving member. In another aspect, the module also includes a plurality of fiber optic cable receptacles and a receptacle retaining member is positioned between the housing and the receptacles and limits movement of the receptacles in the housing.

An example optoelectronic module includes a housing that extends between a first end and an opposite second end. The optoelectronic module includes a printed circuit board (“PCB”) with an electrical connector at an end thereof, a transmitter electrically coupled to the PCB, a receiver electrically coupled to the PCB, and a receiving member including a plurality of ports each configured to receive a respective one of a plurality of fiber optic cables. In one aspect, the receiving member includes a plurality of deformable retaining members configured to be positioned in corresponding receptacles of the housing member in an arrangement structured to limit movement of the receiving member. In another aspect, the module also includes a plurality of fiber optic cable receptacles and a receptacle retaining member is positioned between the housing and the receptacles and limits movement of the receptacles in the housing.

An adapter assembly includes a single-piece or two-piece multi-fiber adapter defining a recess at which a contact assembly is disposed. The adapter assemblies can be disposed within adapter block assemblies or cassettes, which can be mounted to moveable trays. Both ports of the adapters disposed within adapter block assemblies are accessible. Only one port of each adapter disposed within the cassettes are accessible. Circuit boards can be mounted within the block assemblies or cassettes to provide communication between the contact assemblies and a data network.

An adapter assembly includes a single-piece or two-piece multi-fiber adapter defining a recess at which a contact assembly is disposed. The adapter assemblies can be disposed within adapter block assemblies or cassettes, which can be mounted to moveable trays. Both ports of the adapters disposed within adapter block assemblies are accessible. Only one port of each adapter disposed within the cassettes are accessible. Circuit boards can be mounted within the block assemblies or cassettes to provide communication between the contact assemblies and a data network.