An apparatus is provided configured to manufacture an article using a multi-layer/laminated photoresist comprising a plurality of layers of photoresist material, where at least a first layer of photoresist material has a first sensitivity to radiation, and at least a second layer of photoresist material has a different sensitivity to radiation. The apparatus comprises: a. a housing configured to receive the photoresist and locate the photoresist in at least one operational position in the housing; b. an exposure system configured to emit radiation which is incident on the photoresist when in the operational position; wherein: i. the exposure system is configured to emit radiation having a first radiation characteristic to induce a change in one or more properties of the area(s) of the first layer of photoresist material exposed to the radiation; and wherein ii. the first radiation characteristic is configured not to induce a change, or to induce a different change, in one or more properties of at least a different one of the layers of photoresist material. Consequently complex articles can be manufactured including hidden or partially visible features, such as overhangs for example.

A method for fabricating a nano-structure includes: providing a phase mask having an uneven lattice structure to contact a photoresist film; exposing the photoresist film to a light through the phase mask such that the light is obliquely incident on a surface of the photoresist film; and developing the photoresist film to form a nano-structure.

Systems and methods for exposing photopolymer printing plate material located within a target area having first and second dimensions. A light source having LEDs arrayed coextensive with the first dimension moves relative to the second dimension, and emits different light intensities over the target area in at least one of the first dimension or the second dimension. The systems and methods may be used to determine exposure parameters for curing a selected plate by causing different sample units to receive different amounts of total energy exposure, exposure energy per exposure step, or a combination thereof, and visually evaluating each sample unit against a reference plate of the same type and thickness. The sample unit embodying a minimum acceptable total exposure energy and a maximum acceptable exposure energy per exposure step is then identified.

A prism rotation adjustment mechanism, a photolithographic exposure system and a photolithography tool are disclosed. The prism rotation adjustment mechanism includes a frame (200), a flexible mechanism (100) and an actuation mechanism. The flexible mechanism (100) includes a fixing component (110), an actuating component (120), a connecting component (130) and a swinging component (140) that are flexibly articulated in a sequence. The fixing component (110) is fixed to the frame (200). The actuation mechanism is fixed to the frame (200) and coupled to the actuating component (120). On the swinging component (140) are secured a prism wherein an axis of articulation between the swinging component (140) and the fixing component (110) is in correspondence with a rotational center of the prism. The flexible mechanism of the prism rotation adjustment mechanism is a quadrilateral flexibly-articulated assembly, in which, when driven by the actuation mechanism, the actuating component can convert translational movement into rotational movement, allowing the control of the rotational movement to be more accurate and hence improving the rotational control accuracy of the prisms. Moreover, the axis of articulation between the swinging component and the fixing component provides a stable axis for the prisms to rotate thereabout, avoiding crosstalk during the rotation and hence additionally improving the prism rotation control accuracy.

Disclosed are systems and methods for achieving sub-diffraction limit resolutions for fabrication of integrated circuits using multiphoton lithography. In one embodiment, a photolithography system is disclosed. The system includes a light source, which can generate and emit laser beams at various wavelengths; a reflector configured to receive the laser beams and focus the laser beams on a condensing lens; a scattering medium, configured to receive the laser beams and generate scattered laser beams; and a wave-front shaping module, configured to receive the scattered laser beams and generate a focused laser beam in a photoresist material deposited on a silicon wafer.

Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example system may include an optical component configured to direct light from a light source to illuminate a photoresist material at a desired angle and to expose at least a portion of an angled structure in the photoresist material, where the photoresist material overlays at least a portion of a top surface of a substrate. The optical component includes a container containing an light-coupling material that is selected based in part on the desired angle. The optical component also includes a mirror arranged to reflect at least a portion of the light to illuminate the photoresist material at the desired angle.

The present disclosure provides a mask, a layout, a lithography system and a lithography process of the lithography system. The mask includes: a base which is transparent to exposure light; and a light-shielding film covering a part of a bottom surface of the base, wherein the light-shielding film forms a main pattern and an assistant pattern, the main pattern is light-shielding to the exposure light and is transferable, and the assistant pattern is light-shielding to the exposure light and is not transferable. The present disclosure can ensure a normal transfer of the main pattern, and reduce light transmittance of the mask.

Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

A method of creating an image film negative capable of masking non-image areas of one or more layers of liquid photopolymer during a step of imagewise exposing the one or more layers of liquid photopolymer to actinic radiation. The method includes the steps of (a) providing an image film negative comprising a negative of an image on the image film negative, wherein the negative of the image comprises a pattern of opaque areas; and (b) inkjet printing a filtering layer on portions of the image film negative not covered by the pattern of opaque areas, wherein the portions of the image film negative comprise portions where it is desirable to modulate intensity of actinic radiation in a subsequent exposure step.

In one aspect, there is provided a method of creating a microstructure pattern on an exterior surface of an aircraft, boat, automobile or other vehicle is disclosed. A layer of photopolymer (44) is applied to the top coat or substrate (43) by nozzles (45). The photopolymer is selectively irradiated to activate its photoinitiator and the unirradiated polymer is removed. The irradiation can be via a mask (49) which does not come into contact with the polymer, or via a beam splitting arrangement (63, 64) or a diffraction grating (71). The pattern can be formed by either leaving the exposed photopolymer in situ, or using the exposed photopolymer to mask the substrate, etching the substrate, and then removing the exposed photopolymer. In another aspect, there is provided a method 1100 comprising the step 1102 of applying a layer of photocurable material to the exterior surface, the step 1104 of irradiating the photocurable material with radiation including a predetermined irradiation intensity profile, and the step 1106 of removing uncured photocurable material to form the microstructure pattern. The radiation initiates curing of the irradiated photocurable material, causing a curing depth profile across the layer of the photocurable material corresponding to the selected intensity profile.