A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance tool including a first track and at least one maintenance crane on the first track, a rectangular zone overlapping with the load port, a plurality of first sensors on the first track and at corners of the rectangular zone configured to detect a location of the maintenance crane and generate a first location date, a transporting tool including a second track and a OHT vehicle on the second track, at least a second sensor on the OHT vehicle and configured to generate a second location data, at least a third sensor on the load port, and a control unit configured to receive the first location data and the second location data, and send signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

A supporting member on which a wafer table is mounted is substantially kinematically supported, via six rod members placed on a slider. Further, coupling members are placed facing in a non-contact manner via a predetermined gap, thin plate-shaped edges provided at both ends in the Y-axis direction of the supporting member. By this arrangement, vibration-damping is performed by the coupling members (squeeze dampers) facing the edges, on vibration of the supporting member mounted on the wafer table. Further, because the supporting member is kinematically supported via the plurality of rod members, it becomes possible to reduce deformation of the wafer table that accompanies deformation of the slider.

A lithographic apparatus comprising a substrate storage module having a controllable environment for protecting lithographically exposed substrates from ambient air. The substrate storage module is configured to store at least twenty substrates and the substrate storage module is an integral part of the lithographic apparatus. The substrate storage module may be used to protect substrates from ambient air during stitched lithographic exposures.

The present invention provides an exposure apparatus for exposing a substrate, including: an optical system including a barrel and an optical element arranged in the barrel; and an adjustment unit including a heat radiator and configured to adjust imaging characteristics of the optical system by applying heat to the optical element from the heat radiator, wherein the heat radiator is a member including a first end portion and a second end portion on a side opposite to the first end portion and having a variation in physical properties falling within a predetermined range, a central portion between the first end portion and the second end portion of the heat radiator is arranged inside the barrel, and the first end portion and the second end portion of the heat radiator are arranged outside the barrel.

A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.

The present invention relates to a lithographic apparatus, comprising: a primary frame (10) which is provided with a functional unit (11, 12, 14), a secondary frame (20), a primary frame support (30), which is adapted to support the primary frame onto the secondary frame, a flexible utility connection (40), adapted to connect the functional unit to an auxiliary system (51, 52, 53), a vibration isolation body (60) having a body mass, which is moveably connected to the secondary frame by a flexible passive body support (61) having a body support stiffness, wherein the flexible utility connection is fixed to the vibration isolation body at a distance from the primary frame.

A coating and developing apparatus includes: a processing block having a plurality of substrate transport areas vertically stacked and partitioned from each other; a processing module provided in each of the plurality of substrate transport areas; a transport mechanism configured to transport a substrate between the transport block and the processing module; a temperature adjustment module configured to adjust a temperature of the substrate before the substrate is transported to at least one processing module among the plurality of the processing modules; a temperature sensor configured to detect an atmospheric temperature of at least one substrate transport area; and a temperature controller configured to change the temperature of the substrate in the temperature adjustment module based on the atmospheric temperature detected by the temperature sensor.

Disclosed is a stage system and metrology apparatus comprising at least one such stage system. The stage system comprises a stage carrier for holding an object and a stage carrier positioning actuator for displacing the stage carrier. The stage system also comprises a balance mass to counteract a displacement of the stage carrier, and a balance mass positioning actuator for displacing the balance mass. A cable arrangement is connected to the stage carrier for the supply of at least power to said stage carrier. The stage system is operable to apply a compensatory feed-forward force to the balance mass which compensates for a cable arrangement force exerted by the cable arrangement.

A supporting member on which a wafer table is mounted is substantially kinematically supported, via six rod members placed on a slider. Further, coupling members are placed facing in a non-contact manner via a predetermined gap, thin plate-shaped edges provided at both ends in the Y-axis direction of the supporting member. By this arrangement, vibration-damping is performed by the coupling members (squeeze dampers) facing the edges, on vibration of the supporting member mounted on the wafer table. Further, because the supporting member is kinematically supported via the plurality of rod members, it becomes possible to reduce deformation of the wafer table that accompanies deformation of the slider.

A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of many marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.