A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

A patterning device support (200), for example, a patterning device (202) or substrate support, can be configured to release internal stresses of a patterning device loaded thereon. The patterning device support can include a positive pressuring generating interface (206a, 206b) or an acoustic vibration generating interface (206a, 206b), or can be configured to oscillate while at least a portion of patterning device is decoupled from the patterning device support. A method of transferring a patterning device between a patterning device handling apparatus and a patterning device support configured to move the patterning device can include positioning the patterning device onto a surface of the patterning device support, and performing a process that releases internal stress of the patterning device.

A holding device includes a holding member having holes for evacuating air in a space between a substrate and the holding member and an annular seal member on a lower surface of a stepped portion of the holding member for defining the space. A first region is the area of a figure having the same center as that of a plane figure of a surface of the holding member and obtained by reducing the plane figure's size by ⅔ or more and ⅘ or less. A second region is between the first region and the seal member. The holes are formed to satisfy a relationship of (total hole area in second region/area of second region)>(total hole area in sum region of first and second regions/area of sum region of first and second regions) and communicate with a pipe at a position corresponding to the first region of the holding member.

The present invention provides a lithography apparatus that performs patterning on a substrate using an original, the apparatus including a supply device configured to supply a gas to a space between the substrate and the original, a chuck configured to hold the substrate, a movable device that holds the chuck and is movable, and a plate provided on the movable device and surrounding the chuck, wherein the chuck includes a first edge, on a side of the chuck facing the original, protruding toward the plate.

Cleaning equipment for an EUV wafer chuck or clamp, which removes particles that have accumulated between burls on the surface the wafer chuck. The equipment includes a spinning bi-polar electrode placed in proximity to the surface, which can attract and adsorb the charged particle residue therefrom using its generated symmetric electric field when the wafer chuck is not in use.

A tray for a panel exposure machine, and also such a machine, enabling a panel to be retained and pressed down so as to be presented facing an exposure device. The tray comprises a work surface (13) adapted to receive panels of different sizes, said work surface (13) being substantially plane and possessing first and second adjacent edges (13a, 13b) extending along substantially orthogonal first and second directions (X, Y) defining a reference corner (C); and first and second holder devices (30a, 30b) of a first type and at least a first holder device (40a) of a second type, each holder device being actuatable between a holding, first state in which it exerts pressure directed towards the work surface (13), thereby defining a holding position, and a rest, second state in which said pressure is released; a positioning device (14) arranged along at least a portion of the first edge (13a) and along at least a portion of the second edge (13b); the holder devices (30a, 30b) of the first type extend along at least a portion of the first and second edges (13a, 13b) respectively, their holding positions being fixed in a plane parallel to the work surface; the holder device (40a) of the second type is movable in a plane parallel to the work surface (13) in order to adapt its holding position as a function of the size of the panel in use.

A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.

A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.

There is provided a reticle chuck cleaner A for cleaning a reticle chuck of an apparatus, as a reticle chuck cleaner that allows easy cleaning of a reticle chuck in a vacuum chamber of an apparatus without exposing the chamber to the atmosphere and contributes to improvement of the operating ratio of the apparatus, including: an adhesive layer 1 to be adhered to a chuck region of the reticle chuck; a support layer 2 laminated on the adhesive layer 1; and a substrate 3 having a shape capable of being carried to the reticle chuck, the support layer 2 and the substrate 3 being partially bonded together in an adhesive region 41 of a partial adhesive layer 4.

A reticle shape regulation device includes: an adsorption device having an upper surface and a lower surface; and a limit mechanism having a limit surface. The adsorption device is movable relative to the limit mechanism at least in a vertical direction. The upper surface of the adsorption device faces toward and is engagable with the limit surface. The lower surface of the adsorption device defines a vacuum chamber that is configured for communication with a negative-pressure source so as to adsorb the reticle by a negative pressure. The lower surface of the adsorption device further defines at least one positive-pressure outlet that is in communication with a positive-pressure source and is configured to supply a continuous positive-pressure air flow between the lower surface of the adsorption device and the reticle during the adsorption of the reticle. The positive-pressure air flow is so controlled as to form an air cushion between the lower surface of the adsorption device and the reticle while allowing the adsorption of the reticle by the adsorption device. This can correct deformations of the reticle, thus enabling satisfactory flatness thereof during an exposure process, and can easily create vacuum and an air cushion between a deformed reticle and the adsorption device.