Patent classifications
G03F9/7023
MEASUREMENT APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD
A measurement apparatus that measures position information of a measurement target is provided. The apparatus includes a scope configured to generate an image by capturing an image of the measurement target, and a processor configured to obtain position information of the measurement target based on the image. The processor is configured to generate a plurality of image components using a statistical technique from a plurality of images generated by the scope, output the plurality of generated image components, perform processing based on the plurality of image components, and determine the position information based on a result of the processing.
METHOD OF WAFER ALIGNMENT USING AT RESOLUTION METROLOGY ON PRODUCT FEATURES
A method of determining a position of a product feature on a substrate, the method includes: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are referenced to either a positioning system used in displacing the substrate in between measurements or a plane parallel to the surface of the substrate; and determining a distortion component of the substrate based on the position measurements.
Imprint apparatus and method of manufacturing article
The present invention provides an imprint apparatus comprising a deforming unit configured to deform a pattern surface by applying a force to a mold, a measuring unit configured to measure a deformation amount of the pattern surface, a control unit configured to control the measuring unit to measure the deformation amount in each of a plurality of states in which a plurality of the forces are applied to the mold, a calculation unit configured to calculate a rate of change in the deformation amount as a function of a change in the force applied to the mold, and a calibration unit configured to calibrate a control profile describing a time in the imprint process, and the force applied to the mold, based on the rate of change in the deformation amount.
Position measurement apparatus, overlay inspection apparatus, position measurement method, imprint apparatus, and article manufacturing method
Provided is a position measurement apparatus in which a measurement error in a target is reduced. A position measurement apparatus measuring a position of a target includes an illumination unit configured to illuminate the target with illumination light including light of a first wavelength and light of a second wavelength different from the first wavelength, a measurement unit configured to measure the position of the target by detecting light from the target illuminated with the illumination light, and a control unit configured to adjust a ratio of a light intensity of the first wavelength to a light intensity of the second wavelength such that a measurement error varying depending on the position of the target in the measurement unit is reduced.
TAG COORDINATE DETERMINATION METHOD AND APPARATUS, COMPUTER-READABLE MEDIUM AND ELECTRONIC DEVICE
A tag coordinate determination method includes: generating a tag unit for placing a detection tag; setting the detection tag and the tag unit in an image of a photomask, and obtaining a tag position file of the image, the tag position file including position coordinates of the tag unit in the image; and acquiring position coordinates of a tag to be processed in the image according to the tag position file. The tag coordinate determination method can overcome to a certain extent the problem of manually capturing the coordinates being prone to errors, thereby improving accuracy of coordinate determination.
APPARATUS FOR PROCESSING A SUBSTRATE, SYSTEM FOR PROCESSING A SUBSTRATE, AND METHODS THEREFOR
An apparatus for processing a substrate in a vacuum chamber is described. The apparatus includes a first carrier transport system for transporting a first carrier along a first transport path in a first direction and a second carrier transport system for transporting a second carrier along a second transport path in the first direction. Further, the apparatus includes a measurement system for measuring a distance between the first carrier and the second carrier. The distance is perpendicular to the first direction.
Lithographic patterning device multichannel position and level gauge
A patterning device alignment system including a multipath sensory array including a first collimating light path and one or more other light paths, a first detector positioned at a first end of the first collimating light path, and a second detector positioned at a first end of the one or more other light paths, the first detector configured to receive a reflected illumination beam from an illuminated patterning device and calculate a tilt parameter of the patterning device, and the second detector configured to receive a second reflected illumination beam from a beam splitter and calculate an X-Y planar location position and a rotation position of the patterning device.
METHOD AND DEVICE FOR DETERMINING AN ALIGNMENT OF A PHOTOMASK ON A SAMPLE STAGE WHICH IS DISPLACEABLE ALONG AT LEAST ONE AXIS AND ROTATABLE ABOUT AT LEAST ONE AXIS
The present invention relates to a method for determining an alignment of a photomask on a sample stage which is displaceable along at least one axis that is parallel to a chuck surface of the sample stage, and is rotatable about at least one axis that is perpendicular to the chuck surface, which method comprises the following step:
rotating the sample stage by a predefined angle and measuring a height change of the photomask during rotation at a predetermined, non-vanishing distance with respect to the rotation axis for the purpose of determining the alignment of the photomask on the sample stage.
System and method for optimizing a lithography exposure process
A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.
LITHOGRAPHIC PATTERNING DEVICE MULTICHANNEL POSITION AND LEVEL GAUGE
A patterning device alignment system including a multipath sensory array including a first collimating light path and one or more other light paths, a first detector positioned at a first end of the first collimating light path, and a second detector positioned at a first end of the one or more other light paths, the first detector configured to receive a reflected illumination beam from an illuminated patterning device and calculate a tilt parameter of the patterning device, and the second detector configured to receive a second reflected illumination beam from a beam splitter and calculate an X-Y planar location position and a rotation position of the patterning device.