The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1),

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wherein X.sub.1 represents a tetravalent organic group; and R.sub.1 represents a group shown by the following general formula (2),

Y.sub.1.sub.nRf).sub.k (2)

wherein the dotted line represents a bond; Y.sub.1 represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); k represents 1, 2, or 3; and n represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition.

A resist underlayer film-forming composition has excellent embedding and flattening properties for stepped substrates, excellent storage stability, low film-curing start temperature and small amount of sublimate generation, and can form a film that does not dissolve in photoresist solvents. The composition contains: a thermal acid generator; a Novolac resin polymer in which (i) a unit structure having an aromatic ring optionally having a substituent and (ii) a unit structure containing an aromatic cyclic organic group optionally having a substituent, a non-aromatic monocyclic organic group optionally having a substituent, or a 4to 25-membered bicyclic, tricyclic, or tetracyclic organic group containing at least one non-aromatic monocyclic ring and optionally having a substituent are bonded via a covalent bond between carbon atoms on the aromatic ring of (i) and the non-aromatic monocyclic ring of (ii); and a solvent.

Provided is a method to ensure vivid colors and to increase display reliability and lifespan by creating one or more layers through one-time process of performing coating, prebaking, exposure, development, post-exposure, and post-heat treatment and thus implementing a coloring pattern capable of reducing the process time on the electrode substrate, wherein the method unifies the processes of two layers of the PDL and CS layers of the organic light emitting diode panel into one by including the colorant according to the present disclosure, and shortens the process time by adjusting the UV active ray transmittance of the photomask to three sections of 0% (non-exposed portion), 20 to 50% (Half-tone), and 100% (Full-tone) in order to create a step height in the pattern after the development process is completed and thus forming two layers at once.

There are provided a photosensitive resin composition which can be applied to either a projection exposure or direct-write exposure machine without fine adjustment of the composition, and can form a resist pattern having an excellent cross-sectional shape in which an undercut in which the bottom portion of the resist pattern is hollowed and omission of the top of the resist pattern are less likely to occur, and a line width of an intermediate portion (central portion) and a deepest portion (bottom portion) in the depth direction of the cross section of the resist pattern is less likely to be larger than a line width of the surface portion (that is, linearity in the depth direction of the resist pattern contour is favorable), and which has excellent insulation reliability and crack resistance reliability, and a dry film using the same, a printed wiring board, and a printed wiring board manufacturing method. The photosensitive resin composition includes an acid-modified vinyl group-containing epoxy resin (A), a photopolymerization initiator (B), a photopolymerization sensitizer including a benzophenone compound (C), and a photopolymerizable compound (D).

A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first -hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25 C., and a second -hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25 C.

A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an -hydroxy alkylphenone-based photopolymerization initiator.

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A photocurable composition including an acrylic resin, an epoxy group-containing compound (excluding a component corresponding to the acrylic resin), and a cationic polymerization initiator. The acrylic resin has a glass transition point of 0 C. or lower. In such a photocurable composition, a cured film obtained by curing the photocurable composition has an elastic modulus of 2.010.sup.6 [Pa] or greater and 1.010.sup.9 [Pa] or less at a temperature of 80 C. when the viscoelasticity of the cured film is measured at a frequency of 1 Hz.

A photosensitive negative resin composition including (a) an epoxy-group-containing compound, (b) a first onium salt including a cation moiety structure represented by formula (b1) and an anion moiety structure represented by formula (b2), and (c) a second onium salt including a cation moiety structure represented by formula (c1) and an anion moiety structure represented by formula (c2). ##STR00001##

A structured composite surface includes a backing layer and a plurality of composite posts in contact with the backing layer, each composite post having a core made of a first material and an outer shell made of a second material, the outer shell is in contact with and surrounding the core, the core has a Young's modulus of at least 50 times greater than the outer shell. A method of transfer printing includes pressing a stamp including at least one composite post to a substrate, the at least one composite post having a core made of a first material and an outer shell made of a second material, the outer shell is in contact with and surrounding the core, the core has a Young's modulus at least 50 times greater than the outer shell, and retracting the stamp from the substrate by applying a shear load to the stamp.

The present disclosure provides a photosensitive dry film enabling a photocured film being excellent in insulation reliability and resolution and having a frosted appearance to be obtained. A photosensitive dry film including a support film having a first main surface and a second main surface opposite to the first main surface, and a photosensitive resin layer provided on the first main surface, in which the first main surface has an irregular surface formed by chemical etching.