Patent classifications
G03F7/32
Photosensitive composition for EUV light, pattern forming method, and method for manufacturing electronic device
A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Requirements 1 to 3, Requirement 1: The A value determined by Formula (1) is 0.14 or more,
A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127) Formula(1) Requirement 2: The concentration of solid contents in the photosensitive composition for EUV light is 5.0% by mass or less, Requirement 3: The content of the photoacid generator is 5% to 50% by mass with respect to the total solid content in the photosensitive composition for EUV light.
Resist composition and method of forming resist pattern
A resist composition including: a base material component (A), a compound (B1) represented by Formula (b1-1), and a fluorine additive component (F) which contains a fluororesin component (F1) having a constitutional unit (f1) represented by Formula (f-1) and a constitutional unit (f2) represented by Formula (f-2); in Formula (b1-1), V.sup.b01 represents a fluorinated alkylene group, R.sup.b02 represents a fluorine atom or a hydrogen atom, a total number of fluorine atoms as V.sup.b01 and R.sup.b02 is 2 or 3; in Formula (f-1), Rf.sup.1 represents a monovalent organic group having a fluorine atom; in Formula (f-2), Rf.sup.2 represents a group represented by Formula (f2-r-1), which is a group containing a polycyclic aliphatic cyclic group. ##STR00001##
Resist composition and method of forming resist pattern
A resist composition including: a base material component (A), a compound (B1) represented by Formula (b1-1), and a fluorine additive component (F) which contains a fluororesin component (F1) having a constitutional unit (f1) represented by Formula (f-1) and a constitutional unit (f2) represented by Formula (f-2); in Formula (b1-1), V.sup.b01 represents a fluorinated alkylene group, R.sup.b02 represents a fluorine atom or a hydrogen atom, a total number of fluorine atoms as V.sup.b01 and R.sup.b02 is 2 or 3; in Formula (f-1), Rf.sup.1 represents a monovalent organic group having a fluorine atom; in Formula (f-2), Rf.sup.2 represents a group represented by Formula (f2-r-1), which is a group containing a polycyclic aliphatic cyclic group. ##STR00001##
Photoresist composition and method of manufacturing a semiconductor device
A photoresist composition includes a photoactive compound and a polymer. The polymer has a polymer backbone including one or more groups selected from: ##STR00001##
The polymer backbone includes at least one group selected from B, C-1, or C-2, wherein ALG is an acid labile group, and X is linking group.
Photoresist composition and method of manufacturing a semiconductor device
A photoresist composition includes a photoactive compound and a polymer. The polymer has a polymer backbone including one or more groups selected from: ##STR00001##
The polymer backbone includes at least one group selected from B, C-1, or C-2, wherein ALG is an acid labile group, and X is linking group.
HUMIDITY CONTROL OR AQUEOUS TREATMENT FOR EUV METALLIC RESIST
A method for forming a semiconductor device is provided. The method includes applying a photoresist composition over a substrate, thereby forming a photoresist layer over the substrate; performing a first baking process to the photoresist layer; exposing the photoresist layer to an extreme ultraviolet (EUV) radiation, thereby forming a pattern therein; performing a second baking process to the photoresist layer; and developing the photoresist layer having the pattern therein using a developer, thereby forming a patterned photoresist layer. The first baking process and the second baking process are conducted under an ambient atmosphere having a humidity level ranging from 55% to 100%.
AQUEOUS DEVELOPER FOR FLEXOGRAPHIC PRINTING PLATE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE
An object of the present invention is to provide an aqueous developer for a flexographic printing plate capable of maintaining good developability and suppressing aggregation of a dispersion in the developer diluted with water after repeated use, and a manufacturing method of a flexographic printing plate using the same. The aqueous developer for a flexographic printing plate according to the present invention is an aqueous developer for a flexographic printing plate, containing a nonionic surfactant represented by Formula (1), and water.
R.sup.1O—(AO).sub.n—H (1)
Here, in Formula (1),
R.sup.1 represents a linear aliphatic hydrocarbon group having 9 to 30 carbon atoms,
A represents an alkylene group having 2 to 4 carbon atoms, and
n represents an integer of 7 or more, in which in a case where n is an integer of 2 or more, a plurality of A's may be the same or different from each other.
AQUEOUS DEVELOPER FOR FLEXOGRAPHIC PRINTING PLATE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE
An object of the present invention is to provide an aqueous developer for a flexographic printing plate capable of maintaining good developability and suppressing aggregation of a dispersion in the developer diluted with water after repeated use, and a manufacturing method of a flexographic printing plate using the same. The aqueous developer for a flexographic printing plate according to the present invention is an aqueous developer for a flexographic printing plate, containing a nonionic surfactant represented by Formula (1), and water.
R.sup.1O—(AO).sub.n—H (1)
Here, in Formula (1),
R.sup.1 represents a linear aliphatic hydrocarbon group having 9 to 30 carbon atoms,
A represents an alkylene group having 2 to 4 carbon atoms, and
n represents an integer of 7 or more, in which in a case where n is an integer of 2 or more, a plurality of A's may be the same or different from each other.
RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING RADICAL TRAPPING AGENT
Provided is a resist underlayer film-forming composition that is used in a lithographic process in semiconductor manufacturing and has excellent storage stability. The resist underlayer film-forming composition contains: a polymer having a disulfide bond in a main chain; a radical trapping agent; and a solvent. The radical trapping agent is preferably a compound having a ring structure or a thioether structure. The ring structure is preferably an aromatic ring structure having 6-40 carbon atoms or a 2,2,6,6-tetramethylpiperidine structure.
Photoresist composition, coated substrate including the photoresist composition, and method of forming electronic device
A photoresist composition, including an acid-sensitive polymer and photoacid generator compound having Formula (I): ##STR00001##
wherein, EWG, Y, R, and M.sup.+ are the same as described in the specification.