G03F7/70808

PRINT ELEMENT SUBSTRATE AND METHOD FOR MANUFACTURING PRINT ELEMENT SUBSTRATE
20230341762 · 2023-10-26 ·

A print element substrate including a substrate having an energy generating element that generates energy for ejecting liquid from an ejection port and a flow passage forming member including a flow passage that supplies the liquid to the ejection port, wherein the flow passage forming member includes a cavity not communicating with the flow passage, and a side surface of the cavity is formed substantially perpendicular to the substrate wherein a base film is formed between the cavity and the substrate. The refractive index of the flow passage forming member is lower than the refractive index of the base film, and the difference between the refractive index of the flow passage forming member and the refractive index of the base film is greater than or equal to 0.3.

Lift pin assembly and apparatus for treating substrate with the same
11829081 · 2023-11-28 · ·

A lift pin assembly is provided. The lift pin assembly includes a level bolt mounted on a first frame lifted by a lifting device, a lift pin having a weight provided at a lower end of the lift pin, and supported by the level bolt, and a pressing bracket to forcibly move down the lift pin, when the lift pin is locked into a pin hole. The pressing bracket is adjusted in height to be set while maintaining a specific gap to a top surface of the weight.

MODULE VESSEL WITH SCRUBBER GUTTERS SIZED TO PREVENT OVERFLOW

An extreme ultraviolet (EUV) source includes a module vessel and a scrubber system. The scrubber system may include a plurality of gutters in the module vessel. The plurality of gutters may include a first gutter and a second gutter. The second gutter may be lower than the first gutter in the module vessel. A unit volume of the second gutter is larger than a unit volume of the first gutter.

Lithography system and method thereof

A method includes transferring a wafer over a wafer stage on a wafer table. The wafer table includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket and a second bracket, and a stopper. The second sliding member is movable along a first direction, in which the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction. The first bracket and the second bracket are connected by a leaf spring. The method includes moving the wafer stage toward the edge of the table body, such that the wafer stage pushes the first cable outwardly, such that the leaf spring is moved toward a first protective film on a surface of the stopper facing the leaf spring.

LITHOGRAPHIC APPARATUS AND METHOD WITH IMPROVED CONTAMINANT PARTICLE CAPTURE

A lithographic apparatus including a substrate stage for supporting a structure in a compartment, the compartment having a compartment surface facing a top surface of the substrate in at least one operational configuration; and a soft coating on the compartment surface for capturing particles. A heat shield or component thereof for a lithographic apparatus, the heat shield or component thereof including a soft coating on at least one surface for capturing particles and a lithographic apparatus including such a heat shield.

EUV chamber apparatus, extreme ultraviolet light generation system, and electronic device manufacturing method

An EUV chamber apparatus includes: a chamber; a target generation unit configured to output a target toward a predetermined region inside the chamber; a gas nozzle through which gas is supplied into the chamber; and a shroud including a first flow path through which a first cooling medium circulates and surrounding at least part of the trajectory of the target inside the chamber.

Lithographic apparatus and device manufacturing method involving a heater

A lithographic apparatus is described having a liquid supply system configured to at least partly fill a space between a projection system of the lithographic apparatus and a substrate with liquid, a barrier member arranged to substantially contain the liquid within the space, and a heater.

Gas distribution plate with UV blocker at the center

Apparatus for processing substrates can include a gas distribution plate that includes an upper plate and a lower plate and a solid disk between the upper plate and the lower plate. Each of the upper plate and the lower plate has a central region and an outer region surrounding the central region, the central region being solid and the outer region having a plurality of through holes. The upper plate and the lower plate are coaxially aligned along a central axis extending through a center of the central region of the upper plate and a center of the central region of the lower plate. The solid disk is coaxially aligned with the upper plate and the lower plate. The solid disk is configured to block transmission of ultraviolet radiation through the solid disk.

MODULE VESSEL WITH SCRUBBER GUTTERS SIZED TO PREVENT OVERFLOW

An extreme ultraviolet (EUV) source includes a module vessel and a scrubber system. The scrubber system may include a plurality of gutters in the module vessel. The plurality of gutters may include a first gutter and a second gutter. The second gutter may be lower than the first gutter in the module vessel. A unit volume of the second gutter is larger than a unit volume of the first gutter.

INTERMEDIATE LAYER FOR MECHANICAL INTERFACE

An apparatus includes a first substrate, a second substrate, and an intermediate layer disposed between the first and second substrates. The intermediate layer is configured to be a first point of failure or breakage of the apparatus under an applied force. The apparatus can further include a bonding layer disposed between the first and second substrates. The bonding layer is configured to bond the intermediate layer to the first and second substrates. The apparatus can further include a fastener coupled to the first and second substrates. The fastener is configured to secure the intermediate layer to the first and second substrates. The intermediate layer can include a coating applied to the first substrate or the second substrate. The apparatus can further include a second intermediate layer disposed between the first substrate and the fastener or the second substrate and the fastener.