Disclosed is a thermo-mechanical actuator (100) comprising a piezo¬electric module (110), the piezo-electric module comprising at least one piezo-electric element (120), wherein the thermo-mechanical actuator is configured to: receive a thermal actuation signal (132) for controlling a thermal behaviour of the piezo-electric module, or provide a thermal sensing signal (132) representative of a thermal state of the piezo-electric module, and, wherein the thermo-mechanical actuator is configured to: receive a mechanical actuation (134) signal for controlling a mechanical behaviour of the piezo-electric module, or provide a mechanical sensing signal (134) representative of a mechanical state of the piezo-electric module.

A lithography system includes a radiation source and a photomask. The radiation source is configured to generate electromagnetic radiation traveling towards the photomask. The lithography system also includes an incident channel between the radiation source and the photomask for the electromagnetic radiation to travel through. There are a first injection nozzle configured to generate a first particle shield between the photomask and an exit port of the incident channel and a second injection nozzle configured to generate a second particle shield inside the incident channel.

A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.

A conveyance apparatus for conveying a substrate chuck is provided. The apparatus comprises a hand for supporting the substrate chuck, a main body for pivotally supporting the hand about a vertical axis and move in horizontal and vertical directions, and a guiding portion for guiding pivotal motion of the hand. The hand includes hand distal end portions and a hand proximal end portion supported by the main body, and an end surface of the hand proximal end portion facing the main body is formed in an arc shape of a circle centered about a vertical axis of a reference position between the hand distal end portions, and the guiding portion includes a guiding surface that has a shape corresponding to the end surface of the hand proximal end portion and can slidably contact the end surface.

Apparatus and methods of performing nanoimprint lithography using an anti-slip landing ring are provided. In one embodiment, a process chamber for nanoimprint lithography is provided and includes a substrate support and a ring disposed on the substrate support. The ring has a top surface opposite the substrate support, and the top surface has a grid pattern. A bottom surface facing the substrate support has a different pattern compared to the grid pattern.

Devices, systems, and methods (a) receive a predetermined fluid drop volume and an array of cells, wherein each cell in the array is associated with a respective predetermined fluid volume; (b) scan the array of cells according to a scanning sequence for a next unassigned cell and add the next unassigned cell to a respective fill set; (c) add unassigned cells neighboring the next unassigned cell to the respective fill set until an aggregate of the respective predetermined fluid volumes of the cells in the respective fill set equals or exceeds the predetermined fluid drop volume; (d) place a fluid drop in the drop pattern within an area associated with the respective fill set and mark all cells in the respective fill set as assigned; and (e) repeat (b)-(d) until all cells in the array of cells have been assigned and the drop pattern has been generated.

A method comprises loading a wafer onto a wafer chuck of a lithography apparatus, projecting an extreme ultraviolet light through an opening of a frame structure of the lithography apparatus, onto the wafer, and introducing an airflow from an air curtain module on the wafer chuck toward the frame structure, wherein the air curtain module surrounds the wafer. The airflow forms an air curtain around the wafer, and shields the wafer from contaminants from the frame structure or a wafer stage.

An object stage that includes a first structure and a second structure movable relative to the first structure. The second structure is configured to support an object. The object stage also includes a seal plate movably coupled to the first structure or the second structure, but not both. Further, the object stage includes an actuator configured to move the seal plate such that a substantially constant gap is defined between the seal plate and the first structure or second structure that is not coupled to the seal plate.

An illustrative device disclosed herein includes a plate and a reticle pod receiving structure on the front surface of the plate that at least partially bounds a reticle pod receiving area on the front surface. In this example, the back surface of the plate has a pin engagement structure that is adapted to engage a plurality of pins and a fluid flow channel that is adapted to allow fluid communication with an interior region of a reticle pod when the reticle pod is positioned in the reticle pod receiving area.

A support table for a lithographic apparatus, a method of loading a substrate, a lithographic apparatus and a method for manufacturing a device using a lithographic apparatus. In one arrangement, a support table is configured to support a substrate. The support table has a base surface. The base surface faces a surface of the substrate when the substrate is supported by the support table. One or more gas cushion members are provided above the base surface. Each of the gas cushion members includes a recess. The recess is shaped and configured such that a lowering of the substrate into a position on the support table at which the substrate is supported by the support table causes a localised build-up of pressure within the recess. The localized build-up of pressure provides a localised gas cushioning effect during the lowering of the substrate.