The present invention is a polymer containing: a structural unit of general formula (1) and/or (2); and a structural unit of general formula (3) and/or (4), where X.sub.1 represents a tetravalent organic group, R.sub.1 to R.sub.4 each represent a monovalent organic group or a hydrogen atom, provided that at least one is a monovalent organic group, L represents a divalent organic group or a divalent atom, X.sub.2 represents a divalent organic group, X.sub.3 represents a tetravalent organic group, s represents 0 or 1, Z represents a divalent bonding group, and X.sub.4 represents a divalent organic group. This provides a polymer soluble in an aqueous alkaline solution and usable as a base resin for positive and negative photosensitive resin compositions which enable fine pattern formation, provide high resolution, and have excellent mechanical characteristics even when cured at low temperatures.

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Provided is a method to prevent interference between electrodes that causes pixel defects in a pixel defining layer, thereby lowering the touch defect rate of the panel, and implementing a coloring pattern with high optical density on the electrode substrate to not only make the colors vivid but also increase the reliability and lifespan of the display, particularly a composition and a method for forming a pixel defining layer pattern, which comprises a colorant, and the coating film formed by treating at high temperature during post-baking treatment has a high optical density (OD) per thickness, has a low permittivity of 5.0 or less even with changes in measured Hz, and can improve visibility and contrast.

A wafer end protective-film forming composition for semiconductor manufacturing including: a polymer or compound having a crosslinkable group, and a solvent, wherein the solvent contains a first solvent and a second solvent, and when an evaporation rate of n-butyl acetate is 1, an evaporation rate of the first solvent is 0.10 or more and an evaporation rate of the second solvent is 0.05 or less.

A photosensitive resin composition for flexographic printing includes components (A) to (E) below: (A) a first styrene-butadiene-styrene block copolymer (SBS); (B) a second styrene-butadiene-styrene block copolymer (SBS); (C) a polybutadiene or a derivative thereof; (D) a photopolymerizable monomer; and (E) a photopolymerization initiator, and comprises with respect to (A), 5 to 100 wt % of (B), 10 to 40 wt % of (C), 40 to 200 wt % of (D), and 4 to 20 wt % of (E).

Provided is a photosensitive resin composition that contains: (A) a silicone resin containing an acid-crosslinkable group; (B) an epoxy compound represented by formula (B); and (C) a photoacid generator.

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(In the formula, R.sup.51-R.sup.55 each independently represent a hydrogen atom or a saturated hydrocarbyl group having 1-6 carbon atoms.)

A photosensitive resin composition, a photosensitive resin layer manufactured utilizing the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are provided. The photosensitive resin composition includes: (A) at least one resin selected from among a polyimide precursor and a polybenzoxazole precursor; (B) a photopolymerizable compound; (C) a photoinitiator represented by Chemical Formula 1; and (D) a solvent.

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A photosensitive resin composition including a polymer resin having a refractive index of greater than or equal to about 1.66; a photopolymerizable monomer; a photopolymerization initiator; and a solvent, wherein the polymer resin has a repeating structural unit, and the structural unit includes a moiety derived from an acid dianhydride.

Photoresist compositions may include a photosensitive polymer including a first repeating unit of Chemical Formula 1; a photoacid generator (PAG); and a solvent. ##STR00001##

A photoresist composition is provided. The photoresist composition includes a photosensitive polymer, a photoacid generator, and a solvent. The photosensitive polymer can include a first main chain group, a second main chain group, and an acid-dissociative group attached to the first main chain group, and at least one of the first main chain group or the second main chain group comprises an acid-dissociative functional group which is cleaved between the first main chain group and the second main chain group and between the first main chain group and the acid-dissociative group under presence of an acid catalyst.

A compound represented by General Formula (M1) below is provided. In Formula (M1), Y is a linear or branched alkyl group having 1 to 10 carbon atoms, a polymerizable group-containing group, or a group represented by [SiX.sub.3Y.sup.11*]. Y.sup.11 is a linear or branched alkylene group having 1 to 4 carbon atoms, X is a halogen atom or an alkoxy group, and * is a bonding site to an N atom. R.sup.1 is a hydrogen atom or a methyl group. R.sup.2 is a hydrogen atom or a alkyl group having 1 to 6 carbon atoms. R.sup.3 and R.sup.4 each independently represents a alkyl group having 1 to 3 carbon atoms or a fluoroalkyl group. n=2.

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