A PFAS detoxification system 1 includes a concentrating device 11 configured to concentrate a resist waste liquid containing PFAS discharged from a lithography apparatus 111 of a semiconductor manufacturing apparatus 100. Further, the PFAS detoxification system 1 includes a sulfuric acid processing tub 12 configured to decompose and volatilize a concentrate concentrated by the concentrating device 11.

This invention relates to a composition comprising mineral spirits in combination with an alcohol or diisopropylbenzene or both, and methods directed to the preparation and use of this composition. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

The present invention has an object of providing a stepped wafer that can prevent a resist from remaining after development, and a method for manufacturing the stepped wafer. The stepped wafer according to the present invention is a stepped wafer having a step and whose main surface is thinner in a center portion and is thicker in an outer periphery. The step includes a curved surface with a radius of curvature ranging from 300 m to 1800 m.

This invention relates to a composition comprising mineral spirits in combination with an alcohol or diisopropylbenzene or both, and methods directed to the preparation and use of this composition. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

The purpose of the present invention is to provide a developing solution processing device and processing method that solve problems that accompany the occurrence of scum, improve product defect rate, increase the utilization ratio of manufacturing devices, and contribute considerably to reduced manufacturing costs and other factors through highly efficient recovery of noble metals. The present invention provides a developing solution processing device provided with: a centrifuge for separating a clarified liquid and a residue by centrifugally separating out developing solution after development processing; and a defoaming device for defoaming and discharging the clarified liquid.

Disclosed is a substrate treating apparatus that treats a substrate with processing liquids. The apparatus includes a substrate holder, an exterior cup, and an interior cup. The interior cup includes an interior cup body, and an interior cup outlet. The exterior cup includes an exterior cup body, an exterior bottom cup, a first drain outlet, a first exhaust port, a second drain outlet, a second exhaust port, and a separation partition. The apparatus further includes an annular member movable upwardly/downwardly, and a drive unit that causes the annular member to move to shift the interior cup body between a collecting position and a retracting position.

Devices, systems, and methods for conditioning a solvent return flow from a photolithographic process used for semiconductor processing are presented. Reuse of materials in semiconductor processing can provide environmental and manufacturing cost advantages. Devices for conditioning a solvent return flow from a photolithographic process and systems for photolithographic processes include a baffle system and a light system. Methods for reusing a solvent from a photolithographic process include passing the solvent through a conditioning device having a baffle system and a light system.

A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.

A method for removing photoresist comprising: depositing an oxide film on a base substrate on which photoresist has been formed; treating the oxide film by UV light; peeling off the oxide film; and removing the photoresist.

Provided are integrated processing equipment, including base, rotating device, and flow-guide device. The rotating device includes inclination-angle adjusting unit and rotating unit. The inclination-angle adjusting unit is arranged on the base, the rotating unit is connected with the inclination-angle adjusting unit, the rotating unit is used to carry the workpiece and can drive the workpiece to rotate around first axis, and the inclination-angle adjusting unit is used to drive the rotating unit to rotate around second axis at angle to the first axis. The flow-guide device includes frame body, liquid storage part and flow-guide part. The frame body is connected to the inclination-angle adjusting unit, both the liquid storage part and the flow-guide part are connected to the frame body, and the liquid storage part is used to transport the liquid to the flow-guide part, through which the liquid can flow to the workpiece positioned on the rotating unit.