An illumination optical unit for EUV projection lithography serves to illuminate an object field with illumination light. A transmission optical unit images field facets in a manner superposed on one another into the object field via illumination channels, which each have assigned to them one of the field facets and one pupil facet of a pupil facet mirror. The superposition optical unit has at least two mirrors for grazing incidence, downstream of the pupil facet mirror. The mirrors for grazing incidence produce an illumination angle bandwidth of an illumination light overall beam, composed of the illumination channels, in the object field. The bandwith is smaller for a plane of incidence parallel to the object displacement direction than for a plane perpendicular thereto. The result can be an illumination optical unit, by which a projection optical unit can be adapted to a configuration of an EUV light source for the illumination light.

A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

An illumination optical unit for projection lithography serves for illuminating an object field, in which an object to be imaged can be arranged, with illumination light. The illumination optical unit has a field facet mirror having a plurality of field facets. Furthermore, the illumination optical unit has a pupil facet mirror having a plurality of pupil facets. The field facets are imaged into the object field by a transfer optical unit. The illumination optical unit additionally has a deflection facet mirror having a plurality of deflection facets, which is arranged in the illumination beam path between the field facet mirror and the pupil facet mirror. This results in an illumination optical unit in which the illumination of the object to be imaged can be configured flexibly and can be adapted well to predefined values.

A method for generating an extreme ultraviolet (EUV) radiation includes simultaneously irradiating two or more target droplets with laser light in an EUV radiation source apparatus to produce EUV radiation and collecting and directing the EUV radiation produced from the two or more target droplet by an imaging mirror.

An illumination optical unit for microlithography illuminates an object field with illumination light. The unit includes a first facet mirror that has a plurality of first facets, and a second facet mirror that has a plurality of second facets. The unit has facet pairs which include respectively a facet of the first facet mirror and a facet of the second facet mirror which predefine a plurality of illumination channels for illuminating the object field. At least some of the illumination channels have in each case an assigned polarization element for predefining an individual polarization state of the illumination light guided in the respective illumination channel.

A system comprises a reflective optical element with a reflective surface that is configured to reflect a radiation beam. The reflective optical element also has a body. The system includes a thermal conditioning mechanism operative to thermally induce a deformation of the body under control of a controller. By means of controllably deforming the body, the shape of the reflective surface can be adjusted in a controlled manner.

The invention concerns a projection objective of a microlithographic projection exposure apparatus designed for EUV, for imaging an object plane illuminated in operation of the projection exposure apparatus into an image plane. The projection objective has at least one mirror segment arrangement comprising a plurality of separate mirror segments. Associated with the mirror segments of the same mirror segment arrangement are partial beam paths which are different from each other and which respectively provide for imaging of the object plane (OP) into the image plane (IP). The partial beam paths are superposed in the image plane (IP). At least two partial beams which are superposed in the same point in the image plane (IP) were reflected by different mirror segments of the same mirror segment arrangement.

The invention relates to an optical system of a microlithographic projection exposure apparatus, in particular for operation in the EUV, comprising a mirror arrangement composed of a plurality of mutually independently adjustable mirror elements, and at least one polarization-influencing arrangement arranged upstream of the mirror arrangement relative to the light propagation direction, wherein the polarization-influencing arrangement has a group of first reflection surfaces and a group of second reflection surfaces, wherein the first reflection surfaces are tiltable independently of one another, and wherein, during the operation of the optical system, light reflected at respectively one of the first reflection surfaces can be directed onto the mirror arrangement via respectively a different one of the second reflection surfaces depending on the tilting of the first reflection surface.

The invention relates to an optical system of a microlithographic projection exposure apparatus, in particular for operation in the EUV, comprising at least one polarization-influencing arrangement having a first reflection surface and a second reflection surface, wherein the first reflection surface and the second reflection surface are arranged at an angle of 0°±10° or at an angle of 90°±10° relative to one another, wherein light incident on the first reflection surface during the operation of the optical system forms an angle of 45°±5° with the first reflection surface, and wherein the polarization-influencing arrangement is rotatable about a rotation axis running parallel to the light propagation direction of light incident on the first reflection surface during the operation of the optical system.

A collector transfers EUV illumination light from a radiation source region to illumination optics. Imaging optics of the collector image the radiation source region in a downstream focal region. The imaging optics are embodied so that the radiation source is imaged with at least one first imaging scale by the EUV illumination light, which is emitted with beam angles <20° between the radiation source region and the downstream focal region. The imaging optics are also embodied so that the radiation source is imaged with at least one second imaging scale by the illumination light emitted with beam angles >70°. The two imaging scales for the beam angles <20° on the one hand and >70° on the other hand differ by no more than a factor of 2.5. In addition to a corresponding collector, an illumination system contains field facets transfer optics.