Modeling material formulations and formulation systems usable in additive manufacturing of a three-dimensional object, featuring, when hardened, a Shore A hardness lower than 10 and/or a Shore 00 hardness lower than 40, are provided. Additive manufacturing processes utilizing these formulations and formulation systems, and three-dimensional objects obtainable thereby, are also provided.

To provide a negative type photosensitive composition which is capable of forming a cured film having good light shielding properties and high reflectance. [Means for Solution] A negative type photosensitive composition comprising an alkali-soluble resin having a particular structure, a reflectance modifier, a polymerization initiator, and a solvent.

For example, a thin film which has a high refractive index and which it is possible to form a fine pattern can be obtained by using a composition that contains a triazine-ring-containing polymer that includes a repeating unit structure represented by formula [5].

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The present invention provides a transfer film in which a pattern appearance defect is unlikely to occur, a manufacturing method for a laminate, a manufacturing method for a circuit wire, and a manufacturing method for an electronic device. The transfer film of the present invention includes a temporary support a resin composition layer disposed on the temporary support, in which the resin composition layer contains a resin, and at least one compound selected from the group consisting of a block copolymer, which contains a block consisting of a constitutional unit X having a group represented by Formula (A) or a group represented by Formula (B) and a block a constitutional unit Y having a poly(oxyalkylene) group, and a compound represented by Formula (1).

A compound represented by specific chemical formula, a core including the same, and core-shell dye including a shell surrounding the core, a photosensitive resin composition including the same, and a color filter manufactured using the photosensitive resin composition are disclosed.

A compound represented by specific chemical formula, a core including the same, and core-shell dye including a shell surrounding the core, a photosensitive resin composition including the same, and a color filter manufactured using the photosensitive resin composition are disclosed.

The present specification provides a compound, a photoresist composition comprising the same, a photoresist pattern comprising the same, and a method for preparing a photoresist pattern.

The present specification provides a compound, a photoresist composition comprising the same, a photoresist pattern comprising the same, and a method for preparing a photoresist pattern.

In order to provide (A) a photosensitive resin composition which (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing so as to have photosensitivity, (iii) prepares a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) has small warpage after being cured, (B) a resin film, (C) an insulating film, and (D) an printed wiring board provided with an insulating film, the photosensitive resin composition containing at least (A) binder polymer; (B) cross-linked polymer particles, whose polymer has a urethane bond in its molecule; (C) thermosetting resin; and (D) photo-polymerization initiator is used.

In order to provide (A) a photosensitive resin composition which (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing so as to have photosensitivity, (iii) prepares a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) has small warpage after being cured, (B) a resin film, (C) an insulating film, and (D) an printed wiring board provided with an insulating film, the photosensitive resin composition containing at least (A) binder polymer; (B) cross-linked polymer particles, whose polymer has a urethane bond in its molecule; (C) thermosetting resin; and (D) photo-polymerization initiator is used.