A method of forming an optical bridge waveguide between an optical element and an optical waveguide layer fabricated on a substrate such as a PIC platform. An optical element is heterogeneously integrated on the substrate. A first dielectric layer is deposited on the substrate and etched to a predetermined height. A second dielectric layer having a higher k than the first dielectric layer is deposited on the first dielectric layer, and a third dielectric layer having a lower k than the second dielectric layer is deposited on the second dielectric layer. The dielectric layers are formed such that the second dielectric layer provides an optical bridge waveguide between the optical element and optical waveguide layer, with the first and third dielectric layers providing a lower and upper cladding, respectively, for the optical bridge waveguide.

A method of forming an optical bridge waveguide between an optical element and an optical waveguide layer fabricated on a substrate such as a PIC platform. An optical element is heterogeneously integrated on the substrate. A first dielectric layer is deposited on the substrate and etched to a predetermined height. A second dielectric layer having a higher k than the first dielectric layer is deposited on the first dielectric layer, and a third dielectric layer having a lower k than the second dielectric layer is deposited on the second dielectric layer. The dielectric layers are formed such that the second dielectric layer provides an optical bridge waveguide between the optical element and optical waveguide layer, with the first and third dielectric layers providing a lower and upper cladding, respectively, for the optical bridge waveguide.

The photoelectric signal conversion and transmission device includes a photoelectric signal module and a fiber joint, matched and coupled together. A circuit board of the photoelectric signal module includes one or more connection bases. Light emission elements, light reception elements, and amplifiers are configured on a first coupling face of the connection based, and electrically connected by first and second wires. The fiber joint includes a number of fibers axially aligned with the light emission and reception elements. By having the light emission and reception elements and amplifiers configured on a same coupling face, their physical connection distance is reduced, thereby decreasing signal attenuation, enhancing signal transmission performance, and facilitating structural miniaturization.

An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.

An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.

In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.

In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.

A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.

An optical beam combiner circuit includes a plurality of branch portions configured to divide optical beams output from a plurality of input waveguides, a combiner unit configured to combine optical beams, each of the optical beams being one of the divided optical beams obtained by one of the plurality of branch portions, an output waveguide configured to output an optical beam obtained by the combiner unit combining the optical beams, a plurality of monitoring waveguides configured to output optical beams, each of the optical beams being another of the divided optical beams obtained by one of the plurality of branch portions, and a plurality of light-blocking grooves provided on both sides with respect to each input waveguide, the plurality of light-blocking grooves being positioned to enable stray light not coupled to the plurality of input waveguides to be reflected toward an end surface different from an exit end surface of each monitoring waveguide and also different from an exit end surface of the output waveguide.

A USB active optical cable and a plug capable of managing power consumption and state. The USB active optical cable and plug respectively comprises a first plug, a second plug, and an optical transmission medium used to connect the first plug and the second plug; the first plug and the second plug are configured to operate different operating states, including an initialization mode, a transmission mode, and a power saving mode, and they can switch between the different operating states. The USB active optical cable and plug are both based on the separate control of the transmitting unit and the receiving unit to distinguish different operating modes, provide necessary operating requirements and mode switching conditions for each mode, and also enable the checking and transmission of the plugging state in the power saving mode, thus facilitate the power consumption management of the active optical cable.