A carrying device and, a fixing method of a carrying device are provided. The carrying device includes a body and an electromagnet fixing module disposed on the body; wherein the electromagnet fixing module is configured to fix the carrying device. The present application uses the electromagnet fixing module to fix the carrying device, which can avoid downtime of an exposure machine caused by shaking of the carrying device when a robot arm of the exposure machine picks or places the mask form the carrying device so as to improve throughput.

A lithography system and a cleaning method thereof are provided. The lithography system includes a light source generator. The light source generator includes a collector, a droplet generator and a droplet catcher. The droplet generator and the droplet catcher are facing each other, and disposed at a region surrounding the collector. The cleaning method includes: shifting the droplet generator out of the light source generator via a port of the light source generator; inserting a shove assembly into the light source generator via the port; using a borescope attached to the shovel assembly to identify a location of a deposit formed by droplets generated by the droplet generator; using the shovel assembly to remove and collect the deposit; and withdrawing the shovel assembly along with the borescope from the light source generator via the port.

An exposure device has a cylindrical peripheral wall member. The peripheral wall member forms a processing space in which a substrate is storable and has an upper opening and a lower opening. Further, a light emitter is provided in an upper portion of the peripheral wall member to close the upper opening. A lower lid member that is provided to be movable in an up-and-down direction and configured to be capable of closing and opening the lower opening is provided below the peripheral wall member. The atmosphere in the processing space is replaced with an inert gas with the substrate stored in the processing space and the lower opening closed by the lower lid member. In this state, vacuum ultraviolet rays are emitted to the substrate from the light emitter, and the substrate is exposed.

A lift pin assembly is provided. The lift pin assembly includes a level bolt mounted on a first frame lifted by a lifting device, a lift pin having a weight provided at a lower end of the lift pin, and supported by the level bolt, and a pressing bracket to forcibly move down the lift pin, when the lift pin is locked into a pin hole. The pressing bracket is adjusted in height to be set while maintaining a specific gap to a top surface of the weight.

The invention relates a method for manufacturing a damper device including a first part and a second part, said method comprising the following steps: a) providing a damping material in a space in between the first part and the second part, such that the damping material is in a compressed state in the space; and b) heating the device to a predetermined temperature in order to adhere the damping material to the first part and the second part.

Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

A lithographic apparatus or frame assembly, comprising: a first and second pneumatic support, being arranged to control position of a frame, each of said pneumatic supports accommodating a pressure chamber; a frame position control system, comprising; a first position sensor device, configured to generate measurement data relating to the position of the frame; a first pressure controller, configured to control the pressure in the pressure chamber of the first pneumatic support on the basis of the measurement data generated by the first position sensor device; a pressure differential sensor device, configured to generate data relating to the difference between the pressure in the pressure chambers of the first and the second pneumatic support; a second pressure controller, configured to control the pressure in the pressure chamber of the second pneumatic support on the basis of the measurement data from the pressure differential sensor device.

A method includes transferring a wafer over a wafer stage on a wafer table. The wafer table includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket and a second bracket, and a stopper. The second sliding member is movable along a first direction, in which the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction. The first bracket and the second bracket are connected by a leaf spring. The method includes moving the wafer stage toward the edge of the table body, such that the wafer stage pushes the first cable outwardly, such that the leaf spring is moved toward a first protective film on a surface of the stopper facing the leaf spring.

An apparatus is provided configured to manufacture an article using a multi-layer/laminated photoresist comprising a plurality of layers of photoresist material, where at least a first layer of photoresist material has a first sensitivity to radiation, and at least a second layer of photoresist material has a different sensitivity to radiation. The apparatus comprises: a. a housing configured to receive the photoresist and locate the photoresist in at least one operational position in the housing; b. an exposure system configured to emit radiation which is incident on the photoresist when in the operational position; wherein: i. the exposure system is configured to emit radiation having a first radiation characteristic to induce a change in one or more properties of the area(s) of the first layer of photoresist material exposed to the radiation; and wherein ii. the first radiation characteristic is configured not to induce a change, or to induce a different change, in one or more properties of at least a different one of the layers of photoresist material. Consequently complex articles can be manufactured including hidden or partially visible features, such as overhangs for example.

A fluid handling structure configured to confine immersion fluid to a region of a lithographic apparatus, the fluid handling structure having an aperture formed therein for the passage therethrough of a radiation beam through the immersion fluid, the aperture defining an immersion space to be filled with the immersion fluid, and having an inner part and an outer part, wherein the inner part and the outer part are arranged so as to form therebetween a variable space and a connecting space that connects the variable space to the immersion space, wherein the outer part is movable relative to the inner part in a first plane so as to change in shape the variable space but not the connecting space, and wherein the fluid handling structure is configured to contain the immersion fluid in the variable space.