A temperature control apparatus is located at an interface between a coating and developing machine and a lithography machine, and includes a temperature detecting device and a temperature control device. The temperature detecting device is connected to the temperature control device. The temperature detecting device is configured to detect an actual temperature at the interface in real time. The temperature control device is configured to control the actual temperature at the interface to reach a target temperature when the actual temperature is not equal to the target temperature.

Particulate deposition rate on a photolithographic mask, particularly of tin (Sn) particles produced within an EUV light source, is reduced by producing turbulence within a radiation source chamber of the EUV light source. Turbulence can be produced by changing the temperature, pressure, and/or gas flow rate within the radiation source chamber. The turbulence reduces the number of particles exiting the EUV light source which could be deposited on the photomask.

A residual gas analyser (40) for analysis of a residual gas (30), in particular a residual gas in an EUV lithography system (1), includes an inlet system (41) for admission of the residual gas from a vacuum environment (27a) into the residual gas analyser, and a mass analyser (43) having a detector (44) for detecting ionized constituents (30a) of the residual gas. The residual gas analyser includes an ion transfer device (42) for transferring the ionized constituents of the residual gas to the mass analyser, the ion transfer device having an ion filtering device (45) configured for filtering at least one ionic constituent (30a) of the residual gas. Also disclosed is an EUV lithography system, in particular an EUV lithography apparatus, which includes at least one residual gas analyser configured as indicated above for analysing a residual gas in a vacuum environment of the EUV lithography system.

A lithographic apparatus with a cover plate formed separately from a substrate table and means for stabilizing a temperature of the substrate table by controlling the temperature of the cover plate is disclosed. A lithographic apparatus with thermal insulation provided between a cover plate and a substrate table so that the cover plate acts as a thermal shield for the substrate table is disclosed. A lithographic apparatus comprising means to determine a substrate table distortion and improve position control of a substrate by reference to the substrate table distortion is disclosed.

The present disclosure provides an exhaust system for discharging from semiconductor manufacturing equipment a hazardous gas. The exhaust system includes: a main exhaust pipe having a top surface and a bottom surface; a first branch pipe including an upstream end coupled to a source of a gas mixture containing the hazardous gas and a downstream end connected to the main exhaust pipe through the top surface; a second branch pipe including a downstream end connected to the main exhaust pipe through the bottom surface; and a detector configured to detect presence of the hazardous gas in the second branch pipe.

Disclosed is a degassing apparatus. The degassing apparatus includes a dissolved gas extracting nozzle that extracts dissolved gases in a form of bubbles from a treatment solution including the dissolved gases, a first tank that separates the bubbles extracted while passing through the dissolved gas extracting nozzle from the treatment solution, and a second tank having a stabilization space, in which the treatment solution, from which the bubbles have been separated, is stored from the first tank and is stabilized. The dissolved gas extracting nozzle is configured such that a diameter of an outlet is smaller than a diameter of an intermediate passage such that the dissolved gases in the treatment solution are extracted in the form of the bubbles through a cavitation phenomenon.

A light source apparatus configured to emit light includes a condenser unit configured to reflect light from a light source and to condense the light on a condensing point, a light shielding unit disposed on an optical path of the light from the condenser unit, and a reflector unit disposed between the condenser unit and the light shielding unit and configured to reflect the light from the condenser unit. The reflector unit is disposed so that reflected light is condensed by the condenser unit toward the condensing point.

A linear motor with high heat recovery efficiency that inhibits the rise in surface temperature is offered. The linear motor is disposed in a surrounding member (142) and facing a flow passage (142a) of a liquid for regulating temperature, and is provided with a coil unit (141) having at least a part thereof in contact with the liquid. The coil unit (141) is provided with a coil body (144), a mold layer (143) that covers the coil body and holds it in specific form, and a liquid protection layer (150) that covers the mold layer (143) and has liquid protection properties.

An exposure apparatus can mitigate the impact of fluctuations in the refractive index of ambient gas, and improve, for example, stage positioning accuracy. An exposure apparatus radiates an exposure illumination light to a wafer on a wafer stage through a projection optical system, and forms a prescribed pattern on the wafer, and comprises: a scale, which is provided to the wafer stage; a plurality of X heads, which detect information related to the position of the scale; a measurement frame that integrally supports the plurality of X heads and has a coefficient of linear thermal expansion that is smaller than that of the main body of the wafer stage (portions excepting a plate wherein the scale is formed); and a control apparatus that derives information related to the displacement of the wafer stage based on the detection results of the plurality of X heads.

A component for a lithography tool, the component including a member having a primary surface; a conduit defined within the member and configured to receive a fluid under pressure; a compressible region within the member and located between the conduit and the primary surface; and a deformable region between the compressible region and the conduit, wherein the compressible region and the deformable region are configured to accommodate local deformation of the member resulting from the pressure of the fluid.