A three-dimensional (3D) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first layer devoid of a hydrophobicity agent and (b) at least a second layer comprising the hydrophobicity agent. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material.

Provided is a composition for optical stereolithography, which is photo-curable within a shorter time, and is excellent in mechanical properties after photo-curing. Specifically, provided is a composition for optical stereolithography containing (A) a cationic polymerizable epoxy resin that is a novolac epoxy resin and/or an epoxy resin having a predetermined structure; (B) a cationic polymerizable compound being other than the component (A) and having a glycidyl ether structure; (C) a radical polymerizable compound having a methacrylic group and/or an acrylic group; (D) a styrene-containing copolymer resin that is a copolymer resin of styrene and predetermined maleic anhydride and/or a copolymer resin of styrene and methacrylic acid or acrylic acid; (E) a cationic polymerization initiator that is a sulfonium compound or a bis(alkylphenyl)iodonium compound; (F) a radical polymerization initiator; and (G) a sensitizer.

Provided is a photosensitive resin composition that contains (A) a photobase generator and (B) an alkali-soluble epoxy compound, wherein the photobase generator (A) contains a compound represented by formula (2-1): ##STR00001##
and the alkali-soluble epoxy compound (B) is an epoxy compound obtained by reacting (c) a polybasic acid anhydride with a product of a reaction between (a) an epoxy compound having two or more epoxy groups in the molecule and (b) a compound having one or more hydroxyl groups and one carboxyl group in the molecule.

The purpose of the present invention is to provide: a novel compound which can generate a base and radical upon the irradiation with an active energy ray; a photopolymerization initiator which comprises the novel compound; and a photosensitive resin composition which contains the photopolymerization initiator, has high sensitivity and excellent storage stability, and can be formed into a cured article that does not have a metal-corrosive property. The novel compound is represented by formula (1):

##STR00001## (wherein R.sub.1 to R.sub.6 independently represent a hydrogen atom, a hydroxy group, an alkoxy group, an organic group other than the aforementioned substituents, or the like; X represents a residue having a structure such that n hydrogen atoms are removed from a saturated hydrocarbon containing a ring structure; and n represents an integer of 1 to 6).

A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an -hydroxy alkylphenone-based photopolymerization initiator. ##STR00001##

A photosensitive resin composition is provided. The photosensitive resin composition includes a first binder resin and a second binder resin that have a weight average molecular weight of about 7,000 g/mol to about 12,000 g/mol, and an electronic apparatus including a cured product of a pattern-forming composition including the photosensitive resin composition.

Disclosed are a polycarboxylate compound represented by Formula 1 below, a resist composition including the same, and a method of forming a pattern using the same.

##STR00001##

In Formula 1, A.sub.11, X.sub.11, m11, n11, R.sub.13 and b13 are as described in the specification.

A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1).

##STR00001##

A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first -hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25 C., and a second -hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25 C.

Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.