Patent classifications
G03F7/0275
Poly- or prepolymer composition, or embossing lacquer comprising such a composition and use thereof
With a prepolymer composition containing at least one mono or oligomer component with at least one polymerizable CC double bond as well as at least one multifunctional monomer component, the multifunctional monomer component a multifunctional monomer component is contained with at least two thiol groups selected from the group: 3-Mercaptopropionates, 3-Mercaptoacetates, thioglycolates, and alkylthiols, wherein the mono or oligomer component with at least one polymerizable double bond is selected from the group acrylates, methyl acrylates, vinyl ethers, allyl ethers, propenyl ethers, alkenes, dienes, unsaturated esters, allyl triazines, allyl isocyanates, and N-vinyl amides, and wherein at least one surface-active anti-adhesive additive selected from the group alkyl (meth)acrylates, polysiloxane (meth)acrylates, perfluoroalkyl (meth)acrylates, perfluoropolyether (meth)acrylates, alkyl vinyl ethers, polysiloxane vinyl ethers, perfluoroalkyl vinyl ethers, and perfluoropolyether vinyl ethers, as well as a photoinitiator are contained, as well as the use thereof.
ZIRCONIA AND TITANIA FORMULATIONS AND NANOCOMPOSITES FOR NANOIMPRINT LITHOGRAPHY
The present disclosure provides a high-refractive index acrylic formulation comprised of sub-30 nm zirconium and/or titanium oxide nanocrystals. The formulation is solvent-containing or solvent-free, of imprintable and/or inkjet-printable viscosities, can be applied by multiple film deposition techniques and produces high-refractive index, high transparency nanocomposites for a variety of optical applications including AR/VR/MR and display applications.
COMPOSITION, FILM FORMING METHOD, METHOD OF MANUFACTURING NEAR INFRARED CUT FILTER, METHOD OF MANUFACTURING SOLID IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE DISPLAY DEVICE, AND METHOD OF MANUFACTURING INFRARED SENSOR
A composition includes: a near infrared absorbing compound A that includes a -conjugated plane having a monocyclic or fused aromatic ring; and a solvent B, in which the solvent B includes a solvent B1 in which a solubility parameter is in a range between 19.9 MPa.sup.0.5 or higher and 22.3 MPa.sup.0.5 or lower and a solvent B2 in which a solubility parameter is lower than 19.9 MPa.sup.0.5 or higher than 22.3 MPa.sup.0.5, and a content of the solvent B2 in the solvent B is 9 mass % or lower.
UV patternable polymer blends for organic thin-film transistors
A polymer blend includes an organic semiconductor polymer blended with an isolating polymer; at least one photoinitiator for generating active radicals; and at least one crosslinker comprising C?C bonds, thiols, or combinations thereof, such that the organic semiconductor polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, and the isolating polymer has a non-conjugated backbone. A method of forming an organic semiconductor device having the polymer blend is also presented.
STEPPED SUBSTRATE COATING COMPOSITION INCLUDING COMPOUND HAVING PHOTOCROSSLINKING GROUP DUE TO UNSATURATED BOND BETWEEN CARBON ATOMS
A stepped substrate coating composition includes: a compound (E) containing partial structures (I) and (II) and a solvent (F). The partial structure (II) contains a hydroxy group generated by an epoxy group and a proton-generating compound reaction; the partial structure (I) is at least one partial structure selected from partial structures of Formula (1-1) to Formula (1-5) or a partial structure combining a partial structure of Formula (1-6) and Formula (1-7) or Formula (1-8); and the partial structure (II) is a partial structure of Formula (2-1) or Formula (2-2). The photocurable stepped substrate coating composition wherein in the compound (E), the epoxy group and the hydroxy group are contained in a molar ratio of 0(Epoxy group)/(Hydroxy group)0.5 and the partial structure (II) is contained in a molar ratio of 0.01(Partial structure (II))/(Partial structure (I)+Partial structure (II))0.8.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND COLOR FILTER USING SAME
Provided are a photosensitive resin composition including (A) a photo-conversion material; (B) a binder resin including an acryl-based repeating unit including one or more thiol groups at the terminal end; (C) a photopolymerization initiator; and (D) a solvent, a photosensitive resin layer manufactured using the same, and a color filter including the photosensitive resin layer.
COMPOSITION, FILM, CURED FILM, OPTICAL SENSOR, AND METHOD FOR PRODUCING FILM
A composition includes at least one of particles having an average primary particle diameter of 50 to 150 nm or particles having an average major axis length of 50 to 150 nm, and a resin, in which the composition has an L* in an L*a*b* color space of CIE 1976 of 35 to 75 in a case of forming a film with a thickness of 3 m using the composition. A film; a cured film; an optical sensor; and a method for producing a film each use the composition.
BIODEGRADABLE POLYMERS THAT ELUTE AN ACTIVE SUBSTANCE
A photocurable resin composition, the photocurable resin composition comprises a photoinitiator, optionally an oligomer comprising at least one alkene moiety (which may be a 1,2-disubstitued moiety, or an acrylate moiety), and a drug-derived monomer (1, 2, 3, 4, 5) having at least one photo-crosslinkable moiety which may be an alkene moiety).
RADIATION-SENSITIVE COMPOSITION, OPTICAL FILTER, LAMINATE, PATTERN FORMING METHOD, SOLID IMAGE PICKUP ELEMENT, IMAGE DISPLAY DEVICE, AND INFRARED SENSOR
Provided is a radiation-sensitive composition with which a pattern having excellent infrared shielding properties and excellent rectangularity can be formed. In addition, provided are an optical filter, a laminate, a pattern forming method, a solid image pickup element, an image display device, and an infrared sensor. This radiation-sensitive composition includes: a near infrared absorber; a resin; a radically polymerizable compound; and a photoradical polymerization initiator, in which the radiation-sensitive composition has an absorption maximum in a wavelength range of 700 to 1000 nm, a ratio absorbance Amax/absorbance A550 of an absorbance Amax at the absorption maximum to an absorbance A550 at a wavelength of 550 nm is 50 to 500, the resin includes a resin having an acid group, and a mass ratio radically polymerizable compound/resin having an acid group of the radically polymerizable compound to the resin having an acid group is 0.3 to 0.7.
PHOTOSENSITIVE RESIN COMPOSITION AND COLOR FILTER USING THE SAME
A photosensitive resin composition includes (A) a photo-conversion material; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, wherein the solvent includes a first solvent having a polarity index (Snyder Polarity Index) of 0.1 times or less relative to a polarity index of water. The photosensitive resin composition having excellent color reproducibility, color purity, viewing angle, and the like may be provided by using a photoconversion material instead of a pigment or a dye conventionally used as a color material and a color filter having an excellent photo-conversion ratio by using this photosensitive resin composition may be provided.