An electron beam irradiation apparatus which exposes a wafer coated with an electron beam resist with an electron beam is equipped with: a stage that can be moved holding the wafer; an electron beam optical system that irradiates the wafer with an electron beam; and, an opening member, placed facing the wafer via a predetermined gap on the wafer side in the optical arrangement direction of the electron beam optical system, and having an opening through which the electron beam from the electron beam optical system passes.

A system, computer program product and method for producing a three-dimensional overall structure by means of laser lithography, the overall structure being approximated by at least one partial structure, wherein, for the purposes of writing the partial structure, an exposure dose is radiated into the lithography material in a focal region of a laser writing beam while exploiting multi-photon absorption. Here, in the partial structure, the exposure dose in those edge portions that immediately adjoin an external surface of the overall structure to be produced is modified in comparison with the remaining partial structure.

There is provided a substrate processing apparatus including: a light radiator configured to radiate a light for processing into an irradiation area which is smaller than a processing target area of a surface of a substrate; a driver configured to move the irradiation area in two directions that cross each other in a plane along the surface of the substrate; and a controller configured to control the driver to move an irradiation position in two directions according to a movement pattern which has been set to radiate the light to an entire area of the processing target area.

In embodiments of a digital lithography system, physical design data prepared at a data prep server in a hierarchical data structure. A leaf node comprises a repeater nod, comprising a bitmap image and a plurality of locations at which the bitmap appears in a physical design. At an EYE server, a repeater node bitmap is adjusted based upon, for example, spatial light modulator rotational adjustment and substrate distortion. The adjusted repeater node and the plurality of locations in which the adjusted repeater appears is compared to the repeater of the data prep server and its plurality of locations. In further embodiments, a rasterizer generates a checksum of bitmap to be printed to a substrate, from the EYE server bitmap. The checksum is compared to a checksum of the EYE server bitmap.

A method of manufacture of objects including receiving a CAD file containing electrical circuit design data for direct writing on a surface, the CAD file including CAD data for a multiplicity of objects to be produced on the surface, automatically configuring a direct write machine to direct write direct writing data based on the CAD data on the surface in plural scans, each having a scan width less than a width of the surface, including arranging the direct writing data for the multiplicity of objects to be written in a side by side manner in each of the plural scans so as to be within the scan width, whereby stitching of direct writing data between adjacent scans is obviated and operating the direct write machine to create the multiplicity of objects on the surface.

Embodiments of the present disclosure generally relate to an image projection system. The image projection system includes an active matrix solid state emitter (SSE) device. The active matrix solid state emitter includes a substrate, a silicon layer, and a emitter substrate. The silicon layer is deposited over the substrate having a plurality of transistors formed therein. The emitter substrate is positioned between the silicon layer and the substrate. The emitter substrate comprises a plurality of emitter arrays. Each emitter array defines a pixel, wherein one pixel comprises one or more transistors from the plurality of transistors. Each transistor is configured to receive a variable amount of current.

Various aspects include vectorization approaches for model-based mask proximity correction (MPC). In some cases, a computer-implemented method includes: assigning a set of vectors to geometry data describing at least one mask for forming an integrated circuit (IC); adjusting a statistical predictive model of the at least one mask based upon the set of vectors and the geometry data; predicting an adjustment to the at least one mask with the statistical predictive model; and adjusting instructions for forming the at least one mask in response to a predicted mask result of the statistical predictive model deviating from a target mask result for the at least one mask.

A method for digital direct recording of an artwork representing electric connections of components on a substrate includes receiving data representing the artwork, analyzing the artwork representation to identify sections that are similar and sections that are unique and to identify locations of the components in the artwork, and dividing the artwork into modules corresponding to the identified sections, providing a set of unique modules and a set of redundant modules. The method also includes rasterizing each unique module to provide rasterized modules, dividing the rasterized modules into submodules, and receiving measurements representing positions of the components on the substrate. The method also includes receiving measurements representing the position of the substrate, calculating the differences between the measured positions of the components and the artwork positions of the components, calculating modifications for each of the sub modules to compensate for the differences, and recording the modified submodules onto the substrate to form a modified artwork on the substrate.

In embodiments of a digital lithography system, physical design data prepared at a data prep server in a hierarchical data structure. A leaf node comprises a repeater nod, comprising a bitmap image and a plurality of locations at which the bitmap appears in a physical design. At an EYE server, a repeater node bitmap is adjusted based upon, for example, spatial light modulator rotational adjustment and substrate distortion. The adjusted repeater node and the plurality of locations in which the adjusted repeater appears is compared to the repeater of the data prep server and its plurality of locations. In further embodiments, a rasterizer generates a checksum of bitmap to be printed to a substrate, from the EYE server bitmap. The checksum is compared to a checksum of the EYE server bitmap.

A method and an apparatus for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser. The method of the present application uses a parallel interpenetrating algorithm. Firstly, a multi-beam solid light spot for writing is generated based on a writing light spatial light modulator; a multi-beam hollow light spot for inhibition is generated based on an inhibition optical spatial light modulator; the multi-beam solid light spot is combined with the multi-beam hollow light spot to generate a modulated multi-beam light spot; a writing waveform is output based on a multichannel acousto-optic modulator, a displacement stage moves at a constant speed until writing of a whole column of areas is completed, an optical switch is turned off, and the displacement stage conducts one-time stepping movement; the process is not stopped until all patterns are written.