There are provided a photosensitive resin composition containing at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, a compound having a sulfurous ester structure, and a photoradical polymerization initiator, and satisfies at least one of the following conditions 1, . . . , or 3; a pattern forming method using a photosensitive film formed from the photosensitive resin composition; a cured film formed from the photosensitive resin composition; a laminate including the cured film; and a device having the cured film or the laminate. the condition 1: the precursor contains a radically polymerizable group, the condition 2: the compound having a sulfurous ester structure contains a radically polymerizable group, and the condition 3: the photosensitive resin composition further contains a compound containing a radically polymerizable group, other than the precursor and the compound having a sulfurous ester structure.

There is provided a pattern forming method that includes an exposure step of exposing a photosensitive film to laser light; and a development step of developing the photosensitive film after the exposure to obtain a pattern, where the photosensitive film contains at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, and an onium salt.

Provided are a negative photosensitive resin composition and a method for forming a cured relief pattern using the same with which a high chemical resistance and resolution can be obtained and in which the occurrence of voids in the interface of a Cu layer contacting a resin layer after high-temperature storage evaluation can be suppressed. Provided is a negative photosensitive resin composition including (A) a polyimide precursor represented by general formula (1) below; (B) a compound having at least one selected from a urethane bond and a urea bond; and (C) a photopolymerization initiator. In the formula, X.sub.1, Y.sub.1, n.sub.1, R.sub.1, and R.sub.2 are each as defined in the description of the present application.

##STR00001##

A high-quality photosensitive resin composition is disclosed which not only exhibits a reduced adhesion of dust, dirt, and paper powder to a relief and a good resistance to a UV ink but also allows a storage of a printing original plate for a long period of time, even if this plate is a plate in a low hardness to be used for a flexographic printing. A water-developable photosensitive resin composition for flexographic printing contains at least a polyamide and/or a polyamide block copolymer (a), a cross-linking agent having one or more unsaturated group(s) (b), a photo-polymerization initiator (c), and a fatty acid ester (d), wherein the fatty acid ester (d) has two or more hydroxyl groups and 11 to 23 carbon atoms in a molecule, and wherein a content of the fatty acid ester (d) in the photosensitive resin composition is 0.2 to 6% by weight.

An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape after development, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a negative photosensitive resin composition that forms the film. The negative photosensitive resin composition contains an (A) alkali-soluble resin, a (C1) photo initiator, and a (Da) black colorant, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of a (A1-1) polyimide, a (A1-2) polyimide precursor, a (A1-3) polybenzoxazole, and a (A1-4) polybenzoxazole precursor, and has a structural unit having a fluorine atom at a specific ratio, and the (C1) photo initiator contains an (C1-1) oxime ester-based photo initiator that has a specific structure.

Provided is a photosensitive resin composition containing; (A) a polymer having an acidic functional group or a substituent derived therefrom; (B) a photoreactive compound; (C) a solvent; and (D) a nitrogen-containing aromatic compound represented by the following general formula (1). ##STR00001##

A photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E.sub.2) having a phenolic hydroxyl group indicating an acid dissociation constant pKa of 6.0 to 9.5 at 25° C.; or a photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E) having a phenolic hydroxyl group other than (D); wherein the compound (E) having a phenolic hydroxyl group other than (D) contains a compound (E.sub.1) having an electron-withdrawing group and a phenolic hydroxyl group in the molecule. Provided is a photosensitive resin composition whose cured film has high bending resistance even after a reliability test, and also has excellent chemical resistance.

The present invention provides a negative type photosensitive resin composition having high sensitivity, excellent halftone characteristics, capability to form a small tapered pattern shape, and alkali-developability. The negative type photosensitive resin composition includes, as an alkali-soluble resin (A), at least a weakly acidic group-containing resin (A1) and an unsaturated group-containing resin (A2), the weakly acidic group-containing resin (A1) containing an acidic group having an acid dissociation constant in the range of 13.0 to 23.0 in dimethyl sulfoxide, and the unsaturated group-containing resin (A2) containing an ethylenically unsaturated double bond group.

A narrow bezel display panel and preparation method thereof, and a narrow bezel display device, which can realize transformation between flexibility and rigidity of the base substrate by selecting a flexible photo-curable macromolecule resin material having high light transmittance and by a selective exposure process. A bending region of a base substrate is flexible, and can be bent to hide on a back surface of a base substrate to realize a narrow bezel of the panel; a plane region of the base substrate is rigid, and can remain a stable cell gap during bending.

The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) a filler selected from one or more of alumina, graphene, inorganic clay, silica, and zinc oxide and having a particle diameter ranging from 10 nm to 1.0 μm; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide;

##STR00001## wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.