The present invention provides an illumination optical system for illuminating an object, comprising: a first light-transmissive member and a second light-transmissive member, and a control unit configured to control drive of the first light-transmissive member and the second light-transmissive member, therein, while the control unit drives the first light-transmissive member such that an incident angle of light to the first light-transmissive member increases, the control unit drives the second light-transmissive member such that the incident angle of light to the second light-transmissive member decreases, thereby changing the intensity of the light exiting from the illumination optical system.

A method and apparatus for measurement of density of a photosensitive printing plate (130) having a mask (132) embodying image information corresponding to an image to be printed. A density measurement system includes a first radiation source (112) spaced apart from and adjacent the plate and configured to emit radiation having a first wavelength or range of wavelengths toward the plate. A densitometer (110) spaced apart from and adjacent the plate in a fixed relationship relative to the first radiation source receives and measures an amount of the first radiation transmitted through or reflected by the plate and the mask during relative movement between the plate and the density measurement system. The densitometer readings are processed to provide an output correlating to quality of the mask. The density measurement system may be coupled to an exposure system (120,122,124) for curing the plate.

A mask includes a first region and a second region. The first region includes a first light-shielding strip and a second light-shielding strip, the second region includes a third light-shielding strip, the first light-shielding strip, the second light-shielding strip is located between the first light-shielding strip and the third light-shielding strip, the first light-shielding strip, the second light-shielding strip and the third light-shielding strip are configured to shield light and bound spaces, and the spaces are configured in such a manner that light is allowed to pass through the spaces. A width of the first light-shielding strip in a first direction is larger than a width of the second light-shielding strip in the first direction, and the width of the second light-shielding strip in the first direction is larger than a width of the third light-shielding strip in the first direction.

A light irradiation device for an exposure apparatus allowing implementation of photo-alignment process with a simple configuration is provided. The light irradiation device is configured using a light source with a plurality of LEDs, and a polarizing element that receives light from the light source and applies the light transmitted through the polarizing element to a workpiece. An optical axis of each of the LEDs is set in such a manner as to have a first angle θ1 to the workpiece. A second angle θ2 as an angle half of a light distribution angle of the light emitted from each of the LEDs is set smaller than the first angle θ1.

A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.

A method for forming a mask pattern is provided, comprising forming a negative photoresist on a substrate; in an environment without oxygen, to performing a first exposure on the negative photoresist by use of a first ordinary mask plate, so that a fully-cured portion of the negative photoresist is exposed to light and a semi-cured portion and a removed portion of the negative photoresist are not exposed to light; in an environment with oxygen, performing a second exposure on the negative photoresist by use of a second ordinary mask plate, so that the semi-cured portion of the negative photoresist is exposed to light and the removed portion of the negative photoresist not exposed to light; removing the uncured negative photoresist and forming the mask pattern.

An array of ultraviolet light emitting diodes can cure ultraviolet curable material, such as solder mask or ink, that has been applied to a substrate in connection with fabricating electronic circuit devices. The substrate can be placed in a housing associated with a processing station of a manufacturing operation. A mask or stencil can be positioned adjacent the substrate. The ultraviolet curable material can be applied to the substrate via the mask or stencil, for example using a squeegee. The ultraviolet light emitting diodes can be moved over the substrate to cure the ultraviolet curable material. The substrate with the cured material can be removed from the housing.

A synthetic paper is manufactured with a method comprising the steps of: a) providing at least two types of pho to-polymerizable monomers, b) exposing the volume to a three-dimensional light pattern to induce a polymerization reaction, and c) removing uncured monomer to create an open microstructure. The volume comprises at least one monomer comprising at least two thiol groups and at least one monomer comprising at least two carbon-carbon double bonds, where the ratio (r.sub.1) between the number of thiol groups and the number of carbon-carbon double bonds fulfils one of: 0.5≦r1≦0.9 and 1.1≦r1≦2. One advantage is that off stoichiometry creates an edge effect giving better defined boundaries between exposed and unexposed parts in the volume and giving a possibility to create thinner micro pillars. Another advantage is that it is easy to bind molecules to the surface to obtain desired surface properties.

Embodiments of the present invention provide a roll-to-roll exposure system having a reference mark array and alignment scope units for precisely measuring the position and orientation of an object on a flexible multilayered circuit film. A roll-to-roll exposure system according to an exemplary embodiment of the present invention includes: a plurality of rolls configured to move a flexible multilayered circuit film having an object positioned thereon; alignment scope units positioned so as to be spaced apart from each other and proximate to the rolls; and at least one exposure unit positioned so as to be spaced proximate to the rolls and spaced apart from sides of the alignment scope units, in which one of the rolls has a reference mark array on its surface.

A system and a method of producing sub-millimeter scale particles are provided herein. The method includes providing a substrate that has a layer of photosensitive material thereon; exposing a portion of the layer to a structured beam of light that has a cross-sectional shape, and a cross-sectional size. The cross-sectional size of the structured beam of light at the layer of photosensitive material is smaller than a sub-millimeter scale particle. The method also includes moving the substrate or the beam of light relative to each other to follow a path for making additional exposures or continuous exposure to result in a discrete exposed pattern in the layer that corresponds to the particle being produced, and exposing the layer to the light; and processing the layer to remove unexposed material around the discrete exposed pattern and to separate the discrete exposed pattern from the layer to provide the sub-millimeter scale particle.