G03F7/32

Photosensitive composition for EUV light, pattern forming method, and method for manufacturing electronic device

A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Requirements 1 to 3, Requirement 1: The A value determined by Formula (1) is 0.14 or more,
A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127)  Formula(1) Requirement 2: The concentration of solid contents in the photosensitive composition for EUV light is 5.0% by mass or less, Requirement 3: The content of the photoacid generator is 5% to 50% by mass with respect to the total solid content in the photosensitive composition for EUV light.

Resist composition and method of forming resist pattern

A resist composition including: a base material component (A), a compound (B1) represented by Formula (b1-1), and a fluorine additive component (F) which contains a fluororesin component (F1) having a constitutional unit (f1) represented by Formula (f-1) and a constitutional unit (f2) represented by Formula (f-2); in Formula (b1-1), V.sup.b01 represents a fluorinated alkylene group, R.sup.b02 represents a fluorine atom or a hydrogen atom, a total number of fluorine atoms as V.sup.b01 and R.sup.b02 is 2 or 3; in Formula (f-1), Rf.sup.1 represents a monovalent organic group having a fluorine atom; in Formula (f-2), Rf.sup.2 represents a group represented by Formula (f2-r-1), which is a group containing a polycyclic aliphatic cyclic group. ##STR00001##

Resist composition and method of forming resist pattern

A resist composition including: a base material component (A), a compound (B1) represented by Formula (b1-1), and a fluorine additive component (F) which contains a fluororesin component (F1) having a constitutional unit (f1) represented by Formula (f-1) and a constitutional unit (f2) represented by Formula (f-2); in Formula (b1-1), V.sup.b01 represents a fluorinated alkylene group, R.sup.b02 represents a fluorine atom or a hydrogen atom, a total number of fluorine atoms as V.sup.b01 and R.sup.b02 is 2 or 3; in Formula (f-1), Rf.sup.1 represents a monovalent organic group having a fluorine atom; in Formula (f-2), Rf.sup.2 represents a group represented by Formula (f2-r-1), which is a group containing a polycyclic aliphatic cyclic group. ##STR00001##

Photoresist composition and method of manufacturing a semiconductor device

A photoresist composition includes a photoactive compound and a polymer. The polymer has a polymer backbone including one or more groups selected from: ##STR00001##
The polymer backbone includes at least one group selected from B, C-1, or C-2, wherein ALG is an acid labile group, and X is linking group.

Photoresist composition and method of manufacturing a semiconductor device

A photoresist composition includes a photoactive compound and a polymer. The polymer has a polymer backbone including one or more groups selected from: ##STR00001##
The polymer backbone includes at least one group selected from B, C-1, or C-2, wherein ALG is an acid labile group, and X is linking group.

HUMIDITY CONTROL OR AQUEOUS TREATMENT FOR EUV METALLIC RESIST
20230012705 · 2023-01-19 ·

A method for forming a semiconductor device is provided. The method includes applying a photoresist composition over a substrate, thereby forming a photoresist layer over the substrate; performing a first baking process to the photoresist layer; exposing the photoresist layer to an extreme ultraviolet (EUV) radiation, thereby forming a pattern therein; performing a second baking process to the photoresist layer; and developing the photoresist layer having the pattern therein using a developer, thereby forming a patterned photoresist layer. The first baking process and the second baking process are conducted under an ambient atmosphere having a humidity level ranging from 55% to 100%.

AQUEOUS DEVELOPER FOR FLEXOGRAPHIC PRINTING PLATE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE
20230221647 · 2023-07-13 · ·

An object of the present invention is to provide an aqueous developer for a flexographic printing plate capable of maintaining good developability and suppressing aggregation of a dispersion in the developer diluted with water after repeated use, and a manufacturing method of a flexographic printing plate using the same. The aqueous developer for a flexographic printing plate according to the present invention is an aqueous developer for a flexographic printing plate, containing a nonionic surfactant represented by Formula (1), and water.


R.sup.1O—(AO).sub.n—H   (1)

Here, in Formula (1),

R.sup.1 represents a linear aliphatic hydrocarbon group having 9 to 30 carbon atoms,

A represents an alkylene group having 2 to 4 carbon atoms, and

n represents an integer of 7 or more, in which in a case where n is an integer of 2 or more, a plurality of A's may be the same or different from each other.

AQUEOUS DEVELOPER FOR FLEXOGRAPHIC PRINTING PLATE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE
20230221647 · 2023-07-13 · ·

An object of the present invention is to provide an aqueous developer for a flexographic printing plate capable of maintaining good developability and suppressing aggregation of a dispersion in the developer diluted with water after repeated use, and a manufacturing method of a flexographic printing plate using the same. The aqueous developer for a flexographic printing plate according to the present invention is an aqueous developer for a flexographic printing plate, containing a nonionic surfactant represented by Formula (1), and water.


R.sup.1O—(AO).sub.n—H   (1)

Here, in Formula (1),

R.sup.1 represents a linear aliphatic hydrocarbon group having 9 to 30 carbon atoms,

A represents an alkylene group having 2 to 4 carbon atoms, and

n represents an integer of 7 or more, in which in a case where n is an integer of 2 or more, a plurality of A's may be the same or different from each other.

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING RADICAL TRAPPING AGENT

Provided is a resist underlayer film-forming composition that is used in a lithographic process in semiconductor manufacturing and has excellent storage stability. The resist underlayer film-forming composition contains: a polymer having a disulfide bond in a main chain; a radical trapping agent; and a solvent. The radical trapping agent is preferably a compound having a ring structure or a thioether structure. The ring structure is preferably an aromatic ring structure having 6-40 carbon atoms or a 2,2,6,6-tetramethylpiperidine structure.

Photoresist composition, coated substrate including the photoresist composition, and method of forming electronic device

A photoresist composition, including an acid-sensitive polymer and photoacid generator compound having Formula (I): ##STR00001##
wherein, EWG, Y, R, and M.sup.+ are the same as described in the specification.