The present specification relates to a compound represented by Chemical Formula 1, a photoresist fluorescent resin composition including the same, and a color conversion film, a backlight unit and a display apparatus manufactured using the same.

The present specification relates to a compound represented by Chemical Formula 1, a photoresist fluorescent resin composition including the same, and a color conversion film manufactured using the same, a backlight unit and a display apparatus.

A composition includes a near infrared absorbing pigment and a solvent, in which the near infrared absorbing pigment is at least one selected from a colorant compound which has a cation and an anion in the same molecule, a colorant compound which is a salt of a cationic chromophore and a counter anion, and a colorant compound which is a salt of an anionic chromophore and a counter cation, a D50 particle size in which a cumulative volume in a particle size distribution of particle sizes of the near infrared absorbing pigment is 50% is 100 nm or lower, and d values of Hansen solubility parameters of the near infrared absorbing pigment and the solvent satisfy a predetermined expression.

A composition for forming a resist underlayer film containing a hydrolysis condensate prepared through hydrolysis and condensation of a hydrolyzable silane, wherein the hydrolyzable silane contains a hydrolyzable silane of Formula (1):

R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4−(a+b)   Formula (1)

wherein R.sup.1 is an organic group having a primary amino group, a secondary amino group, or a tertiary amino group and is bonded to a silicon atom via an Si—C bond; R.sup.2 is an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, an acyloxyalkyl group, or an organic group having an acryloyl group, a methacryloyl group, a mercapto group, an amino group, an amide group, a hydroxyl group, an alkoxy group, an ester group, a sulfonyl group, or a cyano group, or any combination of these groups, and is bonded to a silicon atom via an Si—C bond; R.sup.1 and R.sup.2 are optionally bonded together to form a ring structure; R.sup.3 is an alkoxy group, an acyloxy group, or a halogen group; a is an integer of 1; b is an integer of 0 to 2; and a+b is an integer of 1 to 3; and the hydrolysis condensate contains an organic group having a salt structure formed between a counter anion derived from a nitric acid and a counter cation derived from a primary ammonium group, a secondary ammonium group, or a tertiary ammonium group.

An adhesion promoter as shown in Formula (I) and a photosensitive resin composition containing the adhesion promoter are disclosed:

##STR00001## where R.sub.1, R.sub.2 and R.sub.3 each refer to a hydrogen atom, an optionally substituted C.sub.1-C.sub.20 alkyl, an optionally substituted C.sub.2-C.sub.20 alkenyl, an optionally substituted C.sub.2-C.sub.20 alkynyl, an optionally substituted phenyl, or other optionally substituted carbon atom; A refers to an optionally substituted C.sub.1-C.sub.20 alkyl, an optionally substituted C.sub.2-C.sub.20 alkenyl, an optionally substituted C.sub.2-C.sub.20 alkynyl, an optionally substituted phenyl, or other an optionally substituted carbon atom substituents; and the carbon in the alkyl, the alkenyl, the alkynyl, the phenyl, or the carbon atom substituents is optionally substituted with one or more of N, O and S; and X refers to an optionally substituted aromatic heterocyclic group. The adhesion promoter and the photosensitive resin composition can be used for manufacturing a semiconductor integrated circuit (IC), a LED and a flat-panel display.

[Object] To provide a negative type photosensitive composition developable with a low concentration alkali developer and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability; and further to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: (I) an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit, (II) a polysiloxane, (III) a compound having two or more (meth)acryloyloxy groups, (IV) (i) a silicone derivative having a particular structure and/or (ii) a compound having two or more epoxy groups, (V) a polymerization initiator, and (VI) a solvent.

A single layer process is utilized to reduce swing effect interference and reflection during imaging of a photoresist. An anti-reflective additive is added to a photoresist, wherein the anti-reflective additive has a dye portion and a reactive portion. Upon dispensing the reactive portion will react with underlying structures to form an anti-reflective coating between the underlying structure and a remainder of the photoresist. During imaging, the anti-reflective coating will either absorb the energy, preventing it from being reflected, or else modify the optical path of reflection, thereby helping to reduce interference caused by the reflected energy.

A fabricating method of reducing photoresist footing includes providing a silicon nitride layer. Later, a fluorination process is performed to graft fluoride ions onto a top surface of the silicon nitride layer. After the fluorination process, a photoresist is formed to contact the top surface of the silicon nitride layer. Finally, the photoresist is patterned to remove at least part of the photoresist contacting the silicon nitride layer.

An adhesion promoter composition comprising at least one of the following compounds: (a) a cyclic compound having the formula: ##STR00001##
(b) a non-cyclic compound having the formula: ##STR00002##
wherein R.sub.1 and R.sub.2 each independently represents a non-photoactive phenyl, a photoactive phenyl or a C.sub.1-C.sub.4 alkyl; R.sub.3 represents a non-photoactive phenyl; R.sub.4 represents a photoactive phenyl; W represents Si or Ge; n represents an integer of value greater than 1;
m represents an integer between 0 and 1.

Some of the resin compositions are ultraviolet light or thermally curable, while others are ultraviolet light curable. One example of the ultraviolet light or thermally curable resin composition consists of a predetermined mass ratio of a (meth)acrylate cyclosiloxane monomer and a non-siloxane (meth)acrylate based monomer ranging from about >0:<100 to about 80:20; from 0 mass % to about 10 mass %, based on a total solids content of the resin composition, of an initiator selected from the group consisting of an azo-initiator, an acetophenone, a phosphine oxide, a brominated aromatic acrylate, and a dithiocarbamate; a surface additive; and a solvent.