Provided are a method for producing a laminate, including a step 1 of preparing a laminate precursor having a base material, a first transparent conductive portion, and a photosensitive composition layer in this order, a step 2 of pattern-exposing the photosensitive composition layer with scattered light from a side of the photosensitive composition layer opposite to a side on which the base material is provided, and a step 3 of developing the pattern-exposed photosensitive composition layer to form a patterned cured layer; and an application thereof.

Systems and processes for making a flexo plate, and plates made thereby. Non-printing indicia defined by areas of resence and absence of polymer in the plate floor are readable downstream of the washing or other non-cured-polymer-removal step but do not print in the printing step. The non-printing indicia may define a repeating pattern of alphanumeric characters, non-text graphics, or a combination thereof.

A representative method includes forming a photo-sensitive material over a substrate, and forming a cap layer over the photo-sensitive material, and patterning the cap layer. Using the patterned cap layer, a first portion of the photo-sensitive material is selectively exposed to a pre-selected light wavelength to change at least one material property of the first portion of the photo-sensitive material, while preventing a second portion of the photo-sensitive material from being exposed to the pre-selected light wavelength. One, but not both of the following steps is then conducted: removing the first portion of the photo-sensitive material and forming in its place a conductive element at least partially surrounded by the second portion of the photo-sensitive material, or removing the second portion of the photo-sensitive material and forming from the first portion of the photo-sensitive material a conductive element electrically connecting two or more portions of a circuit.

A polypeptide, a photoresist composition including the polypeptide, and a method of forming patterns by using the photoresist composition.

A fine metal mask includes a plate including a first and a second surfaces. The first surface has a first inner edge defining a first opening. The second surface has a second inner edge defining a second opening communicated with the first opening. The plate includes a first and a second curved surfaces respectively connecting the first surface inside the first opening and the second surface inside the second opening. The first and the second curved surfaces connect with a third inner edge defining a third opening smaller than the first and the second openings. The third inner edge includes a first straight edge, a second straight edge and a circular edge. The first and the second straight edges form an included angle. The circular edge has a radius smaller than or equal to 15 microns and connects between the first and the second straight edges.

Apparatus and method for exposing a printing plate having a photosensitive polymer to curing radiation. A plurality of light-emitting diodes (LEDs) are arranged in an array of columns and rows, including at least two, and more preferably at least three, different species, each species having a different center emission wavelength, preferably in the UV spectrum. The LEDs species are disposed adjacent one another in a repeating sequence. A controller connected to the array is configured to activate the array and to independently control each of the species to cause them to emit radiation towards the printing plate simultaneously with emissions patterns of adjacent members overlapping one another on the plate. A linear or planar source may comprise a plurality of independently controllable arrays.

Embodiments of this disclosure provide a photoresist structure, a patterned deposition layer, a semiconductor chip and a manufacturing method thereof According to the method for manufacturing a photoresist structure, a single photoresist is used, a second photoresist layer having an undercut can be obtained by only one development process using a single developing solution, and the size of the undercut can be controlled by the development time, thereby solving the problems such as difficulty in lift-off caused by adhesion of the deposited material to the sidewall of the photoresist structure in traditional lift-off processes.

A method for fabricating a nanoantenna array may include forming a resist layer on a substrate, forming a focusing layer having a dielectric microstructure array on the resist layer, diffusing light one-dimensionally in a specific direction by using a linear diffuser, forming an anisotropic pattern on the resist layer by illuminating the light diffused by the linear diffuser on the focusing layer and the resist layer, depositing a material suitable for a plasmonic resonance onto the substrate and the resist layer on which the pattern is formed, and forming a nanoantenna array on the substrate by removing the resist layer and the material deposited on the resist layer. A light diffusing angle by the linear diffuser and a size of the dielectric microstructure are determined based on an aspect ratio of the pattern to be formed.

A substrate having film type pattern and the manufacturing method, the substrate having film type pattern includes: a substrate; at least film type pattern layer which is allocated on the substrate; and a peripheral pattern layer which is allocated around the film type pattern layer.

A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.