An optical device includes a substrate, a first cladding layer that is laminated on one surface of the substrate, and a first optical waveguide that is formed in the first cladding layer at a side opposite to the substrate in the first cladding layer. The optical device further includes an electro-optic crystal layer that is laminated on a surface of the first cladding layer at a side opposite to the substrate, and a second optical waveguide that is formed of the electro-optic crystal layer on a surface of the electro-optic crystal layer at a side opposite to the first cladding layer. The optical device further includes a second cladding layer that is laminated on a surface of the electro-optic crystal layer at a side opposite to the first cladding layer.

A quantum computer system uses a network of Mach-Zehnder interferometers (MZIs) to route laser light to selected atoms of a quantum array. The MZI network is defined in a photonic integrated circuit (PIC), which also includes an array of optical gratings. A laser system generates the light, the electronically controlled MZI network routes the light to respective optical gratings. The optical gratings convert the light from the MZI network into beams to illuminate the respective atoms so as to conditionally change their quantum states. This routing process offers advantages of economy, scalability and reliability over alternatives approaches to optical control of quantum states.

An electro-optical device, including: a substrate; an optical waveguide film formed of electro-optical material provided in a predetermined region on the substrate; a buffer layer provided adjacent to the optical waveguide film; and an electrode for applying an electric field to the optical waveguide film, and a non-light-transmission optical waveguide film is provided outside the predetermined region. According to the electro-optical device of the present disclosure, the propagation loss of light can be suppressed.

An electro-optical device, including: a substrate; an optical waveguide composed of an electro-optic material film formed in a ridge shape on the substrate; a buffer layer configured to cover the optical waveguide; and an upper electrode provided on the optical waveguide through the buffer layer, and the buffer layer has a recess on the upper electrode side above the optical waveguide. Accordingly, the propagation loss of light can be suppressed.

Reflection between a Mach-Zehnder modulator and a termination resistor is suppressed. An optical modulator includes a differential drive open collector driver IC, a differential drive semiconductor Mach-Zehnder modulator, and a differential terminator. The Mach-Zehnder modulator includes waveguides and a differential high-frequency line. The differential terminator includes a differential high-frequency line and termination resistors. The differential high-frequency line includes a capacity provided at least one of between signal lines and between a signal line and a ground line.

Described herein are methods, systems, and apparatuses to utilize an electro-optic modulator including one or more heating elements. The modulator can utilize one or more heating elements to control an absorption or phase shift of the modulated optical signal. At least the active region of the modulator and the one or more heating elements of the modulator are included in a thermal isolation region comprising a low thermal conductivity to thermally isolate the active region and the one or more heating elements from a substrate of the PIC.

Aspects relate to a photonic processing system, a photonic processor, and a method of performing matrix-vector multiplication. An optical encoder may encode an input vector into a first plurality of optical signals. A photonic processor may receive the first plurality of optical signals; perform a plurality of operations on the first plurality of optical signals, the plurality of operations implementing a matrix multiplication of the input vector by a matrix; and output a second plurality of optical signals representing an output vector. An optical receiver may detect the second plurality of optical signals and output an electrical digital representation of the output vector.

Devices, methods for analog-to-digital converters (ADCs) that perform high-dynamic range measurements based on optical techniques are disclosed. In one example aspect, an optical encoder includes a polarization rotator configured to receive a train of optical pulses, and an electro-optic (EO) modulator coupled to an output of the polarization rotator. The EO modulator is configured to receive a radio frequency (RF) signal and to produce a phase modulated signal in accordance with the RF signal. The optical encoder also includes a polarizing beam splitter coupled to the output of the EO modulator; and an optical hybrid configured to receive two optical signals from the polarizing beam splitter and to produce four optical outputs that are each phase shifted with respect to one another.

A light source for a frequency-modulated continuous-wave (FMCW) LiDAR device is formed by a photonic integrated circuit and comprises a substrate and a multilayer structure. Formed in the multilayer structure is a semiconductor laser that is received in a recess etched into the multilayer structure. An optical path between the semiconductor laser and a reflector forms an external cavity for the semiconductor laser. The external cavity includes a variable attenuator causing an attenuation of light guided in the cavity optical waveguide. The external cavity may also or alternatively include an optical phase modulator.

A silicon photonics based single wavelength 100 Gbit/s PAM4 DWDM transceiver in a pluggable form factor having a transmitter, said transmitter having: a DWDM laser source; a fiber array pigtail having a polarization maintaining fiber and an output single mode fiber; a silicon photonics modulator chip configured to optically connect to the DWDM laser source through the usage of the polarization maintaining fiber, a modulator driver chip connected to the silicon photonics modulator chip and an LC receptacle configured to optically connect to the silicon photonics modulator chip through the usage of the output single mode fiber. The disclosed transmitter may be further comprised of a reference loop within the silicon photonics modulator chip to allow for the utilization of a passive alignment approach for optically connected elements. The disclosed transceiver may be configured for use with C-band DWDM applications for utilization in applicable technologies, including 5G telecommunications.