Patent classifications
G03F7/2014
METHOD OF MAKING A PICOSCOPIC SCALE/ NANOSCOPIC SCALE CIRCUIT PATTERN
Provided is a method of making a circuit pattern. The method includes: Step (A): providing a master substrate comprising a first photosensitive layer containing photosensitive particles; Step (B): providing an energy beam to reduce metal ions in a predetermined area of the first photosensitive layer to form multiple first metal particles; Step (C): removing unreduced photosensitive particles by a fixer to obtain a master mask; wherein the first metal particles form a first predetermined pattern in the master mask; Step (D): providing a chip comprising a second photosensitive layer containing second photosensitive particles; Step (E): putting the master mask on the second photosensitive layer and providing an energy beam to reduce metal ions of an uncovered part of the second photosensitive layer to form multiple atomized second metal particles; Step (F): removing unreduced photosensitive particles by a fixer to obtain the circuit pattern having line spacing at picoscopic/nanoscopic scale.
Systems and Methods that Utilize Angled Photolithography for Manufacturing Light Guide Elements
Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example system may include an optical component configured to direct light from a light source to illuminate a photoresist material at a desired angle and to expose at least a portion of an angled structure in the photoresist material, where the photoresist material overlays at least a portion of a top surface of a substrate. The optical component includes a container containing an light-coupling material that is selected based in part on the desired angle. The optical component also includes a mirror arranged to reflect at least a portion of the light to illuminate the photoresist material at the desired angle.
THREE-DIMENSIONAL CROSSLINKER COMPOSITION AND METHOD OF MANUFACTURING ELECTRONIC DEVICES USING THE SAME
The inventive concept relates to a three-dimensional crosslinker composition and a method of manufacturing an electronic device using the same. According to the inventive concept, the three-dimensional crosslinker composition may be represented by Formula 1 below.
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FLEXOGRAPHIC PRINTING WITH REPEATING TILE INCLUDING DIFFERENT RANDOMNLY-POSITIONED FEATURE SHAPES
A method for fabricating a flexographic printing plate for printing image patterns including one or more uniform image regions includes defining a repeating tile having a plurality of different feature shapes positioned in a pattern of pseudo-random feature locations. A plate formation pattern corresponding to the image pattern is determined wherein the repeating tile is applied in a tiled arrangement to the uniform image regions. The plate formation pattern is used to form a flexographic printing plate, wherein regions of the flexographic printing plate corresponding to the uniform image regions of the image pattern include a pattern of raised features in positions corresponding to the feature positions in the repeating tile.
FLEXOGRAPHIC PRINTING WITH REPEATING TILE OF RANDOMNLY-POSITIONED FEATURE SHAPES
A method for fabricating a flexographic printing plate for printing image patterns including one or more uniform image regions includes defining a repeating tile having a pattern of feature shapes positioned at pseudo-random feature locations. A plate formation pattern corresponding to the image pattern is determined wherein the repeating tile is applied in a tiled arrangement to the uniform image regions. The plate formation pattern is used to form a flexographic printing plate, wherein regions of the flexographic printing plate corresponding to the uniform image regions of the image pattern include a pattern of raised features in positions corresponding to the feature positions in the repeating tile.
STRETCHABLE TRANSPARENCY-ADJUSTING FILM HAVING AN ORIENTATED HETEROGENEOUS INTERFACE, METHOD FOR MANUFACTURING THE SAME AND SMART WINDOW HAVING STRETCHABLE TRANSPARENCY-ADJUSTING FILM
A stretchable transparency-adjusting film includes an inner elastic part having a three-dimensional network shape and including a first elastomer, an inorganic thin film surrounding the inner elastic part, and an outer elastic part surrounding the inorganic thin film and including a second elastomer. A scattering unit defined by the inner elastic part, the inorganic thin film and the outer elastic part in a cross-section is orientated in an inclined direction to a vertical direction and a horizontal direction.
Method for producing substrate
The present application relates to a method for producing a substrate which includes a step of exposing and developing a photosensitive resin composition layer formed on a surface of a substrate base layer to produce spacers. The method for producing a substrate of the present application can uniformly form spacers having a height according to a desired cell gap and can also freely control the height of the spacers.
PHOTOSENSITIVE FIBER-FORMING COMPOSITION AND METHOD FOR FORMING FIBER PATTERN
A method for producing a metal pattern by processing a substrate having on its surface a metal layer with a photosensitive fiber having a specific composition, a method for producing a metal pattern, and a composition for producing the photosensitive fiber. The photosensitive fiber contains a positive photosensitive material. The positive photosensitive material may contain a novolac resin, etc. The method for producing a metal pattern includes a first step of forming a fiber layer of photosensitive resin on a substrate having on its surface a metal layer; a second step of exposing the fiber layer to light via a mask; a third step of developing the fiber layer with a developer to thereby form a photosensitive fiber pattern; and a fourth step of etching the metal layer with an etchant and removing the photosensitive fiber, to thereby form a network metal pattern.
METHOD FOR PREPARING INDIUM PILLAR SOLDER, CHIP SUBSTRATE AND CHIP
This disclosure discloses a method for preparing an indium pillar, a chip substrate and a chip. The method includes: applying a first photoresist layer on a substrate; applying a second photoresist layer on the first photoresist layer; covering a part of a surface of the second photoresist layer; underexposing the part of the second photoresist layer to obtain a processed second photoresist layer; developing and fixing the processed second photoresist layer to form an undercut structure; etching the first photoresist layer through the undercut structure to form an expose area; and depositing an indium material on the exposed area to form an indium pillar solder.
LITHOGRAPHIC PRINTING PLATE PRECURSORS AND METHOD OF USE
Lithographic printing plate precursors are prepared with a unique aluminum-containing substrate prepared using two separate anodizing processes to provide an inner aluminum oxide layer of average dry thickness (T.sub.i) of 300-3,000 nm and a multiplicity of inner micropores of average inner micropore diameter (D.sub.i) of ≤100 nm. An outer aluminum oxide layer is also provided to have a multiplicity of outer micropores of average outer micropore diameter (D.sub.o) of 15-30 nm and a dry thickness (T.sub.o) of 30-650 nm. A hydrophilic layer disposed on the outer aluminum oxide layer at 0.0002-0.1 g/m.sup.2 has at least a hydrophilic copolymer composed of (a) recurring units having an amide group and (b) recurring units comprising an —OM group directly connected to a phosphorus atom, wherein M represents a hydrogen, sodium, potassium, or aluminum atom.