A pattern forming method including pressing a mold having an uneven pattern against a curable film formed of a nanoimprint composition to transfer the uneven pattern to the curable film, curing the curable film to which the uneven pattern has been transferred while pressing the mold against the curable film to form a cured film, peeling the mold off from the cured film, and heating the cured film, from which the mold has been peeled off at 160° C. or higher to form a post-baked cured film.

In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N═C═O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N═C═O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

The present invention relates to a structure for a quantum dot barrier rib and a process for preparing the same. The structure for a quantum dot barrier rib of the present invention comprises a cured film having a uniform film thickness and an appropriate range of film thickness. Here, the reflectance R.sub.SCI measured by the SCI (specular component included) method and the reflectance R.sub.SCE measured by the SCE (specular component excluded) method are reduced, and the ratio between them (R.sub.SCE/R.sub.SCI) is appropriately adjusted, so that it is possible to satisfy such characteristics as high light-shielding property and low reflectance at the same time while the resolution and pattern characteristics are maintained to be excellent. In addition, when the structure for a quantum dot barrier rib is prepared, it is possible to form a multilayer pattern having a uniform film thickness suitable for the quantum dot barrier ribs in a single development process. Thus, it can be advantageously used for a quantum dot display.

The present invention relates to a structure for a quantum dot barrier rib and a process for preparing the same. The structure for a quantum dot barrier rib of the present invention comprises a cured film having a uniform film thickness and an appropriate range of film thickness. Here, the reflectance R.sub.SCI measured by the SCI (specular component included) method and the reflectance R.sub.SCE measured by the SCE (specular component excluded) method are reduced, and the ratio between them (R.sub.SCE/R.sub.SCI) is appropriately adjusted, so that it is possible to satisfy such characteristics as high light-shielding property and low reflectance at the same time while the resolution and pattern characteristics are maintained to be excellent. In addition, when the structure for a quantum dot barrier rib is prepared, it is possible to form a multilayer pattern having a uniform film thickness suitable for the quantum dot barrier ribs in a single development process. Thus, it can be advantageously used for a quantum dot display.

A method for producing a composition, the method being for producing a composition using a stirring device provided with a stirring tank and a stirrer, includes a mixing step of charging a resin, an acid generator, and a solvent into the stirring tank, and a stirring step of stirring the mixture accommodated in the stirring tank, using the stirrer, in which a ratio c of a content of the acid generator to a total mass of the mixture is 0.3% to 2.5% by mass, the stirrer is provided with a rotatable stirring shaft, a plurality of support parts attached to the stirring shaft, and a plurality of stirring elements attached to each of end parts of the plurality of support parts, the shape and the arrangement of the stirring elements are specified, and the positions of the plurality of stirring elements are specified so as to satisfy a specific Expression (1).

A method for producing a composition, the method being for producing a composition using a stirring device provided with a stirring tank and a stirrer, includes a mixing step of charging a resin, an acid generator, and a solvent into the stirring tank, and a stirring step of stirring the mixture accommodated in the stirring tank, using the stirrer, in which a ratio c of a content of the acid generator to a total mass of the mixture is 0.3% to 2.5% by mass, the stirrer is provided with a rotatable stirring shaft, a plurality of support parts attached to the stirring shaft, and a plurality of stirring elements attached to each of end parts of the plurality of support parts, the shape and the arrangement of the stirring elements are specified, and the positions of the plurality of stirring elements are specified so as to satisfy a specific Expression (1).

Provided are (1) a composition including an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, a surfactant, and a solvent, in which a surface tension measured by a Wilhelmy method at 25° C. is 26.5 mN/m or less; (2) a composition including a surfactant and a solvent, in which a surface tension T1 measured by a Wilhelmy method at 25° C. and a surface tension T2 measured by a Wilhelmy method at 25° C. immediately before a timing that a volume reaches 60% of an initial volume in an environment of a temperature of 25° C. and a relative humidity of 60% satisfy a relationship of T1>T2; and (3) applications thereof.

Provided are (1) a composition including an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, a surfactant, and a solvent, in which a surface tension measured by a Wilhelmy method at 25° C. is 26.5 mN/m or less; (2) a composition including a surfactant and a solvent, in which a surface tension T1 measured by a Wilhelmy method at 25° C. and a surface tension T2 measured by a Wilhelmy method at 25° C. immediately before a timing that a volume reaches 60% of an initial volume in an environment of a temperature of 25° C. and a relative humidity of 60% satisfy a relationship of T1>T2; and (3) applications thereof.

A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.