A bipod flexure mount couples an optic to a base while isolating the optic from strain to resist wavefront error. The bipod flexure mount has a distal attachment pad to be coupled to the optic and a proximal attachment pad to be coupled to the base. A pair of beams extend between and couple the distal and proximal attachment pads. The distal attachment pad, the proximal attachment pad and the pair of beams are disposed in and define a planar layer with opposite planar surfaces that are substantially parallel. The bipod flexure mount is relatively flexible about four degrees of freedom and is relatively stiff about two degrees of freedom.

A reading device includes an emission unit that emits light; a first reflecting unit having a first reflecting surface that reflects the light emitted by the emission unit toward a document; a second reflecting unit having a second reflecting surface that reflects the light reflected by the first reflecting unit and specularly reflected by the document; a first support unit that supports the first reflecting unit and the second reflecting unit and fixes a relative position and a relative orientation between the first reflecting surface and the second reflecting surface; and a second support unit that supports the first support unit such that at least one of a position and an orientation of the first support unit is adjustable.

An optical imaging lens including, in order from an object side to an image side, an aperture, a first lens, a second lens, a third lens, a fourth lens and a fifth lens, wherein the first lens has positive refractive power and includes a convex image-side surface; the second lens has negative refractive power and includes a convex object-side surface and a concave image-side surface; the third lens has positive refractive power and is biconvex; the fourth lens has positive refractive power and includes a concave object-side surface and a convex image-side surface; the fifth lens has negative refractive power and includes a convex object-side surface and a concave image-side surface. The object-side and image-side surfaces of the third lens, the fourth lens, and the fifth lens are aspheric. The optical imaging lens includes a total of five elements.

A lidar and a lidar adjustment method are provided. The lidar includes at least one transceiver component. The at least one transceiver component includes an emitting assembly, a beam splitting assembly, and a receiving assembly. The emitting assembly is configured to emit an outgoing light signal. The outgoing light signal is emitted, through the beam splitting assembly, towards a detection region and reflected by a target object to form a reflected light signal. The receiving assembly is configured to receive the reflected light signal after being deflected by the beam splitting assembly.

This invention provides a system and method for enhanced depth of field (DOF) advantageously used in logistics applications, scanning for features and ID codes on objects. It effectively combines a vision system, a glass lens designed for on-axis and Scheimpflug configurations, a variable lens and a mechanical system to adapt the lens to the different configurations without detaching the optics. The optics can be steerable, which allows it to adjust between variable angles so as to optimize the viewing angle to optimize DOF for the object in a Scheimpflug configuration. One, or a plurality, of images can be acquired of the object at one, or differing angle settings, with the entire region of interest clearly imaged. In another implementation, the optical path can include a steerable mirror and a folding mirror overlying the region of interest, which allows different multiple images to be acquired at different locations on the object.

A semiconductor lithography projection exposure apparatus includes a sensor reference including reference elements. The apparatus also includes an optical element, which includes a main body comprising receiving elements receiving the reference elements. The optical element further includes a referential surface that is an optically active surface of the optical element. The reference elements are arranged to determine a position and an orientation of the optical element. A method includes aligning a sensor reference with respect to a referential surface in a semiconductor lithography projection exposure apparatus.

A method for assembling a head mounted display includes providing a rigid structural frame, and forming an inner optical assembly by assembling optical components to the structural frame including at least one micro-display configured to generate an image, and at least one reflective optical component configured to direct the image to a user's eye. The method includes assembling an outer frame to the inner optical assembly to provide protection for the optical components and customization of the head-mounted display for the user.

A metrology frame configured to receive and secure a workpiece in preparation for an interferometric determination of a spatial profile of the workpiece with the use of one or more retroreflectors removably cooperated with the frame in known pre-determined spatial relationship with respect the fiducial features of not only the workpiece but those of the metrology frame itself. The metrology frame is necessarily devoid of a holographic optical element, while the measurement apparatus containing such metrology frame employs a hologram configured to generate at least one alignment optical wavefront that spatially converges on the retroreflector. The hologram is preferably structured as a set of constituent holographic regions (contained in the same, unitary or spatially-complementary housing and/or substrate) that perform different but operationally-complementary functions to facilitate the alignment of the metrology frame with respect to the converging optical wavefront with or without the workpiece in the frame. The optical measurement system employing the metrology frame and the hologram. Methods of optical alignment with use of same.

A semiconductor lithography projection exposure apparatus includes a sensor reference including reference elements. The apparatus also includes an optical element, which includes a main body comprising receiving elements receiving the reference elements. The optical element further includes a referential surface that is an optically active surface of the optical element. The reference elements are arranged to determine a position and an orientation of the optical element. A method includes aligning a sensor reference with respect to a referential surface in a semiconductor lithography projection exposure apparatus.

An optical image generation system including: a spatial light modulator (SLM) configured to receive an input collimated laser beam and modulate the wavefront of the laser beam; one or more optical elements configured to project the modulated laser beam onto a focal plane; a first mirror and a second mirror situated at the focal plane, an edge of the first mirror being adjacent to an edge of the second mirror, the first mirror reflects a first portion of the modulated laser beam in a first direction, the second mirror reflects a second portion of the modulated laser beam in a second direction; and an objective lens projects the first and second portions into a combined image; wherein the zeroth order diffraction is block or suppressed at the center of the focal plane.