A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

The present application relates to a compound of Formula 1, a binder resin, a negative-type photosensitive resin composition, and a display device comprising a black bank formed using same.

A nanoimprint composition including an unsaturated acid metal salt (R), a photopolymerizable compound (B), a photoradical polymerization initiator, and a solvent component having compatibility with the unsaturated acid metal salt (R) and the photopolymerizable compound (B), in which a content of the unsaturated acid metal salt (R) is 50 parts by mass or greater with respect to 100 parts by mass of a total content of the unsaturated acid metal salt (R) and the photopolymerizable compound (B).

A nanoimprint composition including an unsaturated acid metal salt (R), a photopolymerizable compound (B), a photoradical polymerization initiator, and a solvent component having compatibility with the unsaturated acid metal salt (R) and the photopolymerizable compound (B), in which a content of the unsaturated acid metal salt (R) is 50 parts by mass or greater with respect to 100 parts by mass of a total content of the unsaturated acid metal salt (R) and the photopolymerizable compound (B).

A photocurable composition including metal oxide nanoparticles, a component (R) which is an unsaturated acid metal salt, a photopolymerizable compound excluding a compound corresponding to the component (R), and a photoradical polymerization initiator.

A photocurable composition including metal oxide nanoparticles, a component (R) which is an unsaturated acid metal salt, a photopolymerizable compound excluding a compound corresponding to the component (R), and a photoradical polymerization initiator.

A first object of the present invention is to provide a composition having excellent coatability. In addition, a second object of the present invention is to provide a composition, a transfer film, a manufacturing method for a laminate, a manufacturing method for a circuit wire, and an electronic device, which are related to the composition.

A composition of the present invention includes a compound A having one or more specific structures selected from the group consisting of (a), (b), and (c), and a resin. (a) a perfluoroalkenyl group, (b) a perfluoropolyether group, and (c) a group represented by General Formula (C1) or General Formula (C2),

*—Cm.sup.+Am.sup.−[-L.sup.m-(Rf).sub.m2].sub.m1  (C1)

*-An.sup.−Cn.sup.+[-L.sup.n-(Rf).sub.n2].sub.n1  (C2)

A first object of the present invention is to provide a composition having excellent coatability. In addition, a second object of the present invention is to provide a composition, a transfer film, a manufacturing method for a laminate, a manufacturing method for a circuit wire, and an electronic device, which are related to the composition.

A composition of the present invention includes a compound A having one or more specific structures selected from the group consisting of (a), (b), and (c), and a resin. (a) a perfluoroalkenyl group, (b) a perfluoropolyether group, and (c) a group represented by General Formula (C1) or General Formula (C2),

*—Cm.sup.+Am.sup.−[-L.sup.m-(Rf).sub.m2].sub.m1  (C1)

*-An.sup.−Cn.sup.+[-L.sup.n-(Rf).sub.n2].sub.n1  (C2)

The present application relates to a method for preparing an organic electronic device, and the organic electronic device prepared by the same, the method for preparing an organic electronic device can improve flatness and adhesion of an organic layer in a process of sealing an organic electronic element to effectively block moisture or oxygen from the outside, thereby securing the lifetime of the organic electronic device.

The present application relates to a method for preparing an organic electronic device, and the organic electronic device prepared by the same, the method for preparing an organic electronic device can improve flatness and adhesion of an organic layer in a process of sealing an organic electronic element to effectively block moisture or oxygen from the outside, thereby securing the lifetime of the organic electronic device.