The present invention provides a composition for forming an underlayer film, with which an underlayer film having excellent surface flatness and solvent resistance can be formed. In addition, the present invention provides a resist pattern forming method and a manufacturing method of an electronic device, which are related to the composition for forming an underlayer film. The composition for forming an underlayer film according to the present invention is a composition for forming an underlayer film, which is used for forming an underlayer film under a resist film, including a monomer or a polymer containing an aromatic ring and a halogen-based organic solvent, in which a content of the halogen-based organic solvent is 0.001 to 50 ppm by mass with respect to a total mass of the composition for forming an underlayer film.

The invention relates to: a photosensitive resin composition containing: (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, (B) an epoxy resin, and (C) an active ester compound, and a method for producing it, a photosensitive resin film using the photosensitive resin composition, a multilayer printed wiring board and a method for producing it, and a semiconductor package.

A negative type photosensitive resin composition containing an epoxy group-containing resin; a metal oxide; and a cationic polymerization initiator (I). The cationic polymerization initiator (I) contains one or more of a compound represented by Formula (I1) and a compound represented by Formula (I2). In Formula (I1), R.sup.b01 to R.sup.b04 represent an aryl group which may have a substituent or a fluorine atom. In Formula (I2), R.sup.b05 represents a fluorinated alkyl group which may have a substituent or a fluorine atom. A plurality of R.sup.b05's may be the same as or different from one another. q represents an integer of 1 or greater, and Q.sup.q+'s each independently represent a q-valent organic cation. ##STR00001##

A method for producing a laminate of a cured material from a photosensitive resin composition (1) and a photosensitive resin composition (2), wherein the method includes a step of obtaining a laminated material by laminating the composition (2) onto the composition (1); a step of subjecting the laminated material to photoexposure to obtain a photocured material; a step of developing the photocured material to obtain a developed material; and a step of heating the developed material to obtain a laminate, wherein the photoexposure dose required to cure the composition (2) is smaller than the dose required to cure the composition (1), and wherein the composition (1) contains an epoxy resin (1) having a weight-average molecular weight Mw of 5,000 to 600,000, a softening point of at least 140° C., and an epoxy equivalent weight of not more than 2,300.

A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 μm, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.

A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.

The present disclosure provides a photosensitive dry film enabling a photocured film being excellent in insulation reliability and resolution and having a frosted appearance to be obtained. A photosensitive dry film including a support film having a first main surface and a second main surface opposite to the first main surface, and a photosensitive resin layer provided on the first main surface, in which the first main surface has an irregular surface formed by chemical etching.

Microcapsules including a polymeric shell and an internal phase including a non-photopolymerizable reactive diluent are provided for use in microcapsule imaging sheets. Imaging sheets including microcapsules which include a non-photopolymerizable reactive diluent, and which exhibit improvements in color development (Dmax), discoloration (yellowing) resistance, mechanical properties (e.g., peel strength), and temperature latitude of imaging sheets including leuco dyes.

A method for making three dimensional structures using photolithography and an adhesively bondable material is disclosed. A thiol-ene-epoxy (OSTE(−)) material undergoes a first reaction upon partial irradiation in a pattern to become a partially cross-linked polymer network. Non-cross-linked parts are dissolved in a solvent and removed. An initiator is added to activate the cross-linked polymer network so that it becomes adhesive and can then be covalently bound to another object to form an article. The method can be utilized to manufacture an article with a complicated three dimensional shape in an easy way.

The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resin composition is configured such that: 30% by mass or more of the epoxy resin (A) is an epoxy resin (A-1) that is represented by formula (1) (wherein each R moiety independently represents a glycidyl group or a hydrogen atom, and at least two R moieties among the plurality of R moieties are glycidyl groups; and a represents the average of the number of repeating units, which is a real number within the range of from 0 to 30); and the compound (B) that has a phenolic hydroxyl group and the cationic photopolymerization initiator (C) have specific structures.

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