The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.

A cassette module has three 16 fiber MPOs and four 12 fiber MPOs wherein each 16 fiber MPO has 4 fiber receiving areas with four fibers going to each fiber receiving area and each 12 fiber MPO has 3 fiber receiving areas with four fibers going to each fiber receiving area. Fibers are routed from certain areas of the 16 fiber MPOs to those of the 12 fiber MPOs in order to convert a base 12 communication system to a base 16 communication system.

A cassette module has three 16 fiber MPOs and four 12 fiber MPOs wherein each 16 fiber MPO has 4 fiber receiving areas with four fibers going to each fiber receiving area and each 12 fiber MPO has 3 fiber receiving areas with four fibers going to each fiber receiving area. Fibers are routed from certain areas of the 16 fiber MPOs to those of the 12 fiber MPOs in order to convert a base 12 communication system to a base 16 communication system.

Embodiments herein describe using a double wafer bonding process to form a photonic device. In one embodiment, during the bonding process, an optical element (e.g., a high precision optical element) is optically coupled to an optical device in an active surface layer. In one example, the optical element comprises a nitride layer which can be patterned to form a nitride waveguide, passive optical multiplexer or demultiplexer, or an optical coupler.

Embodiments herein describe using a double wafer bonding process to form a photonic device. In one embodiment, during the bonding process, an optical element (e.g., a high precision optical element) is optically coupled to an optical device in an active surface layer. In one example, the optical element comprises a nitride layer which can be patterned to form a nitride waveguide, passive optical multiplexer or demultiplexer, or an optical coupler.

The present invention relates to a photonic chip carried out by the combination and interconnection of equally-oriented Programmable Photonics Processing Blocks, with all their longitudinal axes in parallel, implemented over a photonic chip that is capable of implementing one or multiple, simultaneous photonics circuits with optical feedback paths and/or linear multiport transformations, by the appropriate programming of its resources and the selection of its input and output ports. The invention also relates to a parallel field-programmable photonic array (P-FPPA) comprising of, at least one programmable circuit based on equally-oriented/parallel tunable beam-splitters with independent coupling and phase-shifting configuration and peripheral high-performance building blocks.

An optical fiber connecting component includes a glass plate having a plurality of first through holes, a resin ferrule fixed to the glass plate and having a plurality of second through holes that are each coaxial with corresponding one of the plurality of first through holes, and a plurality of optical fibers including a glass fiber and a resin coating that covers the glass fiber. The glass fiber exposed from a tip of each of the optical fibers is held in corresponding one of the first through holes and corresponding one of the second through holes, and a material for the resin ferrule has a flexural modulus of 5 GPa or more at 200° C.

An integrated circuit (IC) package comprising an optical die comprising a configurable optical switch. The configurable optical switch comprises an optical switch operably coupled to one or more optical transceivers. An optical connector comprises at least one exo-package optical port. The at least one exo-package optical port is operably coupled to the configurable optical switch. The configurable optical switch is to pass an optical signal on the at least one of the one or more exo-package ports to at least one of the one or more optical transceivers, and an IC die comprising electronic circuitry is operably coupled to the one or more optical transceivers.

Apparatus and methods of manufacture are disclosed. In one example the apparatus includes a first substrate that has a first surface, a first optical waveguide that is at or near the first surface of the first substrate, a second substrate that has a second surface. The second substrate is coupled to the first substrate at an interface. The apparatus also has a photonic integrated circuit (PIC) with a portion at or near the second surface. The PIC is in alignment with and optically coupled to the first optical waveguide across the interface.

Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.