Structures that include a distributed Bragg reflector and methods of fabricating a structure that includes a distributed Bragg reflector. The structure includes a substrate, an optical component, and a distributed Bragg reflector positioned between the optical component and the substrate. The distributed Bragg reflector includes airgaps and silicon layers that alternate in a vertical direction with the airgaps to define a plurality of periods.

Structures that include a distributed Bragg reflector and methods of fabricating a structure that includes a distributed Bragg reflector. The structure includes a substrate, an optical component, and a distributed Bragg reflector positioned between the optical component and the substrate. The distributed Bragg reflector includes airgaps and silicon layers that alternate in a vertical direction with the airgaps to define a plurality of periods.

An optical circuit board of the present disclosure includes a wiring board and an optical waveguide located on the wiring board. The optical waveguide includes a lower cladding layer, a core located on the lower cladding layer, an upper cladding layer located on the lower cladding layer and covering the core, a first cavity extending from the upper cladding layer to the lower cladding layer and dividing the core, and at least two second cavities extending from the upper cladding layer to the lower cladding layer and located with the core therebetween in plan view. The first cavity has a first opening portion located on the upper cladding layer side and a first bottom portion located on the lower cladding layer side. The second cavities each include a second opening portion located on the upper cladding layer side and a second bottom portion located on the lower cladding layer side.

Systems and methods include an optical switch system which provides a combination of .Math.LED arrays, PDs, imaging fiber cables, and crosspoint switch on a single chip. The system includes one or more input ports with each inputport configured to connect to an inputfiber bundle. The system additionally includes one or more output ports with each output port configured to connect to an outputfiber cable, wherein each of the inputfiber bundle and the outputfiber cable include a plurality of fiber cores. An electrical crosspoint switch is connected to the one or more input ports and the one or more output ports, wherein the electrical crosspoint switch is configured to connect a given input port to a corresponding output port, including all signals in the input fiber cable to the corresponding output fiber cable.

Systems and methods include an optical switch system which provides a combination of .Math.LED arrays, PDs, imaging fiber cables, and crosspoint switch on a single chip. The system includes one or more input ports with each inputport configured to connect to an inputfiber bundle. The system additionally includes one or more output ports with each output port configured to connect to an outputfiber cable, wherein each of the inputfiber bundle and the outputfiber cable include a plurality of fiber cores. An electrical crosspoint switch is connected to the one or more input ports and the one or more output ports, wherein the electrical crosspoint switch is configured to connect a given input port to a corresponding output port, including all signals in the input fiber cable to the corresponding output fiber cable.

A photonic structure can include in one aspect one or more waveguides formed by patterning of waveguiding material adapted to propagate light energy. Such waveguiding material may include one or more of silicon (single-, poly-, or non-crystalline) and silicon nitride.

A photonic structure can include in one aspect one or more waveguides formed by patterning of waveguiding material adapted to propagate light energy. Such waveguiding material may include one or more of silicon (single-, poly-, or non-crystalline) and silicon nitride.

A modular hardware platform utilizes a combination of different types of units that are pluggable into cassette endpoints. The present disclosure enables the construction of an extremely large system, e.g., 500 Tb/s+, as well as small, standalone systems using the same hardware units. This provides flexibility to build different systems with different slot pitches. The hardware platform includes various numbers of stackable units that mate with a cost-effective, hybrid Printed Circuit Board (PCB)/Twinax backplane, that is orthogonally oriented relative to the stackable units. In an embodiment, the hardware platform supports a range of 14.4 Tb/s-800 Tb/s+ in one or more 19″ racks, providing full features Layer 3 to Layer 0 support, i.e., protocol support for both a transit core router and full feature edge router including Layer 2/Layer 3 Virtual Private Networks (VPNs), Dense Wave Division Multiplexed (DWDM) optics, and the like.

Embodiments herein describe using a double wafer bonding process to form a photonic device. In one embodiment, during the bonding process, an optical element (e.g., a high precision optical element) is optically coupled to an optical device in an active surface layer. In one example, the optical element comprises a nitride layer which can be patterned to form a nitride waveguide, passive optical multiplexer or demultiplexer, or an optical coupler.

Embodiments herein describe using a double wafer bonding process to form a photonic device. In one embodiment, during the bonding process, an optical element (e.g., a high precision optical element) is optically coupled to an optical device in an active surface layer. In one example, the optical element comprises a nitride layer which can be patterned to form a nitride waveguide, passive optical multiplexer or demultiplexer, or an optical coupler.